A Study on the Thermal Conductivity of Thermal Grease According to Cu-Ni Content

2021 ◽  
Vol 880 ◽  
pp. 71-76
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Sunghoon Im ◽  
Jinho Yang ◽  
Sunchul Huh
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Electronic Device ◽  
Thermal Contact ◽  
Thermal Characteristics ◽  
Internal Heat ◽  
Thermal Interface Material ◽  
Thermal Grease

An increase in power consumption density is related to the internal thermal characteristics of an electronic device, and the heat dissipation of the device is directly related to the high performance and miniaturization of the device. TIM (thermal interface material) with excellent internal heat dissipation performance are mainly used to improve the heat dissipation performance of electronic devices. Recently, the need for a high-efficiency TIM with high-performance thermal conductivity and low thermal contact resistance has increased. In this study, thermal grease was prepared by mixing Cu-Ni nanopowders with silicon oil, the thermal grease was then used as a heat transfer material. Compared to silicone thermal grease, the thermal conductivity of all prepared samples was excellent. In particularly, thermal conductivity was improved by about maximum 212% compared to that of thermal silicone of thermal grease mixed with Cu-Ni powder.

Thermal Contact Resistance of Phase Change and Grease Type Polymeric Materials

2000 ◽  
Author(s):  
Ravi S. Prasher ◽  
Craig Simmons ◽  
Gary Solbrekken
Keyword(s):  
Thermal Conductivity ◽  
Contact Resistance ◽  
Phase Change ◽  
High Performance ◽  
Phase Change Materials ◽  
Thermal Contact ◽  
Polymeric Materials ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Thermal Grease

Abstract Thermal interface material (TIM) between the die and the heat spreader or between the heat spreader and the heat sink in any electronic package plays a very important role in the thermal management of electronic cooling. Due to increased power and power density high-performance TIMs are sought every day. Phase change materials (PCM) seem to be very good alternative to traditionally used thermal greases because of various reasons. These phase change materials also have the advantage of being reworked easily without damaging the die. Typically these phase change materials are polymer based and are particle laden to enhance their thermal conductivity. The thermal conductivity of these materials is relatively well understood than their contact resistance. Current work focuses on explicitly measuring the contact resistance and the thermal conductivity of a particular phase change TIM and some silicon-based greases. Effect of various parameters, which can affect the contact resistance of theses TIMs and Greases, are also captured. The steady state measurements of the thermal conductivity and the contact resistance was done on an interface tester. In general the work on the contact resistance of fluid-like polymer based TIM, such as thermal grease or phase change polymer has been experimental in the past. A semi-analytical model, which captures the various parameters affecting the contact resistance of two class of materials; the phase change and the thermal grease is also developed in this paper. This model fits very well with the experimental data.

scholarly journals Application of Graphene Silicone Grease in heat dissipation for the Intel Core i5 Processor

2019 ◽  
Vol 3 (2-2) ◽  
Author(s):  
Phuong Thi Mai ◽  
Tuan Anh Bui ◽  
Hau Van Tran ◽  
Trinh Van Pham ◽  
Dinh Nang Nguyen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Saturation Temperature ◽  
High Energy ◽  
Thermal Interface Material ◽  
Thermal Dissipation ◽  
Single Layer Graphene ◽  
Silicone Grease ◽  
Uniform Dispersion ◽  
Thermal Grease

Graphene was known as the material that owning many superiority properties and high thermal conductivity. Thermal conductivity of single-layer graphene was up to 5200 W/mK (compared to the thermal conductivity of Carbon nanotubes 2000 W/mK and Silver 410 W/mK). This had suggested that graphene is the most potential material for heat dissipation applications for electronic devices, such as a computer microprocessor, high power LED... To enhance the dispersion of the GNPs silicone matrix, we were functionalized graphene nanoplatelets (GNPs) with carboxyl (-COOH) groups. The silicone thermal greases containing GNPs were prepared by High- Energy Ball Milling method (8000D Mixer /Mill). The results of SEM, FTIR, Raman showed the presence of the carboxyl groups in GNPs and GNPs uniform dispersion dispersed in grease. The results of thermal conductivity from Transient Hot Bridge THB-100 showed that thermal conductivity enhancement was up to 234 % with Gr-COOH 1.0 vol.%. Thermal grease is used as a thermal interface material to coolants for Intel Core i5 processor. The results of thermal dissipation efficiency shown the saturation temperature of the processor using thermal grease containing 1.0 vol.% Gr-COOH decreased 4℃, compared to the silicone grease.

scholarly journals Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1893 ◽  
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Jihye An ◽  
Siyeon Choi ◽  
Jinho Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Internal Heat ◽  
Upward Trend ◽  
Heat Transfer Medium ◽  
Conductive Materials ◽  
Increasing Trend ◽  
Thermal Grease

As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m·k over the silicon base, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

2016 ◽  
Vol 139 (1) ◽  
Author(s):  
Ronald J. Warzoha ◽  
Andrew N. Smith ◽  
Maurice Harris
Keyword(s):  
Steady State ◽  
Thermal Resistance ◽  
High Performance ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Interfacial Thermal Resistance ◽  
Uniform Heat Flux ◽  
Thermal Probe ◽  
Thermal Interface

