Impact of CF4 Plasma Treatment on the Surface Roughness of Ion Implanted SiC Induced by High Temperature Annealing

2010 ◽  
Vol 645-648 ◽  
pp. 783-786
Author(s):  
Tatsunori Sugimoto ◽  
Masataka Satoh ◽  
Tohru Nakamura ◽  
K. Mashimo ◽  
Hiroshi Doi ◽  
...  
Keyword(s):  
Surface Roughness ◽  
High Temperature ◽  
Energy Range ◽  
Plasma Treatment ◽  
Surface Roughening ◽  
High Temperature Annealing ◽  
Small Surface ◽  
Step Structure ◽  
The Impact ◽  
Ion Implanted

The impact of CF4 plasma treatment on the surface roughening of SiC has been investigated for N ion implanted SiC(0001) which is implanted with the energy range from 15 to 120 keV at a dose of 9.2 x 1014/cm2. The N ion implanted sample, which is processed by CF4 plasma, shows small surface roughness of 1.6 nm after annealing at 1700 oC for 10 min, while the sample without CF4 plasma treatment shows the large surface roughness (6.6nm) and micro step structure. XPS measurements reveals that CF4 plasma treatment is effective to dissolved the residual oxide on the surface of SiC which is not removed by BHF acid of SiO2 layer on SiC. It is strongly suggested that the formation of micro step structure with the increase of the surface roughness is promoted by the residual oxide such as SiCOx, on SiC.

Suppression of SiC surface roughening during high-temperature annealing by atmospheric control using purified Ar gas

2010 ◽  
Vol 25 (4) ◽  
pp. 708-710 ◽  
Author(s):  
Atsushi Ogura ◽  
Daisuke Kosemura ◽  
Shingo Kinoshita
Keyword(s):  
Surface Roughness ◽  
High Temperature ◽  
Surface Roughening ◽  
Annealing Atmosphere ◽  
High Temperature Annealing ◽  
Force Microscopy ◽  
Atomic Force ◽  
Before And After ◽  
Furnace Tube ◽  
Ar Gas

4H-silicon carbide (SiC) wafers were annealed at 1300 and 1600 °C for 30 min and 60 min in a conventional and purified Ar atmosphere. The surface roughness before and after annealing was evaluated by atomic force microscopy. The surface roughness before annealing was approximately 2.37 nm in root mean square. The roughness, after annealing for 30 min at 1300 and 1600 °C in a conventional Ar furnace, was increased to 4.53 and 14.9 nm, respectively. The roughness, after annealing for 60 min, was 5.01 and 19.1 nm, respectively. In this study, the G3 grade Ar gas (99.999%) was supplied in the conventional furnace tube. When the Ar gas was purified to an impurity concentration of less than 1 ppb, and it was supplied in the leak-tight furnace tube, the roughness after 30-min annealing improved 4.27 and 6.93 nm at 1300 and 1600 °C, respectively. The roughness after 60-min annealing was also reduced to 3.54 and 9.28 nm, respectively. We assume that a significant reduction of H2O concentration in the annealing atmosphere might play an important role in suppressing surface roughening of SiC during high-temperature annealing.

Graphene Grown on Ion-Implanted 4H-SiC and an Effect of Pre-Plasma Treatment

2014 ◽  
Vol 1693 ◽  
Author(s):  
Toru Sugimachi ◽  
Yusuke Shiina ◽  
Daiki Aoyagi ◽  
Tomoaki Nishimura ◽  
Tohru Nakamura
Keyword(s):  
Surface Roughness ◽  
Ion Implantation ◽  
Plasma Treatment ◽  
Gas Flow ◽  
Graphene Film ◽  
Small Surface ◽  
The One ◽  
Ar Gas ◽  
P Type ◽  
Ion Implanted

ABSTRACT4H-SiC substrates were annealed at 1500 °C for 30 min in 0.01 MPa Ar gas flow to make a graphene film. To clarify the effect of Al ion implantation and pre-plasma treatment, the graphene was fabricated on four different kinds of SiC substrates: without plasma treatment, with plasma treatment, Al ion-implanted without plasma treatment and Al ion-implanted with plasma treatment. The graphene films were analyzed by AFM and Raman spectroscopy. The Al ion implanted sample, which was then processed by CF4 plasma, showed small surface roughness of 3.49 nm (RMS), while the sample without CF4 plasma treatment showed large surface roughness of 8.41nm. Similar results were also observed for SiC samples without Al ion implantation. In Raman spectra, strong D-band, G-band and 2D-band signals were detected on both ion-implanted samples after annealing at 1500 °C, but weak D-band were observed on both samples without Al ion implantation. Raman mapping (2D-FWHM) showed that the graphene on ion-implanted SiC treated with CF4 plasma was more homogeneous than the one without CF4 plasma treatment. Hall measurements for SiC without Al ion implantation showed that graphene on SiC treated with CF4 plasma has higher mobility (389 cm2/Vs) than that without plasma treatment (136 cm2/Vs). Additionally, p-type graphene can be fabricated on Al ion-implanted SiC by CF4 plasma treatment.

