scholarly journals A CMOS Optoelectronic Receiver IC with an On-Chip Avalanche Photodiode for Home-Monitoring LiDAR Sensors

Sensors ◽  
2021 ◽  
Vol 21 (13) ◽  
pp. 4364
Author(s):  
Ji-Eun Joo ◽  
Myung-Jae Lee ◽  
Sung Min Park

This paper presents an optoelectronic receiver (Rx) IC with an on-chip avalanche photodiode (APD) realized in a 0.18-mm CMOS process for the applications of home-monitoring light detection and ranging (LiDAR) sensors, where the on-chip CMOS P+/N-well APD was implemented to avoid the unwanted signal distortion from bondwires and electro-static discharge (ESD) protection diodes. Various circuit techniques are exploited in this work, such as the feedforward transimpedance amplifier for high gain, and a limiting amplifier with negative impedance compensation for wide bandwidth. Measured results demonstrate 93.4-dBW transimpedance gain, 790-MHz bandwidth, 12-pA/√Hz noise current spectral density, 6.74-mApp minimum detectable signal that corresponds to the maximum detection range of 10 m, and 56.5-mW power dissipation from a 1.8-V supply. This optoelectronic Rx IC provides a potential for a low-cost low-power solution in the applications of home-monitoring LiDAR sensors.

2013 ◽  
Vol 300-301 ◽  
pp. 1012-1017
Author(s):  
Bing Ting Zha ◽  
He Zhang ◽  
Jun Hong Wang ◽  
Jing Guo

The echo signal received by laser fuze was very weak when the detection range increased. In order to expand the operating range of fuze, the reception capacity of fuze for weak signal should be improved. According to the requirements of long-range laser fuze receiving system as small volume, low-power, low-noise, high-gain, the amplifying circuit of the receiving system was analyzed and designed. To improve the ability of laser fuze for detecting weak signal, the high-sensitive, low-noise, inner-gain avalanche photodiode (APD) was used as a photodetector in the system, and the low-noise preamplifier and voltage amplifying circuit was designed. The noise and frequency response of the amplifying circuit was researched and analyzed by simulation and experiment. The results show that the design is effective and feasible, which can meet the requirements of processing circuit as receiving weak signal from long-distance.


2017 ◽  
Vol 27 (01) ◽  
pp. 1850007 ◽  
Author(s):  
Yutong Ying ◽  
Xuefei Bai ◽  
Fujiang Lin

This paper presents a low-power, high gain-bandwidth product (GBW) gain cell for gigabits-per-second communications. Based on this gain cell, a large GBW limiting amplifier (LA) and two types of high oscillation-frequency ring oscillators (ROs) are implemented with good energy efficiencies. Fabricated in the 0.18[Formula: see text][Formula: see text]m CMOS process, the proposed LA can support 1.25[Formula: see text]Gbps data-rate with a measured GBW of 338[Formula: see text]GHz under 5[Formula: see text]mW. The proposed single- and multi-loop ROs obtain a simulated typical oscillation frequency of 5.26[Formula: see text]GHz and 6.96[Formula: see text]GHz, respectively, under 6.2 mW, which is less than one-eighth the power consumption of published ROs at similar frequencies in the same process.


2019 ◽  
Vol 15 (2) ◽  
pp. 113-118
Author(s):  
Agata Romanova ◽  
Vaidotas Barzdenas

AbstractThe work reports on the design and performance of a low-noise low-cost CMOS transimpedance amplifier (TIA). The proposed circuit shall be employed in optical time-domain reflectometers and is implemented using an affordable 0.18 µm 1.8 V CMOS process. The approach preserves the benefits of a classical feedback structure while addressing the noise problem of conventional feed-forward and resistive feedback architectures via the usage of noise-efficient capacitive feedback. Circuit-level modifications are proposed to mitigate the voltage headroom and DC current issues. The suggested design achieves a total gain of 82 dBΩ (79 dBΩ after the output buffer) within the bandwidth of 1.2 GHz while operating with a total input capacitance of 0.7 pF. The simulated average input-referred noise current density is below 1.8 pA/sqrt(Hz) with the power consumption of the complete amplifier including the output buffer being 21 mW.


