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Sensors ◽  
2021 ◽  
Vol 21 (11) ◽  
pp. 3633
Author(s):  
Rytis Augustauskas ◽  
Arūnas Lipnickas ◽  
Tadas Surgailis

Drilling operations are an essential part of furniture from MDF laminated boards required for product assembly. Faults in the process might introduce adverse effects to the furniture. Inspection of the drilling quality can be challenging due to a big variety of board surface textures, dust, or woodchips in the manufacturing process, milling cutouts, and other kinds of defects. Intelligent computer vision methods can be engaged for global contextual analysis with local information attention for automated object detection and segmentation. In this paper, we propose blind and through drilled holes segmentation on textured wooden furniture panel images using the UNet encoder-decoder modifications enhanced with residual connections, atrous spatial pyramid pooling, squeeze and excitation module, and CoordConv layers for better segmentation performance. We show that even a lightweight architecture is capable to perform on a range of complex textures and is able to distinguish the holes drilling operations’ semantical information from the rest of the furniture board and conveyor context. The proposed model configurations yield better results in more complex cases with a not significant or small bump in processing time. Experimental results demonstrate that our best-proposed solution achieves a Dice score of up to 97.89% compared to the baseline U-Net model’s Dice score of 94.50%. Statistical, visual, and computational properties of each convolutional neural network architecture are addressed.


2019 ◽  
Vol 4 (4) ◽  
pp. 2473011419S0011
Author(s):  
Jorge Briceño ◽  
Bonnie Chien ◽  
Christopher Miller ◽  
Brian Velasco ◽  
John Y. Kwon

Category: Ankle Introduction/Purpose: Diagnosis of mortise instability in the apparent isolated lateral malleolus fracture can be challenging and often relies on stress radiography. While the gravity stress view (GSV) is commonly utilized, it traditionally requires the patient to assume the lateral decubitus position for imaging of the ankle. This can be difficult and uncomfortable for the patient and may be unsafe in particular situations. Furthermore, transferring the patient back and forth to obtain this positioning is time-intensive for the radiology technician and disruptive to clinic throughput. Therefore, we describe a simple technique that allows acquisition of the GSV of the ankle while the patient remains seated. The technique involves minimal patient movement and is simple for the staff to position appropriately. Methods: The patient is seated on either a stable office chair with arms for safety or in a wheelchair. The affected limb is then placed on a padded stool with the foot extended past the edge of the stool. The patient is instructed to maintain the ankle in a comfortable resting position. They are then encouraged to externally rotate at the ipsilateral hip. If needed, a small bump can be placed underneath the contralateral hip to further increase external rotation of the affected limb at the hip. The ankle and foot should be approximately 15 degrees internally rotated relative to the plane of the floor once the leg has been appropriately positioned. The leg should be held straight with the ankle at the level of the chair seat. This places the ankle in an optimal angle for obtaining a mortise view. The radiograph is then obtained in standard fashion. Results: N/A Conclusion: Obtaining the GSV in the seated position offers several advantages. First, the patient is placed in a seated position, which is more time-efficient than transferring the patient to the radiology table and avoids the potential danger of patients falling. Second, external rotation of the hip is generally well-tolerated in isolated leg injuries. Third, this positioning more reliably places the ankle in approximately 15 degrees of internal rotation to obtain the optimal mortise view and assess mortise symmetry. Finally, patient comfort is increased as this technique obviates transferring patients or placing their hip directly on a rigid radiology table.


ZooKeys ◽  
2018 ◽  
Vol 783 ◽  
pp. 1-15 ◽  
Author(s):  
Pir Asmat Ali ◽  
Wayne P. Maddison ◽  
Muhammad Zahid ◽  
Abida Butt

EpocillapakhtunkhwaAli & Maddison,sp. n.andStenaelurillusmardanicusAli & Maddison,sp. n.are described from Khyber Pakhtunkhwa Province, Pakistan. Noted for the first time is the presence inEpocillaof a small bump just anterior to the fovea of the carapace, of unknown functional significance, otherwise known in the unrelatedOpisthoncusL. Koch, 1880 andCocalusPocock, 1897. In addition, the female ofMenemerusnigliWesołowska & Freudenschuss, 2012 is described for the first time.


