TSV technology embedding high density capacitors for Advanced 3D packaging solutions

TSV is one of the key technologies for 3D integration . TSVs co-integrated with passives including high density capacitors enable highly integrated heterogeneous solutions required because of the smaller size of the electronic modules . Even if there is still a lot to do , significant progress has already been done on the process , on the testability , on the performances of these smart interposers .The major progress is in the adoption of the technology .In this paper we'll expose some examples where the adoption was driven by cost, performances & miniaturization. Emphasis will be placed on the performances of the new generation of 3D Silicon capacitors, using key enabling technology like ALD and amazing architecture that allow impressive capacitance density increase.

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Medical Industry Trends That Promote the Use of Optical Medicine Fiber

International Journal of Advanced Research in Science, Communication and Technology ◽

10.48175/ijarsct-2310 ◽

2021 ◽

pp. 76-79

Author(s):

Dr. R. Thillaikkarasi ◽

Sindhuja R ◽

Sivabharati M ◽

Abira Bright ◽

Sreejith V

Keyword(s):

Optical Fibers ◽

Laser Light ◽

Light Sources ◽

Healthcare Industry ◽

Future Prospects ◽

Enabling Technology ◽

Instruments And Techniques ◽

Ancient Times ◽

New Generation ◽

Industry Trends

Optics has, since ancient times, being used as aid for the exam human patients and in some therapeutic treatments. Many of the optic medical instruments in use today were developed in the nineteenth century and, with the advent of optical fibers and laser light sources in the mid twentieth century, a new generation of medical devices, instruments, and techniques have been developed that have helped modernize medicine and perform task unimaginable only a few decades ago. This chapter illustrates through several optical instrument and application examples the uses, benefits, and future prospects that optics brings as an enabling technology to the medicine and the overall healthcare industry.

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Development of New Single and High-Density Heat-Flux Gauges for Unsteady Heat Transfer Measurements for a Rotating Transonic Turbine

Volume 7C: Heat Transfer ◽

10.1115/gt2020-14527 ◽

2020 ◽

Author(s):

Richard Celestina ◽

Spencer Sperling ◽

Louis Christensen ◽

Randall Mathison ◽

Hakan Aksoy ◽

...

Keyword(s):

Heat Transfer ◽

Heat Flux ◽

High Pressure ◽

Pressure Ratio ◽

High Density ◽

Secondary Flows ◽

Single Stage ◽

High Pressure Turbine ◽

Transonic Turbine ◽

New Generation

Abstract This paper presents the development and implementation of a new generation of double-sided heat-flux gauges at The Ohio State University Gas Turbine Laboratory (GTL) along with heat transfer measurements for film-cooled airfoils in a single-stage high-pressure transonic turbine operating at design corrected conditions. Double-sided heat flux gauges are a critical part of turbine cooling studies, and the new generation improves upon the durability and stability of previous designs while also introducing high-density layouts that provide better spatial resolution. These new customizable high-density double-sided heat flux gauges allow for multiple heat transfer measurements in a small geometric area such as immediately downstream of a row of cooling holes on an airfoil. Two high-density designs are utilized: Type A consists of 9 gauges laid out within a 5 mm by 2.6 mm (0.20 inch by 0.10 inch) area on the pressure surface of an airfoil, and Type B consists of 7 gauges located at points of predicted interest on the suction surface. Both individual and high-density heat flux gauges are installed on the blades of a transonic turbine experiment for the second build of the High-Pressure Turbine Innovative Cooling program (HPTIC2). Run in a short duration facility, the single-stage high-pressure turbine operated at design-corrected conditions (matching corrected speed, flow function, and pressure ratio) with forward and aft purge flow and film-cooled blades. Gauges are placed at repeated locations across different cooling schemes in a rainbow rotor configuration. Airfoil film-cooling schemes include round, fan, and advanced shaped cooling holes in addition to uncooled airfoils. Both the pressure and suction surfaces of the airfoils are instrumented at multiple wetted distance locations and percent spans from roughly 10% to 90%. Results from these tests are presented as both time-average values and time-accurate ensemble averages in order to capture unsteady motion and heat transfer distribution created by strong secondary flows and cooling flows.

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Bonding Technologies for 3D integration

International Symposium on Microelectronics ◽

10.4071/isom-2015-wa24 ◽

2015 ◽

Vol 2015 (1) ◽

pp. 000231-000234

Author(s):

Sascha Lohse ◽

Alexander Wollanke

Keyword(s):

Flip Chip ◽

Process Technology ◽

3D Integration ◽

Test Procedures ◽

Fine Pitch ◽

Ic Packaging ◽

Die Stacking ◽

3D Packaging ◽

Small Bump ◽

Suitable Process

Tougher requirements related to the request for smaller, lighter and multi-functional electronic devices impose increased demands on IC packaging. Ever more complex circuitry, fine pitch and micro bump designs and die stacking are examples of how the industry meets these demands. Finding a suitable process technology for 3D packaging can be a challenge. This paper provides information about various connection methods predominantly used in today's 3D packaging. In comprehensive trials, various dies characterized by high bump count (up to 143,000), fine pitch (down to 25 μm) and small bump diameter (down to 13 μm) were placed on a substrate using a semi-automated flip chip bonder. This whitepaper describes test procedures for different 3D integration technologies and presents utilized process parameters and results.

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Flex-DIMM – A New High Density Module Form Factor

International Symposium on Microelectronics ◽

10.4071/isom-2015-thp31 ◽

2015 ◽

Vol 2015 (1) ◽

pp. 000806-000809

Author(s):

James E. Clayton

Keyword(s):

Form Factor ◽

Cross Section ◽

Lower Layer ◽

Signal Integrity ◽

High Density ◽

Thermal Dissipation ◽

Ideal Solution ◽

Memory Module ◽

The Past ◽

New Generation

The Dual In-Line Memory Module (DIMM) has remained relatively unchanged for the past two decades, with exception of an increase in PCB size, I/O pads and layer count. A new generation called Flex-DIMM is introduced by replacing the rigid-PCB substrate with a thin, bifurcated, flexible circuit that enables several improvements; including a thinner cross-section, better signal integrity with lower layer count, better thermal dissipation and ability to be directly mated to the surface of a motherboard. Originally intended for RDIMM applications, the new module may be an ideal solution for clustered microservers.

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