Submicron surface roughening of aliphatic polyamide 6,6 fabric through low temperature plasma and its effect on interfacial bonding in rubber composite

2017 ◽  
Vol 47 (8) ◽  
pp. 2029-2049 ◽  
Author(s):  
Siddhan Periyasamy ◽  
Krishna Prasad G ◽  
Raja ASM ◽  
Prashant G Patil
Keyword(s):  
Surface Roughness ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Plasma Treatment ◽  
Treatment Time ◽  
Surface Roughening ◽  
Temperature Plasma ◽  
Nylon 6,6 ◽  
Rubber Composite ◽  
Scanning Electron

The present study aims to produce submicron surface roughening of aliphatic polyamide 6,6 (nylon 6,6) fabric using dielectric barrier discharge-based atmospheric low temperature plasma for improving the adhesion bonding with rubber. The plasma treatment was done in the time ranging from 15 s to 300 s. Formation of surface roughness on the fabric due to plasma treatment and the associated chemical changes were studied through high-resolution scanning electron microscope, geometrical surface roughness by Kawabata evaluation system surface tester, contact angle measurements and Fourier transform infrared in Attenuated total reflectance mode. Scanning electron microscope micrographs revealed the presence of submicron roughness on the nylon 6,6 fibre surface with pores of around 100 nm (0.1 µm) for the optimum treatment time of 180 s above which the pore merging effect dominated resulting in the net low surface roughness. Geometrical roughness (SMD) results were also well in agreement with the scanning electron microscope results for the roughening and the optimum effect of the plasma treatment. The control and plasma treated nylon 6,6 samples were used as reinforcements for rubber composite. The peel strength of the rubber composite, which is a measure of interfacial bonding, increased to 150% as the maximum for the optimum plasma treatment time of 180 s. Intense rubber deposits over the 180 s plasma treated samples were observed while only a few deposits of rubber were observed on the control fabric when their interfaces were examined through scanning electron microscope after peeling test.

Correlation Study of Morphology, Electrical Activation and Contact formation of Ion Implanted 4H-SiC

2009 ◽  
Vol 156-158 ◽  
pp. 493-498
Author(s):  
Ming Hung Weng ◽  
Fabrizio Roccaforte ◽  
Filippo Giannazzo ◽  
Salvatore di Franco ◽  
Corrado Bongiorno ◽  
...  
Keyword(s):  
High Temperature ◽  
Surface Morphology ◽  
Electrical Activation ◽  
Structural Defects ◽  
High Resistivity ◽  
Al Alloy ◽  
High Temperature Annealing ◽  
Capping Layer ◽  
P Type ◽  
Ion Implanted

This paper reports a detailed study of the electrical activation and the surface morphology of 4H-SiC implanted with different doping ions (P for n-type doping and Al for p-type doping) and annealed at high temperature (1650–1700 °C) under different surface conditions (with or without a graphite capping layer). The combined use of atomic force microscopy (AFM), transmission electron microscopy (TEM), and scanning capacitance microscopy (SCM) allowed to clarify the crucial role played by the implant damage both in evolution of 4H-SiC surface roughness and in the electrical activation of dopants after annealing. The high density of broken bonds by the implant makes surface atoms highly mobile and a peculiar step bunching on the surface is formed during high temperature annealing. This roughness can be minimized by using a capping layer. Furthermore, residual lattice defects or precipitates were found in high dose implanted layers even after high temperature annealing. Those defects adversely affect the electrical activation, especially in the case of Al implantation. Finally, the electrical properties of Ni and Ti/Al alloy contacts on n-type and p-type implanted regions of 4H-SiC were studied. Ohmic behavior was observed for contacts on the P implanted area, whilst high resistivity was obtained in the Al implanted layer. Results showed a correlation of the electrical behavior of contacts with surface morphology, electrical activation and structural defects in ion-implanted, particularly, Al doped layer of 4H-SiC.

