Noise Analysis of Silicon Microgyroscope's Transimpedance Amplifier Interface Circuit

2015 ◽  
Vol 645-646 ◽  
pp. 624-629
Author(s):  
Wei Feng Tang ◽  
An Ping Qiu ◽  
Guo Ming Xia ◽  
Yan Su

The output-current of silicon microgyroscope is at the level of 10-7A. So the requirements for circuits’ SNR are very high. This paper proposes a method to improve transimpedance amplifier interface circuit’s SNR. First of all, the operating principles of silicon microgyroscope and transimpedance amplifier interface circuit are introduced. Secondly, resistor thermal noise, amplifier’s current and voltage noise are analyzed. Then noise density in a certain frequency range is calculated based on Matlab. Besides, a method to improve SNR is proposed, namely, increasing the value of DC offset resistance. Finally, simulation based on Cadence is operated to verify the method. Simulation results fit well with the theoretical analysis. That means the method to improve the SNR is feasible.

Sensors ◽  
2020 ◽  
Vol 20 (4) ◽  
pp. 1238 ◽  
Author(s):  
Mingyuan Ren ◽  
Honghai Xu ◽  
Xiaowei Han ◽  
Changchun Dong ◽  
Xuebin Lu

A low noise interface ASIC for micro gyroscope with ball-disc rotor is realized in 0.5µm CMOS technology. The interface circuit utilizes a transimpedance pre-amplifier which reduces input noise. The proposed interface achieves 0.003°/s/Hz1/2 noise density and 0.003°/s sensitivity with ±100°/s measure range. The functionality of the full circuit, including circuit analysis, noise analysis and measurement results, has been demonstrated.


Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 3026
Author(s):  
Woo-Jae Kim ◽  
In-Young Bang ◽  
Ji-Hwan Kim ◽  
Yeon-Soo Park ◽  
Hee-Tae Kwon ◽  
...  

The use of NF3 is significantly increasing every year. However, NF3 is a greenhouse gas with a very high global warming potential. Therefore, the development of a material to replace NF3 is required. F3NO is considered a potential replacement to NF3. In this study, the characteristics and cleaning performance of the F3NO plasma to replace the greenhouse gas NF3 were examined. Etching of SiO2 thin films was performed, the DC offset of the plasma of both gases (i.e., NF3 and F3NO) was analyzed, and a residual gas analysis was performed. Based on the analysis results, the characteristics of the F3NO plasma were studied, and the SiO2 etch rates of the NF3 and F3NO plasmas were compared. The results show that the etch rates of the two gases have a difference of 95% on average, and therefore, the cleaning performance of the F3NO plasma was demonstrated, and the potential benefit of replacing NF3 with F3NO was confirmed.


Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1033
Author(s):  
Alessandro Nastro ◽  
Andrea De Marcellis ◽  
Marco Ferrari ◽  
Vittorio Ferrari

A Current-Mode (CM) TransImpedance Amplifier (TIA) based on Second Generation Current Conveyors (CCIIs) for capacitive microsensor measurements is presented. The designed electronic interface performs a capacitance-to-voltage conversion using 3 CCIIs and 3 resistors exploiting a synchronous-demodulation technique to improve the overall detection sensitivity and resolution of the system. A CM-TIA solution designed at transistor level in AMS0.35 µm integrated CMOS technology with a power consumption lower than 900 µW is proposed. Experimental results obtained with a board-level prototype show linear behavior of the proposed interface circuit with a resolution up to 34.5 fF and a sensitivity up to 223 mV/nF, confirming the theoretical expectations.


1991 ◽  
Vol 131 ◽  
pp. 354-357
Author(s):  
Ann E. Wehrle ◽  
Stephen C. Unwin

AbstractMost VLBI images have low dynamic range because they are limited by instrumental effects such as calibration errors and poor u, v-coverage. We outline the method used to make a new image of the bright quasar 3C345 which has very high dynamic range (peak-to-noise of 5000:1) and which is limited by the thermal noise, not instrumental errors. Both the Caltech VLBI package and the NRAO AIPS package were required to manipulate the data.


2018 ◽  
Vol 5 (2) ◽  
pp. 39 ◽  
Author(s):  
Syifaul Fuada ◽  
Trio Adiono

 The development of educational kit must be compiled on how to prepare undergraduate students in the engineering field in following the new trends globally and becoming an alternative to the technical education system based on practical approach. The primary motivation for this research is to design and implement the visible light communications (VLC) educational toolkit, especially in the analog front-end part. It consisted of six kits (transimpedance amplifier, pre-amplifier, DC-offset remover, analog filter, and AGC) in which each kit has one practicum task. There are six tasks and one task for the project by integrating these kits. The undergraduate students can use this educational kit to investigate the physical layer in a VLC system. It provides a low-complexity educational kit, so this is becoming an alternative as supplement course offered in this field. Then, it has a simple design and user-friendly. The development of educational kit must be compiled on how to prepare undergraduate students in the engineering field in following the new trends globally and becoming an alternative to the technical education system based on practical approach. The primary motivation for this research is to design and implement the visible light communications (VLC) educational toolkit, especially in the analog front-end part. It consisted of six kits (transimpedance amplifier, pre-amplifier, DC-offset remover, analog filter, and AGC) in which each kit has one practicum task. There are six tasks and one task for the project by integrating these kits. The undergraduate students can use this educational kit to investigate the physical layer in a VLC system. It provides a low-complexity educational kit, so this is becoming an alternative as supplement course offered in this field. Then, it has a simple design and user-friendly.


2014 ◽  
Vol 24 (01) ◽  
pp. 1550010 ◽  
Author(s):  
Jack Ou ◽  
Pietro M. Ferreira

We present an unified explanation of the transconductance-to-drain current (gm/ID)-based noise analysis in this paper. We show that both thermal noise coefficient (γ) and device noise corner frequency (f co ) are dependent on the gm/ID of a transistor. We derive expressions to demonstrate the relationship between the normalized noise power spectral density technique and the technique based on γ and f co . We conclude this letter with examples to demonstrate the practical implication of our study. Our results show that while both techniques discussed in this letter can be used to compute noise numerically, using γ and f co to separate thermal noise from flicker noise provides additional insight for optimizing noise.


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