LED & HB-LED Packaging: Technology & Marketing Trends
2010 ◽
Vol 2010
(DPC)
◽
pp. 001137-001176
Keyword(s):
If LED lighting is to fulfill the promise it holds across all lighting segments, costs need to drop significantly and production volumes will need to double several times over in the coming years. To achieve both, cost improvements must happen at every level of manufacturing and manufacturing processes must evolve. When talking about LED device costs today, packaging holds the greatest cost saving opportunities. As with many semiconductor devices and for LED devices in particular, wafer level packaging will be a key cost saving move for the future. Much needs to be done and much is being done - this talk will take a look at the full spectrum of developments to bring LED into mainstream lighting applications.
2012 ◽
Vol 132
(8)
◽
pp. 246-253
◽
2016 ◽
Vol 23
(6)
◽
pp. 2107-2111
◽
Keyword(s):
2017 ◽
Vol 2017
(1)
◽
pp. 000325-000330
◽
Keyword(s):
2019 ◽
pp. 261-270
Keyword(s):
Keyword(s):