STELLA - STretchable ELectronics for Large Area Applications - A New Technology for Smart Textiles

2008 ◽  
pp. 67-73 ◽  
Author(s):  
Benno Schmied ◽  
Jürgen Günther ◽  
Christopher Klatt ◽  
Horst Kober ◽  
Eugène Raemaekers
Keyword(s):  
New Technology ◽  
Stretchable Electronics ◽  
Large Area ◽  
Smart Textiles

STELLA - STretchable ELectronics for Large Area Applications - A New Technology for Smart Textiles

2008 ◽  
Vol 60 ◽  
pp. 67-73 ◽  
Author(s):  
Benno Schmied ◽  
Jürgen Günther ◽  
Christopher Klatt ◽  
Horst Kober ◽  
Eugène Raemaekers
Keyword(s):  
Low Cost ◽  
New Technology ◽  
High Volume ◽  
The Body ◽  
Stretchable Electronics ◽  
Electronic Systems ◽  
Wearable Electronics ◽  
Large Area ◽  
Ambient Intelligent ◽  
Eu Project

As a consequence of the ambient intelligent vision where the citizen carries along more and more electronic systems near the body wearable electronics is needed. Typical applications are intelligent textiles and clothes, personnel healthcare or fitness monitoring. The electronic systems for these applications have to be stretchable with soft touch nature in order not to hamper the comfort of the user and to be ideally almost non-noticeable to him. They should be reliably withstanding all mechanical and chemical requirements of clothes, in which they are integrated. In the EU- project "STELLA" IST - 028260 the consortium has developed a platform technology of enabling interconnection, packaging and assembling technologies. For example a new generation of stretchable substrates based on non woven with stretchable conductor pattern for large area application has been developed. In order to realize low-cost high volume stretchable electronics printed circuit methods have been modified and applied so far.

Smart Textiles: A Strategic Perspective of Textile Industry

2012 ◽  
Vol 80 ◽  
pp. 1-6 ◽  
Author(s):  
Lorena Affatato ◽  
Cosimo Carfagna
Keyword(s):  
Textile Industry ◽  
Manufacturing Industry ◽  
Well Being ◽  
Large Area ◽  
Smart Textiles ◽  
Materials Engineering ◽  
Interdisciplinary Field ◽  
State Of Mind ◽  
Micro Systems ◽  
Strategic Perspective

Comfort is a state of mind affected by many factors, and clothing has contributing to the well being of man, changing in some cases his customs. Since the origin, the primary functions of clothes have been of protection against cold or in general against environmental stimuli. New functions are required to modern textiles: wearing comfort, durability, cleaning properties, optimized functionality for specific applications (workwear, sportswear, medical wear). Smart and interactive textiles represent a budding interdisciplinary field that brings together specialists in information technology, micro systems, materials engineering, and production technology. The focus of this new area is on developing the enabling technologies and fabrication techniques for the economical production of flexible, conformable and large-area textile- based information systems that are expected to have more applications for different end users. The smart and interactive textiles will be highly applied in the next generation of fibres, fabrics and items produced from them. Application of smart textiles can be now found everywhere. The market and the business of wearable, interactive and smart textiles are presently changing the basis of the textile industry. The changes are dynamic knowledge transfer, innovative systems, new employment opportunities in the smart industries and others. Business possibilities are not limited to the textile industry, but they can be found in almost any line of business. The European textile sector is one of the mainstays of the European Manufacturing Industry. The market for smart textiles is one of the most dynamic and fast growing sectors and offers huge potential for companies.

scholarly journals A highly shape-adaptive, stretchable design based on conductive liquid for energy harvesting and self-powered biomechanical monitoring

2016 ◽  
Vol 2 (6) ◽  
pp. e1501624 ◽  
Author(s):  
Fang Yi ◽  
Xiaofeng Wang ◽  
Simiao Niu ◽  
Shengming Li ◽  
Yajiang Yin ◽  
...  
Keyword(s):  
Energy Harvesting ◽  
Three Dimensional ◽  
Power Source ◽  
Triboelectric Nanogenerator ◽  
Stretchable Electronics ◽  
Large Area ◽  
Conductive Liquid ◽  
Power Sources ◽  
Energy Harvesters ◽  
Self Powered

