Evaluation of Epoxy Flux for Use in Hearing Aid SMD Assemblies

2013 ◽  
Vol 2013 (1) ◽  
pp. 000152-000157
Author(s):  
Susie Johansson ◽  
John Dzarnoski
Keyword(s):  
Integrated Circuits ◽  
Hearing Aids ◽  
Integrated Circuit ◽  
Hearing Aid ◽  
Single Step ◽  
Size Reduction ◽  
Circuit Board ◽  
Limiting Factor ◽  
Surface Mount ◽  
Die Attach

Miniaturization of everyday products has been driving sales for some time and continues to fuel the consumer market. Everyone expects size reduction with each new product generation [1], [2]. Almost everything has electronics inside that must get smaller. There is no market demanding smaller devices that are faster, more capable, more feature-rich than that of the hearing aid industry. While radios, Bluetooth wireless systems and other accessories are added to hearing instruments feature lists, the consumer nonetheless continues to wish for them to be even smaller. Advancements in circuit fabrication, component shrinkage and die consolidation have aided the industry in satisfying this need. However, as this demand continues and even intensifies, current surface mount device assembly materials are becoming inadequate and the limiting factor for overall circuit size reduction; specifically, the die attachment, protection and reinforcement process is limiting how small hearing aid circuits can be. For hearing aids, the addition of more features and connection to more accessories each require a number of integrated circuits and associated passives attached to a flexible circuit. These circuits are invariably bent and twisted during assembly, up to 180°, requiring the integrated circuit solder joints to be reinforced by underfilling to prevent detachment. Unfortunately, the underfilling process is time-consuming and the capillary action necessary for its success is finicky. Even more unfavorably, a designated “keep out” area for other components must surround the die to be underfilled to allow for the dispensing equipment to access the die, reducing the useable board space and limiting the overall possibility of circuit size reduction. Additionally, the underfill material must stay away from circuit board edges and areas to be bent during final assembly. In an attempt to increase useable circuit board space, decrease overall circuit board size, and reduce assembly steps, the application of two epoxy flux materials for die attach fluxing and underfilling of hearing aids was evaluated. Epoxy flux is a relatively new material, which combines the functionality of flux and underfill into a single step. Epoxy flux's application, while eliminating steps, would more significantly eliminate the necessary “keep out” areas around die and allow for more densely placed surface mount components. The epoxy flux materials were applied by both printing and dipping, and then evaluated using x-ray imaging, scanning acoustic microscope imaging, die peel testing, multiple reflow integrity testing and die shear testing.

Embedding Active and Passive Devices in Medical Electronics

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000786-000814
Author(s):  
John Dzarnoski ◽  
Susie Johansson
Keyword(s):  
Hearing Aids ◽  
Hearing Aid ◽  
Telecommunications Industry ◽  
The United States ◽  
Size Reduction ◽  
Circuit Board ◽  
Vacuum Tube ◽  
Passive Devices ◽  
Hearing Instruments ◽  
Wafer Test

