scholarly journals Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Polymers ◽  
2021 ◽  
Vol 13 (16) ◽  
pp. 2797 ◽  
Author(s):  
Hongli Zhang ◽  
Tiezhu Shi ◽  
Aijie Ma
Keyword(s):  
Thermal Management ◽  
High Performance ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Heat ◽  
Consumer Electronics ◽  
Recent Advances ◽  
Processing Strategies ◽  
Innovative Material ◽  
Processing Properties

The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

scholarly journals Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices

Micromachines ◽  
2019 ◽  
Vol 10 (2) ◽  
pp. 89 ◽  
Author(s):  
Zhibin Yan ◽  
Mingliang Jin ◽  
Zhengguang Li ◽  
Guofu Zhou ◽  
Lingling Shui
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux ◽  
Electrowetting On Dielectric ◽  
Handling Methods ◽  
Cooling Methods

Advanced thermal management methods have been the key issues for the rapid development of the electronic industry following Moore’s law. Droplet-based microfluidic cooling technologies are considered as promising solutions to conquer the major challenges of high heat flux removal and nonuniform temperature distribution in confined spaces for high performance electronic devices. In this paper, we review the state-of-the-art droplet-based microfluidic cooling methods in the literature, including the basic theory of electrocapillarity, cooling applications of continuous electrowetting (CEW), electrowetting (EW) and electrowetting-on-dielectric (EWOD), and jumping droplet microfluidic liquid handling methods. The droplet-based microfluidic cooling methods have shown an attractive capability of microscale liquid manipulation and a relatively high heat flux removal for hot spots. Recommendations are made for further research to develop advanced liquid coolant materials and the optimization of system operation parameters.

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

Site-Specific and On-Demand High Heat-Flux Cooling Using Superlattice Based Thin-Film Thermoelectrics

2009 ◽  
Author(s):  
Ihtesham Chowdhury ◽  
Ravi Prasher ◽  
Kelly Lofgreen ◽  
Sridhar Narasimhan ◽  
Ravi Mahajan ◽  
...  
Keyword(s):  
Thin Film ◽  
Heat Flux ◽  
Thermal Management ◽  
High Performance ◽  
High Heat ◽  
Thermoelectric Device ◽  
High Heat Flux ◽  
General Will ◽  
Site Specific ◽  
Fully Integrated

We have recently reported the first ever demonstration of active cooling of hot-spots of >1 kW/cm2 in a packaged electronic chip using thin-film superlattice thermoelectric cooler (TEC) cooling technology [1]. In this paper, we provide a detailed account of both experimental and theoretical aspects of this technological demonstration and progress. We have achieved cooling of as much as 15°C at a location on the chip where the heat-flux is as high as ∼1300 W/cm2, with the help of a thin-film TEC integrated into the package. To our knowledge, this is the first demonstration of high heat-flux cooling with a thin-film thermoelectric device made from superlattices when it is fully integrated into a usable electronic package. Our results, which validate the concept of site-specific micro-scale cooling of electronics in general, will have significant potential for thermal management of future generations of microprocessors. Similar active thermal management could also be relevant for high-performance solid-state lasers and power electronic chips.

Thermal Issues in Next Generation Integrated Circuits

2003 ◽  
Author(s):  
Siva Gurrum ◽  
Shivesh Suman ◽  
Yogendra Joshi ◽  
Andrei Fedorov
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Power Dissipation ◽  
High Performance ◽  
Electronic Devices ◽  
Heat Removal ◽  
Current Generation ◽  
Fundamental Limits ◽  
Convection Boundary ◽  
And Performance

Effective cooling of electronic chips is crucial for reliability and performance of electronic devices. Steadily increasing power dissipation in both devices and interconnects motivate the investigation of chip-centric thermal management as opposed to traditional package-centric solutions. In this work, we explore the fundamental limits for heat removal from a model chip for various configurations. Temperature rise when the chip is embedded in an infinite solid is computed for different thermal conductivities of the medium to pin down the best that can be achieved with conduction based thermal management. Next, a chip attached to a spreader plate with convection boundary condition on top was considered. A brief review of interface thermal resistances and partitioning of overall thermal resistance is presented for current generation microprocessors. Based upon the analysis it is concluded that far-term cooling solutions might necessitate integration with chip/interconnect-stack to meet the challenges. In addition, this would require concurrent thermal and electrical design/fabrication of future high-performance microprocessors.

