Piezoresistivity and Electrical Conductivity of SiC Thin Films Deposited by High Temperature PECVD

2013 ◽  
Vol 740-742 ◽  
pp. 657-660 ◽  
Author(s):  
Oleg Jakovlev ◽  
Tino Fuchs ◽  
Franziska Rohlfing ◽  
Helmut Seidel

We introduce a novel high temperature PECVD process and use it for the deposition of silicon carbide thin films on oxidized silicon wafers at 900°C substrate temperature. A variation of the atomic composition over a wide range is achieved by altering the flow ratio of the precursors silane (SiH4) and acetylene (C2H2). XPS analysis is performed to verify the silicon to carbon ratio in the deposited layers. The resistivity of the obtained thin films shows a strong dependence on the Si/C-ratio. Four point measurements show the resistivity ranging between 5•10-3Ωcm for C-rich layers and >107Ωcm for near stoichiometric layers. We investigate the piezoresistivity of the SiC layers at room temperature under compressive and tensile strain using the four point bending method. The same method is used to analyze selected layers at elevated temperatures up to 600°C. Based on the results we evaluate the applicability of the obtained thin films for strain transducing in harsh environment MEMS sensors.

Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.


Alloy Digest ◽  
1981 ◽  
Vol 30 (6) ◽  

Abstract FANSTEEL 85 METAL is a columbium-base alloy characterized by good fabricability at room temperature, good weldability and a good combination of creep strength and oxidation resistance at elevated temperatures. Its applications include missile and rocket components and many other high-temperature parts. This datasheet provides information on composition, physical properties, microstructure, hardness, elasticity, tensile properties, and bend strength as well as creep. It also includes information on low and high temperature performance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cb-7. Producer or source: Fansteel Metallurgical Corporation. Originally published December 1963, revised June 1981.


2013 ◽  
Vol 690-693 ◽  
pp. 1702-1706 ◽  
Author(s):  
Shuang Jun Nie ◽  
Hao Geng ◽  
Jun Bao Wang ◽  
Lai Sen Wang ◽  
Zhen Wei Wang ◽  
...  

NiZn-ferrite thin films were deposited onto silicon and glass substrates by radio frequency magnetron sputtering at room temperature. The effects of the relative oxygen flow ratio on the structure and magnetic properties of the thin films were investigated. The study results reveal that the films deposited under higher relative oxygen flow ratio show a better crystallinity. Static magnetic measurement results indicated that the saturation magnetization of the films was greatly affected by the crystallinity, grain dimension, and cation distribution in the NiZn-ferrite films. The NiZn-ferrite thin films with a maximum saturation magnetization of 151 emucm-3, which is about 40% of the bulk NiZn ferrite, was obtained under relative oxygen flow ratio of 60%.


Polymers ◽  
2020 ◽  
Vol 12 (5) ◽  
pp. 1000
Author(s):  
Guoxiao Xu ◽  
Juan Zou ◽  
Zhu Guo ◽  
Jing Li ◽  
Liying Ma ◽  
...  

Although sulfonic acid (SA)-based proton-exchange membranes (PEMs) dominate fuel cell applications at low temperature, while sulfonation on polymers would strongly decay the mechanical stability limit the applicable at elevated temperatures due to the strong dependence of proton conduction of SA on water. For the purpose of bifunctionally improving mechanical property and high-temperature performance, Nafion membrane, which is a commercial SA-based PEM, is composited with fabricated silica nanofibers with a three-dimensional network structure via electrospinning by considering the excellent water retention capacity of silica. The proton conductivity of the silica nanofiber–Nafion composite membrane at 110 °C is therefore almost doubled compared with that of a pristine Nafion membrane, while the mechanical stability of the composite Nafion membrane is enhanced by 44%. As a result, the fuel cell performance of the silica nanofiber-Nafion composite membrane measured at high temperature and low humidity is improved by 38%.