Electronics ◽  
2021 ◽  
Vol 10 (13) ◽  
pp. 1516
Author(s):  
Shuai Cheng ◽  
Linhong Li ◽  
Niansong Mei ◽  
Zhaofeng Zhang

In this paper, a high gain 77-GHz receiver with a low noise figure (NF) was designed and implemented in a 40-nm CMOS process. With the purpose of making better use of active devices, an extra inductor, Ld, is adopted in the new neutralization technique. The three-stage differential low noise amplifier (LNA) using the proposed technique improves the voltage gain and reduces the NF. The receiver design utilizes an active double-balanced Gilbert mixer with a transformer coupling network between the transconductance stage and the switch stage. The flicker noise contribution from the switch MOS transistors is largely reduced due to the low DC current of the switch pairs. The LO signal is provided by an on-chip fundamental voltage-controlled oscillator (VCO) with a tuning range from 70.5 to 78.1 GHz. A conversion gain of 32 dB and a NF of 11.86 dB are achieved at 77 GHz by the designed receiver. The LNA as well as the mixer consume a total DC power of 33.2 mW and occupy a core size of 1 × 0.38 mm2.


Electronics ◽  
2020 ◽  
Vol 9 (7) ◽  
pp. 1137
Author(s):  
Changmin Lee ◽  
Jinho Jeong

In this paper, we design a THz CMOS on-chip patch antenna with defected ground structure (DGS) and utilize it to implement a broadband and high gain on-chip antenna array. It is verified from the simulation that the DGS not only can increase the gain and bandwidth of the antenna element, but also can increase the isolation between the antenna elements in the on-chip array. Therefore, it allows the design of the compact 1 × 2 and 2 × 2 on-chip antenna array with high gain and broad bandwidth. The element spacing and feedline structures of the antenna array are designed and optimized by the simulations. The designed antenna element, and 1 × 2 and 2 × 2 antenna arrays are fabricated in a commercial 65 nm CMOS process. In the on-wafer measurement, they exhibit an antenna gain of 3.1 dBi, 7.2 dBi, and 8.2 dBi with a bandwidth of 14.0%, 21.3%, and 28.0% for the reflection coefficient less than −10 dB, respectively, at 300 GHz. This result corresponds to very good performance compared to the reported THz CMOS on-chip antenna array. Therefore, the designed CMOS on-chip antenna element and array using DGS in this work can be effectively applied to build low-cost and high performance THz systems, because they can be fully implemented in a conventional CMOS process without requiring any additional processes or manufacturing techniques.


Circuit World ◽  
2019 ◽  
Vol 46 (1) ◽  
pp. 32-41
Author(s):  
Deepak Balodi ◽  
Arunima Verma ◽  
Ananta Govindacharyulu Paravastu

Purpose The paper aims to present the novel design approach for a low power LC-voltage-controlled oscillators (VCO) design with low phase noise that too targeted at the most sought band of Bluetooth applications. Owing to their crucial role in a wide variety of modern applications, VCO and phase-locked loop (PLL) frequency synthesizers have been the subject of extensive research in recent years. In fact, VCO is one of the key components being used in a modern PLL to provide local frequency signal since a few decades. The complicated synthesizer requirements imposed by cellular phone applications have been a key driver for PLL research. Design/methodology/approach This paper first opted to present the recent developments on implemented techniques of LC-VCO designs in popular RF bands. An LC-VCO with a differential (cross-coupled) MOS structure is then presented which has aimed to compensate the losses of an on-chip inductor implemented in UMC’s 130 nm RF-CMOS process. The LC-VCO is finally targeted to embed onto the synthesizer chip, to address the narrowband (S-Band) applications where Bluetooth has been the most sought one. The stacked inductor topology has been adopted to get the benefit of its on-chip compatibility and low noise. The active differential architecture, which basically is a cross-coupled NMOS structure, has been then envisaged for the gain which counters the losses completely. Three major areas of LC-VCO design are considered and worked upon for the optimum design parameters, which includes Bluetooth coverage range of 2.410 GHz to 2.490 GHz, better linearity and high sensitivity and finally the most sought phase noise performance for an LC-VCO. Findings The work provides the complete design aspect of a novel LC-VCO design for low phase noise narrowband applications such as Bluetooth. Using tuned MOS varactor, in 130 nm-RF CMOS process, a high gain sensitivity of 194 MHz/Volt was obtained. Thus, the entire frequency range of 2415-2500 MHz for Bluetooth applications, supporting multiple standards from 3G to 5G, was covered by voltage tuning of 0.7-1.0 V. To achieve the low power dissipation, low bias (1.2 V) cross-coupled differential structure was adopted, which completely paid for the losses occurred in the LC resonator. The power dissipation comes out to be 8.56 mW which is a remarkably small value for such a high gain and low noise VCO. For the VCO frequencies in the presented LO-plan, the tank inductor was allowed to have a moderate value of inductance (8 nH), while maintaining a very high Q factor. The LC-VCO of the proposed LO-generator achieved extremely low phase noise of −140 dBc/Hz @ 1 MHz, as compared to the contemporary designs. Research limitations/implications Though a professional tool for inductor and circuit design (ADS-by Keysight Technologies) has been chosen, actual inductor and circuit implementation on silicon may still lead to various parasitic evolutions; therefore, one must have that margin pre-considered while finalizing the design and testing it. Practical implications The proposed LC-VCO architecture presented in this work shows low phase noise and wide tuning range with high gain sensitivity in S-Band, low power dissipation and narrowband nature of wireless applications. Originality/value The on-chip stacked inductor has uniquely been designed with the provided dimensions and other parameters. Though active design is in a conventional manner, its sizing and bias current selection are unique. The pool of results obtained completely preserves the originally to the full extent.