Thermal interface materials (TIMs) constitute a critical component for heat dissipation in electronic packaging systems. However, the extent to which a conventional steady-state thermal characterization apparatus can resolve the interfacial thermal resistance across current high-performance interfaces (RT < 1 mm2⋅K/W) is not clear. In this work, we quantify the minimum value of RT that can be measured with this instrument. We find that in order to increase the resolution of the measurement, the thermal resistance through the instrument's reference bars must be minimized relative to RT. This is practically achieved by reducing reference bar length. However, we purport that the minimization of reference bar length is limited by the effects of thermal probe intrusion along the primary measurement pathway. Using numerical simulations, we find that the characteristics of the probes and surrounding filler material can significantly impact the measurement of temperature along each reference bar. Moreover, we find that probes must be spaced 15 diameters apart to maintain a uniform heat flux at the interface, which limits the number of thermal probes that can be used for a given reference bar length. Within practical constraints, the minimum thermal resistance that can be measured with an ideal instrument is found to be 3 mm2⋅K/W. To verify these results, the thermal resistance across an indium heat spring material with an expected thermal contact resistance of ∼1 mm2⋅K/W is experimentally measured and found to differ by more than 100% when compared to manufacturer-reported values.

Thermal Conductivity of Diamond-Containing Grease

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Hung-En Chou ◽  
Shang-Ray Yang ◽  
Sea-Fue Wang ◽  
James C. Sung
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
Terminal Group ◽  
Thermal Interface Material ◽  
Particle Sizes ◽  
Thermal Interface ◽  
Thermal Grease ◽  
Single Filler

As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, researches on diamond-containing TGs remain rare. In this study, four kinds of TGs in which diamond served as essential filler were prepared and hot disk technique was applied to measure their thermal conductivity k(TG). After two unoverlapped particle sizes were selected, the volumetric filler content, terminal group, and viscosity of a polydimethylsiloxane (PDMS) matrix were modified in sequence. Based on the preferred recipe of a single-filler TG, two double-filler TG series were prepared by retaining the large diamonds and replacing the small ones by Al2O3 or ZnO, respectively. Depending on the content, it was found that diamond was not always the best choice for small filler. The highest k(TG), which was 23 times greater than the original k(PDMS), appeared in a ZnO-containing double-filler grease (=3.52 W/mK). The prediction for the maximum attainable thermal conductivity was preliminarily supported.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

Development of High Thermally Conductive Die Attach for TIM Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000312-000315
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride

2018 ◽  
Vol 38 (8) ◽  
pp. 767-774 ◽  
Author(s):  
Liang Wang ◽  
Luchong Zhang ◽  
Andreas Fischer ◽  
Yuhua Zhong ◽  
Dietmar Drummer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Flame Retardant ◽  
Flame Retardancy ◽  
High Performance ◽  
Heat Dissipation ◽  
Hexagonal Boron Nitride ◽  
Light Emitting Diode ◽  
Polyamide 6 ◽  
Twin Screw

Abstract High performance composite of polyamide 6 (PA6)/flame retardant (FR)/hexagonal boron nitride (hBN) was prepared via twin screw extrusion, followed by injection molding. The heat dissipation of the composite was significantly improved by incorporating 40 vol% of hBN, and the corresponding thermal conductivity was up to 5.701 W/(m·K), nearly 17 times that of the PA6/FR composites. In addition, the combination effect of hBN and FR to the flame retardancy of the composites was observed, and the addition of hBN could dramatically enhance the flame retardancy of composites, achieving a UL94 V-0 rating with a limited oxygen index (LOI) value of 37%. This multifunctional modification would broaden the application field of PA6 composites in light-emitting diode (LED) lamps, electronic products, and so on.

scholarly journals SIMULATION OF HEAT EXCHANGE IN A MULTILAYER FLAT STRUCTURE UNDER PERFECT THERMAL CONTACT IN FIRE CONDITIONS

Fire Safety ◽  
2020 ◽  
Vol 36 ◽  
pp. 115-120
Author(s):  
R. Tatsii ◽  
M. Stasiuk ◽  
O. Pazen
Keyword(s):  
Thermal Conductivity ◽  
Heat Exchange ◽  
Thermal Contact ◽  
Internal Heat ◽  
Nonstationary Temperature ◽  
Heat Sources ◽  
Conductivity Equation ◽  
Flat Structure ◽  
Temperature Changes ◽  
Internal Heat Sources

The proposed work is devoted to the application of the direct method to the study of heat transfer processes in a multilayer flat structure. It is assumed that each layer is made of isotropic material of different thickness. There is an imperfect thermal contact between them, and the layers have internal heat sources. In this case, the isothermal surfaces are parallel planes, i.e the temperature changes in only one direction. On the outer surfaces of the structure there is a convective heat exchange with the environment, i.e the boundary conditions of the third kind are fulfilled. The coefficients of the thermal conductivity equation are considered to be piecewise constant with respect to the spatial coordinate. This is the first time the problem has been solved in this setting. The solution of the problem is realized by applying the method of reduction using the concept of quasi-derivatives and applying the theory of systems of differential equations with impulse action. The following is the procedure for separating Fourier variables using a modified method of eigenfunctions.Based on the physical content of the problem, the differential equation of thermal conductivity was written in the Cartesian coordinate system, but the solution scheme presented here without any fundamental difficulties extends to similar problems for multilayer bodies of basic geometric shapes by switching to appropriate coordinate systems. To illustrate the proposed method, a model example of finding the distribution of a nonstationary temperature field in a seven-layer flat structure under the influence of the hydrocarbon temperature of the fire is solved. The condition of ideal or non-ideal thermal contact is fulfilled between two adjacent layers. In addition, some layers have internal heat sources. The results of the calculations are presented in the form of a graph of temperature changes depending on timeand spatial coordinates.

Sign in / Sign up

Export Citation Format

Share Document