Author(s):  
Haiyang Fan ◽  
Yahui Liu ◽  
Shoufeng Yang

Ti–6Al–2Sn–4Zr–2Mo (Ti-6242), a near-[Formula: see text] titanium alloy explicitly designed for high-temperature applications, consists of a martensitic structure after selective laser melting (SLM). However, martensite is thermally unstable and thus adverse to the long-term service at high temperatures. Hence, understanding martensite decomposition is a high priority for seeking post-heat treatment for SLMed Ti-6242. Besides, compared to the room-temperature titanium alloys like Ti–6Al–4V, aging treatment is indispensable to high-temperature near-[Formula: see text] titanium alloys so that their microstructures and mechanical properties are pre-stabilized before working at elevated temperatures. Therefore, the aging response of the material is another concern of this study. To elaborate the two concerns, SLMed Ti-6242 was first isothermally annealed at 650[Formula: see text]C and then water-quenched to room temperature, followed by standard aging at 595[Formula: see text]C. The microstructure analysis revealed a temperature-dependent martensite decomposition, which proceeded sluggishly at [Formula: see text]C despite a long duration but rapidly transformed into lamellar [Formula: see text] above the martensite transition zone (770[Formula: see text]C). As heating to [Formula: see text]C), it produced a coarse microstructure containing new martensites formed in water quenching. The subsequent mechanical testing indicated that SLM-built Ti-6242 is excellent in terms of both room- and high-temperature tensile properties, with around 1400 MPa (UTS)[Formula: see text]5% elongation and 1150 MPa (UTS)[Formula: see text]10% elongation, respectively. However, the combination of water quenching and aging embrittled the as-built material severely.


Crystals ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 1330
Author(s):  
Muhammad Farzik Ijaz ◽  
Mahmoud S. Soliman ◽  
Ahmed S. Alasmari ◽  
Adel T. Abbas ◽  
Faraz Hussain Hashmi

Unfolding the structure–property linkages between the mechanical performance and microstructural characteristics could be an attractive pathway to develop new single- and polycrystalline Al-based alloys to achieve ambitious high strength and fuel economy goals. A lot of polycrystalline as-cast Al-Cu-Mg-Ag alloy systems fabricated by conventional casting techniques have been reported to date. However, no one has reported a comparison of mechanical and microstructural properties that simultaneously incorporates the effects of both alloy chemistry and mechanical testing environments for the as-cast Al-Cu-Mg-Ag alloy systems. This preliminary prospective paper presents the examined experimental results of two alloys (denoted Alloy 1 and Alloy 2), with constant Cu content of ~3 wt.%, Cu/Mg ratios of 12.60 and 6.30, and a constant Ag of 0.65 wt.%, and correlates the synergistic comparison of mechanical properties at room and elevated temperatures. According to experimental results, the effect of the precipitation state and the mechanical properties showed strong dependence on the composition and testing environments for peak-aged, heat-treated specimens. In the room-temperature mechanical testing scenario, the higher Cu/Mg ratio alloy with Mg content of 0.23 wt.% (Alloy 1) possessed higher ultimate tensile strength when compared to the low Cu/Mg ratio with Mg content of 0.47 wt.% (Alloy 2). From phase constitution analysis, it is inferred that the increase in strength for Alloy 1 under room-temperature tensile testing is mainly ascribable to the small grain size and fine and uniform distribution of θ precipitates, which provided a barrier to slip by deaccelerating the dislocation movement in the room-temperature environment. Meanwhile, Alloy 2 showed significantly less degradation of mechanical strength under high-temperature tensile testing. Indeed, in most cases, low Cu/Mg ratios had a strong influence on the copious precipitation of thermally stable omega phase, which is known to be a major strengthening phase at elevated temperatures in the Al-Cu-Mg-Ag alloying system. Consequently, it is rationally suggested that in the high-temperature testing scenario, the improvement in mechanical and/or thermal stability in the case of the Alloy 2 specimen was mainly due to its compositional design.