2013 ◽  
Vol 760-762 ◽  
pp. 115-119
Author(s):  
Wen Yuan Li ◽  
Rui Guo

A fully integrated 10-Gb/s optical receiver analog front-end (AFE) design that includes a transimpedance amplifier (TIA) and a limiting amplifier (LA) is demonstrated to require less chip area and is suitable for both low-cost and low-voltage applications. The AFE is stimulation using a 0.18μm CMOS process. In order to avoid off-chip noise interference, the TIA and LA are dc-coupled on the chip instead of ac-coupled though a large external capacitor. The tiny photo current received by the receiver AFE is amplified to voltage swing of 400. The results indicate that, with a photodiode parasitic capacitance of 500fF and the bonding pad parasitic capacitance of 200fF between which a 2-mm bond wire is inserted at the input node, the AFE provides a conversion gain of up to 89.21 dB and 3 dB bandwidth of 9.78 GHz. Operating under a 1.8V supply, circuit power dissipation is 95 mW and its sensitivity is 18.5μA for BER of 10-12


2021 ◽  
Author(s):  
zhang qi wen ◽  
Chen Honglei ◽  
Ding Ruijun

Abstract HgCdTe avalanche photodiode (APD) is a frontier research on infrared focal plane technology, High-precision time stamp readout circuit is the basis of the APD focal plane at 77 K, which directly affects APD infrared focal plane performance. Time-to-digital conversion circuit (TDC) is one of the methods to achieve high-precision time stamping. Based on the analysis of MOSFET at low temperature, our design a vernier TDC circuit, which uses a synchronous counter to quantize an integer multiple of the period to achieve a coarse count of 6 bits; The on-chip PLL multiplied high-frequency clock has high-precision and high PVT characteristics, using it to quantify the part that is less than one clock cycle to achieve a fine-count of 6 bits output. The circuit adopts standard CMOS process tape out, our circuit works at a master-frequency of 120 MHz. At 77 K, the circuit test can distinguish the time resolution of 236.280 ps. The DNL is within -0.54~0.71 LSB, and INL is within -1.32~1.21 LSB.


2012 ◽  
Vol 2 (3) ◽  
Author(s):  
Apratim Roy ◽  
S. Rashid

AbstractIn this paper, a single-stage deep sub-micron wideband amplifier (LNA) using a reactive resonance tank and passive port-matching techniques is demonstrated operating in the microwave frequency range (K band). A novel power-efficient bandwidth (BW) regulation technique is proposed by incorporating a small impedance in the resonance tank of the amplifier configuration. It manifests a forward gain in the range of 5.9–10.7 dB covering a message bandwidth of 10.6–6.3 GHz. With regulation, input-output reflection parameters (S 11, S 22) and noise figure can be manipulated by −12.7 dB, −22.7 dB and 0.36 dB, respectively. Symmetric regulation is achieved for bandwidth and small signal gain with respect to moderate tank impedance (36.5% and −26.8%, respectively) but the effect on noise contribution remains relatively low (increase of 7% from a base value of 2.39 dB). The regulated architecture, when analyzed with 90 nm silicon CMOS process, supports low power (9.1 mW) on-chip communication. The circuit is tested with a number of combinations for tank (drain) impedance to verify the efficiency of the proposed technique and achieves better figures of merit when compared with published literature.


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