Low and High Temperature Isothermal Aging Effect on Morphology and Diffusion Kinetics of Intermetallic Compound (IMC) for Sn-Cu-Si3N4 Composite Solder

2013 ◽  
Vol 594-595 ◽  
pp. 666-670
Author(s):  
Saud Norainiza ◽  
S.I. Najib ◽  
M.A.A. Mohd Salleh
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Aging Temperature ◽  
Composite Solder ◽  
Aging Effect ◽  
Cu6sn5 Phase ◽  
High Aging Temperature ◽  
Reliability Of Solder Joints ◽  
Kinetics Of ◽  
And Diffusion

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si3N4composite solder to observe the intermetallic compound (IMC) growth during low and high temperature aging. 50°C and 150°C represent low and high aging temperature respectively. Various isothermal of aging times were carried out by using 24hrs, 240hrs and 720hrs. The IMC thickness increases with increasing of aging temperature and time. Cu6Sn5 phase appear at low aging temperature whilst Cu6Sn5together with Cu3Sn phases has been observed at high aging temperature. The growth kinetics for low and high aging temperature is 1.63x10-18μm2/s and 2.75 x10-18μm2/s.

Effect of Aging Time towards Intermetallic Compound (IMC) Growth Kinetics Formation for Sn-0.7Cu-Si3N4 Composite Solder on Copper Substrate

2013 ◽  
Vol 795 ◽  
pp. 505-508 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Diffusion Coefficient ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Growth Kinetics ◽  
Aging Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Intermetallic Growth ◽  
Reliability Of Solder Joints ◽  
Electronic Assemblies

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.

Effect of Aging Temperature on the Intermetallic Compound (IMC) Formation of Sn-0.7Cu/Si3N4 Composite Solder

2013 ◽  
Vol 795 ◽  
pp. 522-525 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Intermetallic Compound ◽  
Aging Temperature ◽  
Electronic Packaging ◽  
Isothermal Aging ◽  
Aging Process ◽  
Composite Solder ◽  
Intermetallic Formation ◽  
Imcs Growth ◽  
Packaging Industry ◽  
Growth Formation

Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.

scholarly journals Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

2018 ◽  
Vol 2018 ◽  
pp. 1-6
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji ◽  
Yusuke Nakata
Keyword(s):  
Growth Kinetics ◽  
Aging Temperature ◽  
Solder Joints ◽  
High Reliability ◽  
Power Cycles ◽  
Power Cycle ◽  
Cycling Test ◽  
Power Cycling ◽  
Reliability Of Solder Joints ◽  
Kinetics Of

Power cycle reliability of solder joints with Sn-5Sb (mass%) and Sn-10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn-Sb alloys and Cu plates were also investigated. In the power cycling test, the solder joint with Sn-10Sb has high reliability compared with that of Sn-5Sb. IMC layers grew in both joints with increasing number of power cycles. Compared with Sn-5Sb and Sn-10Sb, difference in growth kinetics of IMC layers was negligible. A similar tendency was observed in the heat aging test. Compared with the power cycling and the heat aging, growth of IMC layers at the aging temperature of 200°C is faster than that in the power cycling test at the temperature range of 100°C to 200°C, while that at the aging temperature of 100°C, the growth is slower. On the basis of the comparison between the power cycling and the heat aging, it was clarified that growth kinetics of IMC layers in the power cycling can be predicted by investigating growth kinetics of the IMC layer at the temperatures in the vicinity of the peak temperature in power cycling.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

High-temperature oxidation and diffusion behaviours of YG6X and Inconel625

2019 ◽  
Vol 546 (1) ◽  
pp. 137-147
Author(s):  
Erliang Liu ◽  
Xudong Wei ◽  
Mingming Wang ◽  
Tengda Wang
Keyword(s):  
High Temperature ◽  
High Temperature Oxidation ◽  
Temperature Oxidation ◽  
And Diffusion

scholarly journals Greener Solution to Waste Corn Stalks and Shortage of Asphalt Resource: Hydrochar Produced by Hydrothermal Carbonization as a Novel Performance Enhancer for Asphalt Binder

Materials ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1427
Author(s):  
Xiaoming Wu ◽  
Chichun Hu
Keyword(s):  
High Temperature ◽  
Reaction Temperature ◽  
Storage Stability ◽  
Asphalt Binder ◽  
Aging Effect ◽  
Experimental Tests ◽  
Hydrothermal Carbonization ◽  
Modified Asphalt ◽  
Direct Combustion ◽  
Aging Property

Utilization of waste corn stalks (CS) has seized extensive attention due to high annual output and hazardous impact of piling aside or direct combustion on environment. However, previously there has been a lot of emphasis on improvement of its energy efficiency as solid fuel while limited investigations are available which explore the possibility of applying corn stalks as performance enhancer in asphalt binder. The purpose of this study is to examine the potential of employing hydrochar as modifiers in asphalt binder by a series of experimental tests. In this study, two hydrochar were produced from corn stalks by a novel process called hydrothermal carbonization at a different reaction temperature. The two hydrochar and their responding hydrochar-modified asphalt (HCMA) were tested by chemical and rheological tests. Chemical analysis detected the interaction between hydrochar and binder factions, resulting in poor compatibility but satisfying anti-aging property. Even though hydrochar increased the viscosity of bitumen, implying worse workability, and caused poor storage stability, ameliorated performance of asphalt binder at high temperature by incorporating hydrochar was verified by various criteria such as higher performance grade (PG) failure temperature and lower non-recoverable creep compliance (Jnr). Moreover, higher reaction temperature makes hydrochar’s particles smaller and more homogeneous, which results in slightly lower enhanced high temperature performance, more satisfying workability, better storage stability, and greater anti-aging effect of hydrochar-modified asphalt. Eventually, this study provided a promising win-win solution to environment problems concerning corn stalk treatment and shortage of asphalt binder. Further exploration of methods to improve HCMA’s storage stability, real-scale corroboration on trial section and life cycle assessment of asphalt pavement containing hydrochar modifiers will be followed in the future.

scholarly journals Biosorption and Diffusion Modeling of Pb(II) by Malt Bagasse

2016 ◽  
Vol 2016 ◽  
pp. 1-11 ◽  
Author(s):  
Klaiani B. Fontana ◽  
Giane Gonçalves Lenzi ◽  
Erica R. L. R. Watanabe ◽  
Ervin Kaminski Lenzi ◽  
Juliana A. M. T. Pietrobelli ◽  
...  
Keyword(s):  
Sorption Process ◽  
Isotherm Models ◽  
Diffusion Modeling ◽  
Biosorption Capacity ◽  
Kinetic And Thermodynamic Parameters ◽  
Pseudo Second Order ◽  
Ph Optimization ◽  
Kinetics Of ◽  
And Diffusion

The removal of Pb(II) from water by biosorption processes onto malt bagasse was investigated and the kinetic and thermodynamic parameters were obtained; additionally a diffusion modeling was proposed. The characterization of malt bagasse was performed by FTIR and SEM/EDS. The experiments were conducted in batch system and an experimental design based response surface methodology was applied for agitation speed and pH optimization. The kinetics of biosorption followed pseudo-second-order model and the temperature of the process affected the biosorption capacity. Isotherm models of Langmuir, Freundlich, and Elovich were applied and the Langmuir model showed better fit and the estimated biosorption capacity was 29.1 mg g−1. The negative values obtained for ΔG° and positive values of ΔH° confirm, respectively, the spontaneous and endothermic nature of the process. The diffusion modeling was performed based on experiments in the absence of agitation to investigate the influence of the biosorbent on the sorption process of Pb(II) ions.

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