2020 ◽  
Vol 6 (3) ◽  
pp. 113-123
Author(s):  
Arnold S. Borukhovich

The results of the creation of a high-temperature spin injector based on EuO: Fe composite material are discussed. Their magnetic, electrical, structural and resonance parameters are given in a wide range of temperatures and an external magnetic field. A model calculation of the electronic spectrum of the solid solution Eu–Fe–O, responsible for the manifestation of the outstanding properties of the composite, is performed. The possibility of creating semiconductor spin electronics devices capable of operating at room temperature is shown.


2012 ◽  
Vol 710 ◽  
pp. 457-462 ◽  
Author(s):  
G. Rajaram ◽  
S. Kumaran ◽  
T Srinivas Rao

The high temperature tensile behaviour of Al-Si alloy and two of its composite systems with graphite as major reinforcement were investigated. The composites were developed by the stir casting method, wherein a mixture of graphite (3 wt %) and Cu / Ni (2 wt% each) were added into the molten Al-Si alloy to fabricate two systems such as Al-Si-Cu/graphite composite and Al-Si-Ni/graphite composite. The properties of composites were better than that of the matrix alloy. Tensile behaviour of alloy and composites were studied at different temperatures from room temperature to 300°C. It is found that the tensile strength of the alloy and composites were decreasing with increase in temperature. The transition elements (Cu / Ni) have played the key role in improving the ultimate tensile and yield strength of the composites over the alloy. The flow stress of the composite is more than that of the alloy. The strain hardening exponent value continuously drops with the increase of tensile temperature due to the thermal softening effect. The % elongation of the alloy is more than that of the composites. Fracture surfaces of the samples are analyzed by scanning electron microscope to understand the fracture mechanisms. Fractography reveals that the fracture behaviour of the alloy changes from cleavage mode at room temperature to complete ductile mode at high temperature.


2011 ◽  
Vol 462-463 ◽  
pp. 1-6 ◽  
Author(s):  
Tao Suo ◽  
Yu Long Li ◽  
Ming Shuang Liu

As Carbon-fiber-reinforced SiC-matrix (C/SiC) composites are widely used in high-temperature structural applications, its mechanical behavior at high temperature is important for the reliability of structures. In this paper, mechanical behavior of a kind of 2D C/SiC composite was investigated at temperatures ranging from room temperature (20C) to 600C under quasi-static and dynamic uniaxial compression. The results show the composite has excellent high temperature mechanical properties at the tested temperature range. Catastrophic brittle failure is not observed for the specimens tested at different strain rates. The compressive strength of the composite deceases only 10% at 600C if compared with that at room temperature. It is proposed that the decrease of compressive strength of the 2D C/SiC composite at high temperature is influenced mainly by release of thermal residual stresses in the reinforced carbon fiber and silicon carbon matrix and oxidation of the composite in high temperature atmosphere.


2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000046-000055
Author(s):  
John R. Fraley ◽  
Edgar Cilio ◽  
Bryon Western

In recent years, high temperature magnetic structures have been developed and used for inductors and transformers in high temperature applications ranging from power electronics to wireless telemetry systems. Research in the high temperature magnetics field has led to the development of more advanced magnetic structures that can enable diverse applications ranging from regulators to amplifiers, with far reaching implications for the high temperature electronics community. Current high temperature electronics have shown potential in lab and rig tests, but high temperature electronics systems suffer from the relatively limited lifetime of the semiconductor devices themselves. The advanced magnetics discussed in this paper can be designed to have extreme lifetime capabilities even at elevated temperatures, and as such can have an immediate impact on the implementation of true field deployable high temperature electronic systems. Aerospace, power generation, and automotive industries may especially benefit from this technology, as significant advances in health monitoring and active engine control will be enabled by these advanced magnetic structures. A theoretical understanding of these advanced magnetic structures is necessary for initial design and feasibility, while the true development and implementation of this technology depends on state of the art high temperature packaging approaches. By combining high temperature, grain-oriented magnetic materials along with high temperature packaging processes, APEI, Inc. has created advanced high temperature magnetic systems that indicate the technology described in this paper is a viable one, with applications across a wide range of high temperature electronics systems.


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