Nanofluid as a coolant for next generation high heat dissipation electronic devices

2017 ◽  
Vol 8 (3/4) ◽  
pp. 410
Author(s):  
Abdul Razak Kaladgi ◽  
Balal Hassan ◽  
Isquander Yunus ◽  
Mohammed Sami Dafedar ◽  
Amjad Khan ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Electronic Devices ◽  
High Heat ◽  
Next Generation

Nano Electronics: A New Era of Devices

2014 ◽  
Vol 222 ◽  
pp. 99-116 ◽  
Author(s):  
Inderpreet Kaur ◽  
Shriniwas Yadav ◽  
Sukhbir Singh ◽  
Vanish Kumar ◽  
Shweta Arora ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Electronic Properties ◽  
Communication Systems ◽  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Device Fabrication ◽  
Consumer Electronics ◽  
Capacitive Coupling ◽  
Circuit Components

The technical and economic growth of the twentieth century was marked by evolution of electronic devices and gadgets. The day-to-day lifestyle has been significantly affected by the advancement in communication systems, information systems and consumer electronics. The lifeline of progress has been the invention of the transistor and its dynamic up-gradation. Discovery of fabricating Integrated Circuits (IC’s) revolutionized the concept of electronic circuits. With advent of time the size of components decreased, which led to increase in component density. This trend of decreasing device size and denser integrated circuits is being limited by the current lithography techniques. Non-uniformity of doping, quantum mechanical tunneling of electrons from source to drain and leakage of electrons through gate oxide limit scaling down of devices. Heat dissipation and capacitive coupling between circuit components becomes significant with decreasing size of the components. Along with the intrinsic technical limitations, downscaling of devices to nanometer sizes leads to a change in the physical mechanisms controlling the charge propagation. To deal with this constraint, the search is on to look around for alternative materials for electronic device application and new methods for electronic device fabrication. Such material is comprised of organic molecules, proteins, carbon materials, DNA and the list is endless which can be grown in the laboratory. Many molecules show interesting electronic properties, which make them probable candidates for electronic device applications. The challenge is to interpret their electronic properties at nanoscale so as to exploit them for use in new generation electronic devices. Need to trim downsize and have a higher component density have ushered us into an era of nanoelectronics.

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Yueguang Deng ◽  
Jing Liu
Keyword(s):  
Heat Flux ◽  
Liquid Metal ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Water Cooling ◽  
Cooling Device ◽  
Liquid Metal Cooling

Broad societal needs have focused attention on technologies that can effectively dissipate huge amount of heat from high power density electronic devices. Liquid metal cooling, which has been proposed in recent years, is fast emerging as a novel and promising solution to meet the requirements of high heat flux optoelectronic devices. In this paper, a design and implementation of a practical liquid metal cooling device for heat dissipation of high performance CPUs was demonstrated. GaInSn alloy with the melting point around 10°C was adopted as the coolant and a tower structure was implemented so that the lowest coolant amount was used. In order to better understand the design procedure and cooling capability, several crucial design principles and related fundamental theories were demonstrated and discussed. In the experimental study, two typical prototypes have been fabricated to evaluate the cooling performance of this liquid metal cooling device. The compared results with typical water cooling and commercially available heat pipes show that the present device could achieve excellent cooling capability. The thermal resistance could be as low as 0.13°C/W, which is competitive with most of the latest advanced CPU cooling devices in the market. Although the cost (about 70 dollars) is still relatively high, it could be significantly reduced to less than 30 dollars with the optimization of flow channel. Considering its advantages of low thermal resistance, capability to cope with extremely high heat flux, stability, durability, and energy saving characteristic when compared with heat pipe and water cooling, this liquid metal cooling device is quite practical for future application.

Integrated Eco-Thermal Management for Aerospace

2005 ◽  
Author(s):  
Lev Reznikov
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
High Performance ◽  
Waste Heat ◽  
Space Station ◽  
Nucleate Boiling ◽  
High Heat ◽  
Novel Technologies ◽  
Related Substances ◽  
Nucleation Sites

Thermal Management System developed for aerospace carriers (missile, aircraft, space station), bounds processes of generation and dissipation, transfer and conversion of power, refrigeration, and of bio-metabolism related substances. Local ecosystem of the carrier combines technological and biological subsystems, interacting with internal and outer spaces. The conceptual IETM System performs recovery of waste thermal energy, generation of “free” refrigeration, and recovery of byproducts into safe coolants (ammonia - water). Thermal Management solutions include novel technologies of intensification of the heat transfer and of conversion of the waste resources into refrigeration for extension of cooling capabilities for high heat radars, lasers and microwave generators. The IETM includes Vacuum-Evaporative Refrigeration (VER) utilizing “free natural” vacuum and waste heat-activated refrigeration circuits. VER generates ~1000 Btu of “free” cold per pound of wastewater or ammonia. The introduced high performance microstructure of compound electrohydrodynamic (EHD) boundary microsystems intensifies nucleate boiling, preventing dryout. The coils of the microwires adjoin to the boiling surface and form precision microstructure of heat sink with microchannels between the coils and the surface. The microcavities form the active bubbling nucleation sites along the spiral zones of contacts of the microwires and basic surfaces. The fins-microelectrodes develop additional heat transfer surface and evenly distributed spiral zones of the nucleation sites. Like fibers of a fine wick, the electric forces in EHD capillary structures of the microelectrodes retain the liquid and push out generated vapor bubbles from the surface. Good manufacturability and performance of novel MEMS are based on well-developed materials and common winding technology “borrowed” from electrotechnical industry. Conversion of waste resources into refrigeration and EHD activation of boiling allow meeting strong limitations in weight, reliability and consumption of energy. These conceptual approaches provide diversities in refrigeration capabilities for IETM.

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