The Behavior of Ion Implanted Silicon During Ultra-High Temperature Annealing

2006 ◽  
Vol 912 ◽  
Author(s):  
Amitabh Jain
Keyword(s):  
High Temperature ◽  
Time Scale ◽  
Short Time Scale ◽  
Successful Implementation ◽  
High Temperature Annealing ◽  
Promising Technique ◽  
Final Profile ◽  
Short Time ◽  
Ultra High Temperature ◽  
Ion Implanted

AbstractUltra-high temperature annealing is emerging as a promising technique for annealing ion implanted layers with a view to maximizing electrical activation while minimizing dopant diffusion. In order to ensure successful implementation, several materials-related problems have been under study. Since the time scale of the process is short, diffusion in the amorphous phase may dominate the final profile. In general, the residual disorder after anneal can be higher than with current anneal processes. However, the short time scale of the process curtails the opportunity for movement of dislocations into regions where the electrical behavior of a device would be affected. An additional effect of the limited time scale is the ability of silicon to plasto-elastically support the high strain-rates that may arise during the anneal.

Formation and Properties of Schottky Diodes on 4H-SiC after High Temperature Annealing with Graphite Encapsulation

2006 ◽  
Vol 527-529 ◽  
pp. 915-918 ◽  
Author(s):  
Y. Wang ◽  
M.K. Mikhov ◽  
B.J. Skromme
Keyword(s):  
High Temperature ◽  
Ideality Factor ◽  
Schottky Diodes ◽  
Extended Defects ◽  
High Temperature Annealing ◽  
Force Microscopy ◽  
Atomic Force ◽  
Current Voltage ◽  
Encapsulation Method ◽  
The Impact

The impact of high temperature annealing using graphite encapsulation (formed by baking photoresist) on the electrical properties of Ni Schottky diodes formed on the annealed surfaces is studied. The surface morphology is also characterized by atomic force microscopy (AFM). Annealing for 10 minutes at temperatures up to 1800 °C with graphite encapsulation actually reduces the high-current ideality factor of the diodes while raising the current-voltage barrier height (linearly extrapolated to unity ideality factor) from 1.453 V to 1.67-1.73 V. Excess leakage current occurs only in a subset of diodes, which are believed to be affected by extended defects. The AFM images show no significant surface roughening, and the graphite can be removed after processing. This encapsulation method is found to be highly effective in preserving the electronic properties of the surface during high temperature annealing.

On the Formation of Intrinsic Defects in 4H-SiC by High Temperature Annealing Steps

2012 ◽  
Vol 717-720 ◽  
pp. 247-250 ◽  
Author(s):  
Bernd Zippelius ◽  
Jun Suda ◽  
Tsunenobu Kimoto
Keyword(s):  
High Temperature ◽  
Carrier Lifetime ◽  
Growth Conditions ◽  
Device Fabrication ◽  
Defect Concentration ◽  
Epitaxial Layers ◽  
High Temperature Annealing ◽  
Intrinsic Defects ◽  
Initial Defect ◽  
The Impact

In this paper the impact of high temperature annealing on the formation of intrinsic defects in 4H-SiC such as Z1/2 and EH6/7 was examined. Therefore, three epitaxial layers with various initial concentrations of the Z1/2- and EH6/7-centers (1011 – 1013 cm-3) were investigated. It turns out that depending on the initial defect concentration the high temperature annealing leads to a monotone increase of the Z1/2- and EH6/7-concentration in a temperature range from 1600 to 1750°C. For a defined temperature above these values, the resulting defect concentration is independent of the sample’s initial values. Beside the growth conditions themselves such as C/Si ratio the thermal post-growth processing has a severe impact on the carrier lifetime which must be taken into account during device fabrication.

Trench Formation on Ion Implanted SiC Surfaces after Thermal Oxidation

2005 ◽  
Vol 483-485 ◽  
pp. 777-780 ◽  
Author(s):  
Wook Bahng ◽  
Geun Ho Song ◽  
Nam Kyun Kim ◽  
Sang Cheol Kim ◽  
Hyoung Wook Kim ◽  
...  
Keyword(s):  
Growth Rate ◽  
High Temperature ◽  
Ion Implantation ◽  
Doping Concentration ◽  
Side Wall ◽  
Surface Region ◽  
Surface Roughening ◽  
Oxide Growth ◽  
High Temperature Annealing ◽  
Thermal Oxide

The effects of the damage induced during ion implantation on the surface roughening and oxide growth rate were investigated. Using several scheme of doses and acceleration energies, it is found that the amount of the dose predominantly produce damage rather than the acceleration energy, especially near the surface region. It was also found that the damage affects not only the oxide growth rate but also the surface roughening during high temperature annealing. The edge of highly implanted area may have higher doping concentration due to the vicinal side wall effect of the thick oxide mask for ion implantation. It was confirmed by the trench formation after thermal oxide remove.

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