Properties of Films Characterized by Scanning Acoustic Microscope

2014 ◽  
Vol 1061-1062 ◽  
pp. 961-965
Author(s):  
Hong Juan Yan ◽  
Chun Guang Xu ◽  
Ding Guo Xiao ◽  
Qi Lin
Keyword(s):  
Elastic Modulus ◽  
Sound Velocity ◽  
Ultrasonic Wave ◽  
Acoustic Impedance ◽  
Extreme Values ◽  
Amplitude Spectrum ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Scanning Acoustic Microscope

The scanning acoustic microscope is used to detect the properties of films. The ultrasonic wave propagates in the films with thickness h, acoustic impedance Z2 between medium with acoustic impedance Z1. The echoes from upper and lower interfaces overlap and interfere. The echoes are transformed by FFT. The interference phenomena are observed in amplitude spectrum of echoes. The spectrum has periodic extreme values at fn, fn=nc/2h. When thickness h is known, sound velocity c2 of film can be calculated. According to the principle, the properties of films such as thickness, acoustic impendence and elastic modulus are evaluated by scanning acoustic microscopy. The experimental results are good accorded with the actual properties of specimens.

Stacked Die Analysis Using C-mode Scanning Acoustic Microscope

2005 ◽  
Author(s):  
Li Na ◽  
Jawed Khan ◽  
Lonnie Adams
Keyword(s):  
Data Acquisition ◽  
Image Interpretation ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Analysis Mode ◽  
Scanning Acoustic Microscope

Abstract For stacked die package delamination inspection using C-mode acoustic microscope, traditional interface and thorough scan techniques cannot give enough of information when the delamination occurs in multi-interfaces, and echoes from adjacent interfaces are not sufficiently separated from each other. A thinner thickness in the stacked-die package could complicate C-mode scanning acoustic microscopy (CSAM) analysis and sometimes may lead to false interpretations. The first objective of this paper is to briefly explain the CSAM mechanism. Based on that, some of the drawbacks of current settings in detecting the delamination for stacked-die packages are presented. The last objective is to introduce quantitative B-scan analysis mode (Q-BAM) and Zip-Slice technologies in order to better understand and improve the reliability of detecting the delamination in stacked-die packages. Therefore, a large portion of this paper focuses on the Q-BAM and Zip-Slice data acquisition and image interpretation.

Scanning acoustic microscopy investigation of melted collagen in thermoplastic leather

1999 ◽  
Vol 14 (6) ◽  
pp. 2446-2448
Author(s):  
A. Wyler ◽  
G. Golan
Keyword(s):  
High Pressure ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Microscopy Investigation ◽  
The Matrix ◽  
Scanning Acoustic Microscope ◽  
Scanning Electron

A scanning acoustic microscope (SAM) has been used to investigate the structure of thermoplastic leather. This material is formed by pressing fibers of leather under high pressure and moderate temperature. The result is a matrix from transformed, melted fibers in which leftover fibers act as reinforcement. Unlike the scanning electron microscope (SEM), the SAM is able to distinguish between completely and incompletely transformed fibers and also to penetrate the material beneath the surface. The results show that the matrix is built as a domain structure. The advantages of the SAM over the SEM for organic materials are indicated.

scholarly journals The Reference Phase Correction for the Fluctuated Scanning Lines and the Slope of the Stage in Tissue Characterization by Scanning Acoustic Microscope

2019 ◽  
Vol 9 (22) ◽  
pp. 4883
Author(s):  
Nguyen Thanh Phong Truong ◽  
Hyehyun Kim ◽  
Donghae Lee ◽  
Yeon-Hee Kang ◽  
Sungsoo Na ◽  
...  
Keyword(s):  
Tissue Characterization ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
New Approach ◽  
Fluctuation Pattern ◽  
Hematoxylin And Eosin ◽  
Scanning Acoustic Microscope ◽  
Reference Phase

In this study, a new approach was investigated to extract reference phases from the scanning acoustic microscope to calculate the speed of sound when dealing with the slope of the stage and fluctuation of the scanning lines. To capture the slope and the fluctuation pattern, data of the first lines along the horizontal and vertical axes on the stage were used. A corrective function was then utilized to improve the accuracy of reference phase extraction. The method was then corroborated by demonstrating tumor discrimination in mice skin by means of scanning acoustic microscopy (SAM). B16-F10 melanoma cells were used to grow the tumor. Hematoxylin and eosin (H&E) staining was applied for histology characterization of the sample. A comparison of both acoustics and histology was conducted. Phase analysis was performed to examine the effects of both slope and fluctuation. The results showed that our approach significantly improved the tumor detection and accuracy of scanning acoustic microscopy.