2018 ◽  
Vol 924 ◽  
pp. 349-352 ◽  
Author(s):  
Satoshi Torimi ◽  
Norihito Yabuki ◽  
Takuya Sakaguchi ◽  
Masato Shinohara ◽  
Yoji Teramoto ◽  
...  

We investigate electrical characteristics of the pn-diode fabricated using the epitaxial films on the surface damage-free 4H-SiC (0001) Si-face 4° off-cut wafers prepared by the completely thermal-chemical etching process; Si-vapor etching (Si-VE) technology. The forward and reverse current-voltage (I-V) characteristics of pn-diodes correlated to the epitaxial defects are discussed. The device at the defect-free area includes 11 % failed diodes on the chemo-mechanical polishing (CMP) wafer while 0 % on the Si-VE wafer. The latent scratches and mechanical damages, which increase the forward and reverse leakage current of the pn-diodes, are completely removed by the Si-VE. The Si-VE exposes the carbon inclusions in the wafer to form the small bump which ends up with the larger bump defect on the epitaxial surface. These bumps cause leak current of the forward characteristics while all of the reverse characteristics are normal. The epitaxial film on the Si-VE surface has less density of the basal plane dislocations (BPDs) than the conventional CMP. It is hard to recognize the safe device on the CMP wafer without additional reliability test. The Si-VE wafer shows the apparent breakdown voltage fail on every small-number diode including BPDs under the simple test. It is considered that the Si-VE is possible to reduce ambiguity of the device characteristics under the relationship with the defects in comparison with the CMP.


2018 ◽  
Vol 89 (2) ◽  
pp. 298-305
Author(s):  
Philip B. Whyman
Keyword(s):  
The Road ◽  

2016 ◽  
Vol 2016 ◽  
pp. 1-7
Author(s):  
Won-Hyeong Park ◽  
Da-hye Kim ◽  
Ki-uk Kyung ◽  
Sang-Youn Kim

This paper proposes visuotactile primitives with vibrotactile properties for a more systematic haptic representation of virtual objects in touchscreen mobile devices. We define a DOT, a LINE, and a SURFACE as tactile symbols of hitting a small bump, flicking a string, and rubbing a textured surface, respectively. The combination of the proposed primitives induces a more efficient design process for providing various tactile properties of virtual objects to a user. We did experiments to evaluate whether the proposed method haptically represents virtual objects. The results show that the proposed visuotactile primitives can be applied to the haptic representation of graphical objects.


2015 ◽  
Vol 2015 (1) ◽  
pp. 000231-000234
Author(s):  
Sascha Lohse ◽  
Alexander Wollanke

Tougher requirements related to the request for smaller, lighter and multi-functional electronic devices impose increased demands on IC packaging. Ever more complex circuitry, fine pitch and micro bump designs and die stacking are examples of how the industry meets these demands. Finding a suitable process technology for 3D packaging can be a challenge. This paper provides information about various connection methods predominantly used in today's 3D packaging. In comprehensive trials, various dies characterized by high bump count (up to 143,000), fine pitch (down to 25 μm) and small bump diameter (down to 13 μm) were placed on a substrate using a semi-automated flip chip bonder. This whitepaper describes test procedures for different 3D integration technologies and presents utilized process parameters and results.


Author(s):  
L. Bogaerts ◽  
J. De Vos ◽  
C. Gerets ◽  
G. Jamieson ◽  
K. Vandersmissen ◽  
...  
Keyword(s):  

Zootaxa ◽  
2012 ◽  
Vol 3190 (1) ◽  
pp. 47
Author(s):  
CHAO ZHANG ◽  
FENG ZHANG

Platybunoides Šilhavý, 1955, currently included in the subfamily Platybuninae Staręga, 1976, is reassigned to Phalangii-nae Latreille, 1802 for the absence of ventral spur in proximal segment of chelicerae, the absence of ventral thorns on pe-dipalpal femur, and the presence of distomesal bump on pedipalpal patella and tibia. A new species, Platybunoides songisp. nov., from Liupan Mountain, Ningxia, China, is described and can be recognized by having a large ocularium, unarmed pedipalps, hairs being restricted to ventral femur, and the presence of a small bump distally on prolateral femur.


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