The rapid growth of deformable and stretchable electronics calls for a deformable and stretchable power source. We report a scalable approach for energy harvesters and self-powered sensors that can be highly deformable and stretchable. With conductive liquid contained in a polymer cover, a shape-adaptive triboelectric nanogenerator (saTENG) unit can effectively harvest energy in various working modes. The saTENG can maintain its performance under a strain of as large as 300%. The saTENG is so flexible that it can be conformed to any three-dimensional and curvilinear surface. We demonstrate applications of the saTENG as a wearable power source and self-powered sensor to monitor biomechanical motion. A bracelet-like saTENG worn on the wrist can light up more than 80 light-emitting diodes. Owing to the highly scalable manufacturing process, the saTENG can be easily applied for large-area energy harvesting. In addition, the saTENG can be extended to extract energy from mechanical motion using flowing water as the electrode. This approach provides a new prospect for deformable and stretchable power sources, as well as self-powered sensors, and has potential applications in various areas such as robotics, biomechanics, physiology, kinesiology, and entertainment.

scholarly journals Protein crystallography with a novel large-area pixel detector

2006 ◽  
Vol 39 (4) ◽  
pp. 550-557 ◽  
Author(s):  
Gregor Hülsen ◽  
Christian Broennimann ◽  
Eric F. Eikenberry ◽  
Armin Wagner
Keyword(s):  
Single Photon ◽  
New Technology ◽  
Photon Counting ◽  
Data Sets ◽  
Pixel Detector ◽  
Large Area ◽  
Single Photon Counting ◽  
Continuous Rotation ◽  
Under Construction ◽  
Paul Scherrer

The PILATUS 1M detector, developed at the Paul Scherrer Institut, is a single-photon-counting hybrid pixel detector designed for macromolecular crystallography. With more than 1 million pixels covering an area of 243 × 210 mm, it is the largest such device constructed to date. The detector features a narrow point spread function, very fast readout and a complete absence of electronic noise. Unfortunately, this prototype detector has numerous defective pixels and sporadic errors in counting that complicate its operation. With appropriate experimental design, it was largely possible to work around these problems and successfully demonstrate the application of this technology to structure determination. Conventional coarse ϕ-sliced data were collected on thaumatin and a refined electron density map was produced that showed the features expected of a map at 1.6 Å resolution. The results were compared with the performance of a reference charge-coupled device detector: the pixel detector is superior in speed, but showed higherR-factors because of the counting errors. Complete fine ϕ-sliced data sets recorded in the continuous-rotation mode showed the predicted advantages of this data collection strategy and demonstrated the expected reduction ofR-factors at high resolution. A new readout chip has been tested and shown to be free from the defects of its predecessor; a PILATUS 6M detector incorporating this new technology is under construction.

Via-Hole Addressed TFT and Process for Large-Area A-Si:H Electronics

1997 ◽  
Vol 467 ◽  
Author(s):  
H. Gleskova ◽  
S. Wagneri ◽  
D. S. Shen
Keyword(s):  
New Technology ◽  
Back Side ◽  
Large Area ◽  
Silicon Thin Film ◽  
Metal Line ◽  
Delay Reduction ◽  
Thin Glass ◽  
Via Holes ◽  
Via Hole ◽  
First Time

ABSTRACTWe demonstrate a new technology for RC gate delay reduction, by fabricating an array of amorphous silicon thin-film transistors (a-Si:H TFTs) on a thin glass substrate provided with via holes. All gates are connected through via holes to a metal line that is run on the back side of the substrate. We opened via holes with a diameter of 35 to 50 μm in 50 μm glass foil. For the first time, all TFT pattern definition steps used a process which employs electrophotographic toner masks.

Explosive Compaction-Coating Manufacture Large Area Coat

2011 ◽  
Vol 189-193 ◽  
pp. 1014-1017
Author(s):  
Chang Xing Du ◽  
Zheng Zhao ◽  
Gang Tao
Keyword(s):  
Heat Treatment ◽  
Impact Velocity ◽  
Coating Thickness ◽  
New Technology ◽  
Annealing Treatment ◽  
Amorphous Coating ◽  
Large Area ◽  
Explosive Compaction ◽  
Uniform Coating

A new technology for manufacturing large area coating, named explosive compaction- coating (ECC), was proposed in this paper, and its concrete process was described in detail. The ECC for Cu plate- Cu powder was experimented, by variety height of burst and heat treatment of Cu plate four groups divided into, and uniform coating thickness beyond 300 um was obtained. Research shows that the optimal impact velocity is 900 m/s. Annealing treatment of Cu plate has not impact on coating. ECC can manufacture large area metal or nonmetal coating and nano or amorphous coating.