Mechanical basis of cell shape: investigations with the scanning acoustic microscope

1995 ◽  
Vol 73 (7-8) ◽  
pp. 337-348 ◽  
Author(s):  
Jürgen Bereiter-Hahn ◽  
Llonka Karl ◽  
Holger Lüers ◽  
Monika Vöth
Keyword(s):  
Low Temperature ◽  
Cell Shape ◽  
Giant Cells ◽  
Bulk Flow ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Mechanical Basis ◽  
Scanning Acoustic Microscope

The shape of cells during interphase in sparse cultures often resembles that of fried eggs. XTH-2 cells, which have been derived from tadpole heart endothelia, provide a typical example of this type of shape. To understand the physical basis of this shape, the cytoskeleton of these cells has been investigated in detail. Subcellular elasticity data have been achieved by scanning acoustic microscopy (SAM). Their changes were observed during treatment of the cells with microtubule-disrupting agents (colcemid and low temperature), and shape generation in giant cells produced by electro-fusion was observed with SAM, revealing the role of the nucleus as a force centering organelle. From these observations combined with well-documented observations on cellular dynamics described in the literature, a model is developed explaining the fried-egg shape of cells by means of interacting forces and fluxes (cortical flow, bulk flow of cytoplasm, microtubule-mediated transport of cytoplasm) of cytoplasm. The model also allows the comprehension of the increase of tension in cells treated with colcemid.Key words: cell shape, elasticity, grant cells, microtubules, acoustic microscopy.

Application of Scanning Acoustic Microscopy to Electric and Electronic Parts

2000 ◽  
Author(s):  
C. Miyasaka ◽  
B. R. Tittmann
Keyword(s):  
Surface Roughness ◽  
Background Noise ◽  
Spherical Aberration ◽  
Current Trend ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Acoustic Lens ◽  
Electronic Parts ◽  
Scanning Acoustic Microscope

Abstract Ever since the invention of the scanning acoustic microscope (SAM), a key objective has been the enhancement of the resolution in an interior image. Thus, an acoustic lens that can form an interior image with a shear wave has been designed. The use of this lens gives benefits such as an increase of lateral resolution in the interior image, a reduction in background noise caused by surface roughness, and a reduction of spherical aberration. Significantly, with the current trend towards microminiaturization of microelectronic packages, acoustic microscopy with higher resolution and removal of surface roughness can play an important role in diagnostic examinations and failure analysis. In this paper, applications for the lens in microelectronic IC packages will be summarized.

Scanning Acoustic Microscope Studies of the Elastic Properties of Osteons and Osteon Lamellae

1993 ◽  
Vol 115 (4B) ◽  
pp. 543-548 ◽  
Author(s):  
J. Lawrence Katz ◽  
Alain Meunier
Keyword(s):  
Elastic Properties ◽  
Pulse Mode ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Structural Studies ◽  
Microstructural Properties ◽  
Acoustic Microscope ◽  
Ultrasonic Signals ◽  
Comparable Level ◽  
Scanning Acoustic Microscope

Scanning acoustic microscopy (SAM) provides the means for studying the elastic properties of a material at a comparable level of resolution to that obtained by optical microscopy for structural studies. SAM is nondestructive and permits observation of properties in the interior of materials which are optically opaque. Two modes of ultrasonic signals have been used in a Model UH3 Scanning Acoustic Microscope (Olympus Co., Tokyo, Japan) as part of a continuing study of the microstructural properties of bone. The pulse mode, using a single narrow pulse in the range of 30 MHz to 100 MHz, has been used to survey the surface and interior of specimens of human and canine femoral compact cortical bone at resolutions down to approximately 30μm. To obtain more detailed information at significantly higher resolution, the burst mode, comprised of tens of sinusoids, has been used at frequencies from 200 MHz to 600 MHz. This has provided details of both human and canine single osteons (or haversion systems) and osteonic lamellae at resolutions down to approximately 1.7μm, well within the thickness of a lamella as viewed in a specimen cut transverse to the femoral axis.

An Acoustic Gray Scale for Scanning Acoustic Microscopy and Diagnostic Ultrasound

1979 ◽  
Vol 1 (1) ◽  
pp. 89-100 ◽  
Author(s):  
R. D. Weglein
Keyword(s):  
Impedance Matching ◽  
Diagnostic Ultrasound ◽  
Wave Impedance ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Gray Scale ◽  
Acoustic Microscope ◽  
Quarter Wave ◽  
Scanning Acoustic Microscope ◽  
Single Material

The principle of a true acoustic gray scale standard is presented and experimentally applied to the Scanning Acoustic Microscope (SAM). The implementation is based on the impedance matching property of a quarter wave impedance transformer through which precise changes in reflection coefficient may be produced in a single material. The performance of the first implementation designed for 375 MHz operation is described and the implications of its use are discussed in detail. The application of the principle to diagnostic ultrasound is also treated.

Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy

1996 ◽  
Author(s):  
O. Diaz de Leon ◽  
M. Nassirian ◽  
C. Todd ◽  
R. Chowdhury
Keyword(s):  
Failure Analysis ◽  
Large Scale ◽  
Flip Chip ◽  
Ultrasonic Waves ◽  
Acoustic Microscopy ◽  
Acoustic Microscope ◽  
Chip Technology ◽  
Ball Joints ◽  
Non Destructive ◽  
Scanning Acoustic Microscope

Abstract Integration of circuits on semiconductor devices with resulting increase in pin counts is driving the need for improvements in packaging for functionality and reliability. One solution to this demand is the Flip- Chip concept in Ultra Large Scale Integration (ULSI) applications [1]. The flip-chip technology is based on the direct attach principle of die to substrate interconnection.. The absence of bondwires clearly enables packages to become more slim and compact, and also provides higher pin counts and higher-speeds [2]. However, due to its construction, with inherent hidden structures the Flip-Chip technology presents a challenge for non-destructive Failure Analysis (F/A). The scanning acoustic microscope (SAM) has recently emerged as a valuable evaluation tool for this purpose [3]. C-mode scanning acoustic microscope (C-SAM), has the ability to demonstrate non-destructive package analysis while imaging the internal features of this package. Ultrasonic waves are very sensitive, particularly when they encounter density variations at surfaces, e.g. variations such as voids or delaminations similar to air gaps. These two anomalies are common to flip-chips. The primary issue with this package technology is the non-uniformity of the die attach through solder ball joints and epoxy underfill. The ball joints also present defects as open contacts, voids or cracks. In our acoustic microscopy study packages with known defects are considered. It includes C-SCAN analysis giving top views at a particular package interface and a B-SCAN analysis that provides cross-sectional views at a desired point of interest. The cross-section analysis capability gives confidence to the failure analyst in obtaining information from a failing area without physically sectioning the sample and destroying its electrical integrity. Our results presented here prove that appropriate selection of acoustic scanning modes and frequency parameters leads to good reliable correlation between the physical defects in the devices and the information given by the acoustic microscope.

scholarly journals Use of Ultrasound Microscopy for Ex Vivo Analysis of Acoustic Impedance in Mouse Liver with Steatohepatitis

Acoustics ◽  
2020 ◽  
Vol 3 (1) ◽  
pp. 3-10
Author(s):  
Hideki Kumagai ◽  
Kazuto Kobayashi ◽  
Sachiko Yoshida ◽  
Koji Yokoyama ◽  
Norio Hirota ◽  
...  
Keyword(s):  
Acoustic Impedance ◽  
Ex Vivo ◽  
Acoustic Microscopy ◽  
Control Group ◽  
Scanning Acoustic Microscopy ◽  
Central Frequency ◽  
Deficient Diet ◽  
Acoustic Images ◽  
Ultrasound Microscopy

Scanning acoustic microscopy reveals information on histology and acoustic impedance through tissues. The objective of the present study was to investigate whether acoustic impedance values in the liver over time reflect the progression of steatohepatitis through different grades and stages, and whether this approach can visualize histologic features of the disease. Mice were divided into two groups: a control group and a steatohepatitis group prepared by keeping the mice on a methionine and choline-deficient diet for 56 weeks. The hepatic lobe was excised for measurement of impedance and observation of microscopic structure using a commercially available scanning acoustic microscopy system with a central frequency of 320 MHz. Scanning acoustic microscopy revealed that acoustic impedance through liver tissue with steatohepatitis temporarily decreased with the degree of fat deposition and then increased in parallel with the progression of inflammation and fibrosis. However, the acoustic images obtained did not allow discrimination of detailed microstructures from those seen using light microscopy. In conclusion, estimation of acoustic impedance appears to have potential clinical applications, such as for monitoring or follow-up studies.

Effects of the Cooling Rate on the Acoustic Properties of Pb-10Sn Solder

2012 ◽  
Vol 729 ◽  
pp. 356-360
Author(s):  
Endre Harkai ◽  
Tamás Hurtony ◽  
Péter Gordon
Keyword(s):  
Sound Velocity ◽  
Cooling Rate ◽  
Acoustic Microscopy ◽  
Acoustic Properties ◽  
Scanning Acoustic Microscopy ◽  
Cooling Rates ◽  
Reliability Parameters ◽  
Microscopy Characterization ◽  
The Given

Microhardness and sound velocity were measured in case of differently prepared solder samples. The used Pb-10Sn solder samples were melted then cooled down applying different cooling rates. These procedures caused variant microstructure thus different microhardness and sound velocity values. The sound velocity was measured by means of scanning acoustic microscopy. Characterization of solder materials by acoustic microscopy gives the possibility to non-destructively estimate mechanical and reliability parameters of the given material.

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