STELLA - STretchable ELectronics for Large Area Applications - A New Technology for Smart Textiles

2008 ◽  
Vol 60 ◽  
pp. 67-73 ◽  
Author(s):  
Benno Schmied ◽  
Jürgen Günther ◽  
Christopher Klatt ◽  
Horst Kober ◽  
Eugène Raemaekers
Keyword(s):  
Low Cost ◽  
New Technology ◽  
High Volume ◽  
The Body ◽  
Stretchable Electronics ◽  
Electronic Systems ◽  
Wearable Electronics ◽  
Large Area ◽  
Ambient Intelligent ◽  
Eu Project

As a consequence of the ambient intelligent vision where the citizen carries along more and more electronic systems near the body wearable electronics is needed. Typical applications are intelligent textiles and clothes, personnel healthcare or fitness monitoring. The electronic systems for these applications have to be stretchable with soft touch nature in order not to hamper the comfort of the user and to be ideally almost non-noticeable to him. They should be reliably withstanding all mechanical and chemical requirements of clothes, in which they are integrated. In the EU- project "STELLA" IST - 028260 the consortium has developed a platform technology of enabling interconnection, packaging and assembling technologies. For example a new generation of stretchable substrates based on non woven with stretchable conductor pattern for large area application has been developed. In order to realize low-cost high volume stretchable electronics printed circuit methods have been modified and applied so far.

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

Fabricaton Ofactive Devices and Logic Gates on Fibers

2003 ◽  
Vol 769 ◽  
Author(s):  
YongWoo Choi ◽  
Ioannis Kymissis ◽  
Annie Wang ◽  
Akintunde I. Akinwande
Keyword(s):  
Threshold Voltage ◽  
Electronic Structures ◽  
Low Cost ◽  
Logic Gates ◽  
Wearable Electronics ◽  
Drain Voltage ◽  
Large Area ◽  
Active Devices ◽  
P Type ◽  
A Current

AbstractTextiles are a suitable substrate for large area, flexible and wearable electronics because of their excellent flexibility, mechanical properties and low cost manufacturability. The ability to fabricate active devices on fiber is a key step for achieving large area and flexible electronic structures. We fabricated transistors and inverters with a-Si film and pentacene film on Kapton film and cut them into fibers. The a-Si TFT showed a threshold voltage of 8.5 V and on/off ratio of 103 at a drain voltage of 10 V. These are similar to the characteristics of a TFT fabricated on a glass substrate at the same time. The maximum gain of the inverter with an enhancement n-type load was 6.45 at a drain voltage of 10 V. The pentacene OTFT showed a threshold voltage of -8 V and on/off ratio of 103 at a drain voltage of -30 V. The inverter with a depletion p-type load showed a voltage inversion but the inversion occurred at the wrong voltage. The antifuse was successfully programmed with a voltage pulse and also a current pulse. The resistance decreased from 10 GΩ to 2 kΩ after the programming.

scholarly journals Electric Field Assisted Self-Healing of Open Circuits with Conductive Particle-Insulating Fluid Dispersions: Optimizing Dispersion Concentration

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Virendra Parab ◽  
Oppili Prasad ◽  
Sreelal Pillai ◽  
Sanjiv Sambandan
Keyword(s):  
Electric Field ◽  
Flexible Electronics ◽  
Image Sensor ◽  
Electronic Systems ◽  
Self Healing ◽  
Wearable Electronics ◽  
Large Area ◽  
Open Faults ◽  
The Impact ◽  
Conductive Particles

AbstractOpen circuit faults in electronic systems are a common failure mechanism, particularly in large area electronic systems such as display and image sensor arrays, flexible electronics and wearable electronics. To address this problem several methods to self heal open faults in real time have been investigated. One approach of interest to this work is the electric field assisted self-healing (eFASH) of open faults. eFASH uses a low concentration dispersion of conductive particles in an insulating fluid that is packaged over the interconnect. The electric field appearing in the open fault in a current carrying interconnect polarizes the conductive particles and chains them up to create a heal. This work studies the impact of dispersion concentration on the heal time, heal impedance and cross-talk when eFASH is used for self-healing. Theoretical predictions are supported by experimental evidence and an optimum dispersion concentration for effective self-healing is identified.