Entrainment Defects

2019 ◽  
Author(s):  
J. Campbell
Keyword(s):  
Liquid Metals ◽  
Early Stage ◽  
Surface Film ◽  
New Technology ◽  
Superplastic Forming ◽  
Hot Tearing ◽  
Surface Films ◽  
Large Area ◽  
Large Populations ◽  
Metallurgical Defect

Most metals start their lives in the liquid state, and are subjected to various transfers involving pouring or other types of surface turbulence. These actions entrain (fold in) the surface film to create entrainment defects. These are principally (a) bubbles that in turn create bubble trails; (b) bifilms; doubled over surface films, that act as cracklike defects; and (c) sundry entrained debris, collectively known as exogenous inclusions. The bifilm is the subject of this perspective. It appears to be a common, but serious and almost overlooked metallurgical defect. Analysis of bifilms provides a simple, powerful and elegant concept based on an enduring legacy from turbulence during the pouring of liquid metals. Usually large populations of bifilms are introduced into metals at an early stage of their production. In general their presence has been unsuspected because although they can have large area, they can often be only nanometres thick and not easily detected by conventional non-destructive techniques. The populations of cracks in suspension in liquid metal explains many otherwise inexplicable features of cast products such as porosity, hot tearing, the morphologies of second phases, and impaired reliability of mechanical properties. The fundamental difference between such entrained defects (associated with a macroscopic unbonded interface) and defects and inclusions grown in the melt is seen to be of central significance for the failures of metals by mechanical or corrosion type mechanisms. For wrought products the continued presence of bifilms, now usually extended and elongated and mainly occupying grain boundaries, appears to offer explanations for many metallurgical phenomena. Bifilms are likely to influence the development of texture, and are the most likely source for many types of failure in the solid state. Thus the limitations to superplastic forming, cavitation in tertiary creep, pitting corrosion of various types and stress corrosion cracking are likely to be profoundly affected by bifilms. Although the effects of bifilms can be reduced by expensive post-casting operations such as hipping or working, the major future potential lies in techniques for their avoidance. Some casting operations are already taking some first steps in new technology for their avoidance, and benefiting technically and commercially.

New Technology and Developments in Compound Semiconductor Vertical RDR-MOCVD Growth Systems

1994 ◽  
Vol 340 ◽  
Author(s):  
M. McKee ◽  
G.S. Tompa ◽  
P.A. Zawadzki ◽  
A. Thompson ◽  
A. Gurary ◽  
...  
Keyword(s):  
New Technology ◽  
Chemical Vapor ◽  
Rotating Disk ◽  
Easy Access ◽  
Organic Chemical ◽  
Optimum Process ◽  
Process Conditions ◽  
Monitoring And Control ◽  
Large Area ◽  
Wide Range

ABSTRACTCompound semiconductors are at the heart of todays advanced digital and optoelectronic devices. As device production levels increase, so too does the need for high throughput deposition systems. The vertical rotating disk reactor (RDR) has been scaled to dimensions allowing metal organic chemical vapor deposition (MOCVD) on multiple substrates located on a 300 mm diameter platter. This symetric large area reactor affords easy access over a wide range of angles for optical monitoring and control of the growth process. The RDR can be numerically modeled in a straightforward manner, and we have derived scaling rules allowing the prediction of optimum process conditions for larger reactor sizes. The material results give excellent agreement with the modeling, demonstrating GaAs/AlAs structures with <±0.9% thickness uniformities on up to 17-50mm or 4-100mm GaAs substrates. Process issues related to reactor scaling are reviewed. With high reactant efficiencies and short cycle times between growths, through the use of a vacuum loadlock, the costs per wafer are found to be dramatically less than in alternative process reactors. The high reactant utilization, in combination with a dedicated and highly efficient exhaust scrubbing system, minimizes the systems environmental impact.

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