STELLA - STretchable ELectronics for Large Area Applications - A New Technology for Smart Textiles

2008 ◽  
pp. 67-73 ◽  
Author(s):  
Benno Schmied ◽  
Jürgen Günther ◽  
Christopher Klatt ◽  
Horst Kober ◽  
Eugène Raemaekers
Keyword(s):  
New Technology ◽  
Stretchable Electronics ◽  
Large Area ◽  
Smart Textiles

Diode Laser Bonding of Planar MEMS, MOEMS, & Microfluidic Devices

2005 ◽  
Vol 872 ◽  
Author(s):  
Jie-Wei Chen ◽  
Jerry Zybko ◽  
James Clements
Keyword(s):  
Diode Laser ◽  
Low Cost ◽  
New Technology ◽  
Microfluidic Devices ◽  
High Volume ◽  
Process Characteristics ◽  
Alignment System ◽  
Laser Bonding ◽  
Plastic Parts ◽  
Automated Alignment

AbstractThe assembly of plastic microfluidic devices, MOEMS and microarrays requiring high positioning and welding accuracy in the micrometer range, has been successfully achieved using a new technology based on laser transmission welding combined with a photolithographic mask technique. This paper reviews a laser assembly platform for the joining of microfluidic plastic parts with its main related process characteristics and its potential for low-cost and high volume manufacturing. The system consists of a of diode laser with a mask and an automated alignment function to generate micro welding seams with freely definable geometries. A fully automated mask alignment system with a resolution of < 2 μm and a precise, non-contact energy input allows a fast welding of micro structured plastic parts with high reproducibility and excellent welding quality.

Printable Electronics: Patterning of Conductive Materials for Novel Applications

2004 ◽  
Vol 828 ◽  
Author(s):  
Anupama Karwa ◽  
Yu Xia ◽  
Daniel M. Clark ◽  
Thomas W. Smith ◽  
Bruce E. Kahn
Keyword(s):  
Materials Science ◽  
Low Cost ◽  
High Volume ◽  
Production Volume ◽  
Wearable Electronics ◽  
Conductive Materials ◽  
High Volume Production ◽  
Volume Production ◽  
Novel Applications ◽  
Printing Processes

ABSTRACTThe convergence of materials science, printing, and electronics promises to offer low cost and high volume production of devices such as transistors, RFID tags, wearable electronics and other novel applications. Although a number of “soft lithographic” techniques have been used to make these devices, they are slow and have a limited production volume [5], [14-15].Here high volume printing processes like rotary letterpress, flexography and offset lithography have been investigated for patterning conductive materials [1]. The synthesis and development of conducting inks using electrically functional polymers has been studied. The feasibility of using such inks in high volume printing processes has been studied. An attempt has been made to print conductive interdigitated electrodes using these inks to obtain uniform coating properties and appropriate electrical characteristics. Various process parameters like type of substrate, inking time and speed, printing pressure, printing force and ink formulation have been investigated.

scholarly journals Stability Analysis of All-Inkjet-Printed Organic Thin-Film Transistors

MRS Advances ◽  
2018 ◽  
Vol 3 (33) ◽  
pp. 1871-1876 ◽  
Author(s):  
Chen Jiang ◽  
Hanbin Ma ◽  
Arokia Nathan
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Low Voltage ◽  
Low Cost ◽  
Organic Thin Film Transistors ◽  
Operating Voltage ◽  
Wearable Electronics ◽  
Organic Thin Film ◽  
Large Area ◽  
Mechanical Bending

Abstract:All-inkjet-printed organic thin-film transistors take advantage of low-cost fabrication and high compatibility to large-area manufacturing, making them potential candidates for flexible, wearable electronics. However, in real-world applications, device instability is an obstacle, and thus, understanding the factors that cause instability becomes compelling. In this work, all-inkjet-printed low-voltage organic thin-film transistors were fabricated and their stability was investigated. The devices demonstrate low operating voltage (<3 V), small subthreshold slope (128 mV/decade), good mobility (0.1 cm2 V−1 s−1), close-to-zero threshold voltage (−0.16 V), and high on/off ratio (>105). Several aspects of stability were investigated, including mechanical bending, shelf life, and bias stress. Based on these tests, we find that water molecule polarization in dielectrics is the main factor causing instability. Our study suggests use of a printable water-resistant dielectric for stability enhancement for the future development of all-inkjet-printed organic thin-film transistors.

scholarly journals Bioimpedance as a tool for evaluating the body composition of suruvi (Steindachneridion scriptum)

2015 ◽  
Vol 75 (4 suppl 1) ◽  
pp. 239-244
Author(s):  
E. Zaniboni-Filho ◽  
S. Hermes-Silva ◽  
M. Weingartner ◽  
J. E. Jimenez ◽  
M. R. Borba ◽  
...  
Keyword(s):  
Body Composition ◽  
Low Cost ◽  
New Technology ◽  
Bioelectrical Impedance ◽  
Impedance Analysis ◽  
Study Data ◽  
The Body ◽  
High Lipid ◽  
In Series ◽  
Lipid Diet

Abstract Bioelectrical impedance analysis (BIA) is regarded as an important tool for evaluating the body composition of different animals in a rapid, non-destructive, and low-cost manner. A South American fish species, Steindachneridion scriptum, known as suruvi, was selected for study in this investigation. A protocol to produce fish with different body composition was used to allow BIA to adequately predict the body composition of suruvi. The fish were fed twice each day with two different diets; a low lipid diet (8.90%), and a high lipid diet (18.68%). These dietary differences allowed suruvi specimens with different body compositions to be produced. The BIA readings were determined using a Quantum X Bioelectrical Body Composition Analyzer. Two readings (dorsal and ventral) were obtained for each fish. After BIA readings were obtained, the proximate composition of the fish bodies for each individual was determined. All of the study data were used to establish correlation equations between proximate analyses and BIA values. Strong correlations were found for S. scriptum. The highest correlations were obtained for the following pairs of quantities, using BIA data from dorsal readings: moisture and resistance in series (R2 = 0.87); protein and resistance in series (R2 = 0.87); and ash and reactance in parallel (R2 = 0.82). We conclude that BIA is an effective method in determining the body composition of S. scriptum without sacrificing the fish. However, to expand the use of this new technology it is important to define strict BIA protocols to guarantee accurate estimates.

Materials and Manufacturing Issues for Color Plasma Displays

MRS Bulletin ◽  
1996 ◽  
Vol 21 (3) ◽  
pp. 65-68 ◽  
Author(s):  
Larry F. Weber ◽  
Jane D. Birk
Keyword(s):  
Low Cost ◽  
Contrast Ratio ◽  
High Volume ◽  
Computer Applications ◽  
Market Potential ◽  
Large Area ◽  
Plasma Display ◽  
The Media ◽  
And Performance ◽  
Plasma Displays

Recent demonstrations of color-plasma displays with exceptional image quality and performance that meet and in some cases exceed that of cathode-ray tubes (CRTs) have resulted in a renewed interest in this 25-year-old technology. The tremendous market potential for large-area plasma displays for both home-entertainment and computer applications now appears to be an attainable goal. This new generation of plasma displays features full color capability, high brightness and contrast ratio, wide viewing angles, and rapid refresh rate. The success of today's plasma displays is the result of the integration of advancements in driver electronics and the materials and processes used in the fabrication of the plasma-display structures.Using color-plasma technology, two-inch-thick direct-view displays can be made that are up to 60 inches in diagonal. During the past several months, numerous articles have appeared in the media announcing major investments in facilities and technology for largescale manufacturing of these large-area plasma displays. Table I lists the companies committed to plasma-display research and development. Additional advancements in materials, processes, and electronics will be required to achieve high-volume, low-cost manufacturing.

scholarly journals Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics

2019 ◽  
Vol 20 (9) ◽  
pp. 2124 ◽  
Author(s):  
Lixin Mo ◽  
Zhenxin Guo ◽  
Li Yang ◽  
Qingqing Zhang ◽  
Yi Fang ◽  
...  
Keyword(s):  
Silver Nanoparticles ◽  
Radio Frequency Identification ◽  
Printed Electronics ◽  
Low Cost ◽  
Substrate Surface ◽  
Microwave Sintering ◽  
Stretchable Electronics ◽  
Temperature Sensitive ◽  
Large Area ◽  
Ag Nps

Printed electronics on flexible substrates has attracted tremendous research interest research thanks its low cost, large area production capability and environmentally friendly advantages. Optimal characteristics of silver nanoparticles (Ag NPs) based inks are crucial for ink rheology, printing, post-print treatment, and performance of the printed electronics devices. In this review, the methods and mechanisms for obtaining Ag NPs based inks that are highly conductive under moderate sintering conditions are summarized. These characteristics are particularly important when printed on temperature sensitive substrates that cannot withstand sintering of high temperature. Strategies to tailor the protective agents capping on the surface of Ag NPs, in order to optimize the sizes and shapes of Ag NPs as well as to modify the substrate surface, are presented. Different (emerging) sintering technologies are also discussed, including photonic sintering, electrical sintering, plasma sintering, microwave sintering, etc. Finally, applications of the Ag NPs based ink in transparent conductive film (TCF), thin film transistor (TFT), biosensor, radio frequency identification (RFID) antenna, stretchable electronics and their perspectives on flexible and printed electronics are presented.

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