Efforts to increase the packaging efficiency of microelectronic systems have been extensive and continuous over the past few decades. Evidence of this can be seen even before the expansion of the space program by the United States in 1961 and the race to the moon; one of the first settings where size was truly limited and miniaturization of electronics was a necessity. In the 1950's the world saw its first major size reduction of electronic component with the phase out of the vacuum tube in favor of the transistor. The transistor saw its first major commercial use in 1952 via hybrid vacuum tube transistor technology. While many industries benefitted from the shift, in 1954 the hearing aid industry specifically experienced major improvements owing to the implementation of transistors, becoming smaller, requiring less power and having better functionality. The first 4-transistor AM radio product followed shortly thereafter. Much of today's effort since 1978 has been driven by the telecommunications industry that has succeeded in reducing cell phone size while simultaneously increasing functionality. Just as in the 1950's, hearing aid technology continues to be at the forefront when it comes to miniaturization. The hearing aid business has always had the need to use extremely small electronic packaging. The first completely in the canal (CIC) hearing aids were produced in 1993 and required all electronic components to be small enough that they fit entirely inside the ear canal. The introduction of wireless systems into hearing aids has sharply increased component count. Due to the size and shape of a multitude of types of hearing aids, flexible circuits need to be folded and bent to fit inside hearing aid cases, with essentially all available space being used. More powerful processors and more memory are enabling sophisticated algorithms that are able to greatly improve sound quality. There is also a strong market desire to add more features to hearing products while at the same time making them smaller and less visible. The latest hearing aids have succeeded in the later demand, constructed so small they are not visible and consequently are called invisible in the canal (IIC). In order to continue meeting the markets want for smaller and more features, a new packaging method needed to be developed. One such option is embedded die packaging. This paper will examine the use of embedded die packaging (or chip-in-flex) to drive significant further size reduction in custom and standard hearing instruments over what can be achieved using chip-on-flex or traditional ceramic hybrid based technologies. The historical drivers, available circuit board technologies, use of integrated passive devices, performance improvement, size reduction, device reliability, changes in supply chain, impact on wafer test, impact on device test, and challenges of working with wafers instead of die will be discussed.

scholarly journals A Novel Multi-Pattern Solder Joint Simultaneous Segmentation Algorithm for PCB Selective Packaging Systems

2019 ◽  
Vol 33 (13) ◽  
pp. 2058005
Author(s):  
Lei Huang ◽  
Shibin Shen ◽  
Fei Xie ◽  
Jing Zhao ◽  
Jianing Han ◽  
...  
Keyword(s):  
Solder Joint ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Extraction Methods ◽  
Segmentation Algorithm ◽  
Circuit Board ◽  
Packaging System ◽  
Low Efficiency

To prevent any negative electromagnetic influence of high-density integrated circuits, an insulation package needs to be specially designed to shield it. Aiming at the low efficiency and material waste in traditional packaging methods, a printed circuit board (PCB) selective packaging system based on a multi-pattern solder joint simultaneous segmentation algorithm and three-dimensional printing technology is introduced in this paper. Firstly, the structure of PCB selective packaging system is designed. Secondly, to solve the existing problems, such as multi-pattern solder joints which are located densely in small welding areas and are hard to be extracted in the small-area integrated circuit board, a multi-pattern solder joint simultaneous segmentation algorithm is developed based on (geometrical) neighborhood features to extract and locate the optimal PCB solder joint areas. Finally, tests using three actual PCB are carried out to compare the proposed method with traditional multi-threshold solder joint extraction methods. Test results indicate that the proposed algorithm is simple and effective. Diverse solder joints can be optimally located and simultaneously extracted from the collected PCB image, which greatly improves the filling rate of the solder joint areas and filters out false pixels. Thus, this method provides a reliable location-finding tool to help place solder points in PCB selective packaging systems.

scholarly journals A Survey on Application Specific Processor Architectures for Digital Hearing Aids

2021 ◽  
Author(s):  
Lukas Gerlach ◽  
Guillermo Payá-Vayá ◽  
Holger Blume
Keyword(s):  
Hearing Aids ◽  
Integrated Circuit ◽  
Hearing Aid ◽  
Operating Conditions ◽  
Silicon Area ◽  
Digital Hearing Aids ◽  
The One ◽  
Common Application ◽  
Instruction Set Processors ◽  
Application Specific

AbstractOn the one hand, processors for hearing aids are highly specialized for audio processing, on the other hand they have to meet challenging hardware restrictions. This paper aims to provide an overview of the requirements, architectures, and implementations of these processors. Special attention is given to the increasingly common application-specific instruction-set processors (ASIPs). The main focus of this paper lies on hardware-related aspects such as the processor architecture, the interfaces, the application specific integrated circuit (ASIC) technology, and the operating conditions. The different hearing aid implementations are compared in terms of power consumption, silicon area, and computing performance for the algorithms used. Challenges for the design of future hearing aid processors are discussed based on current trends and developments.

Mechanical Interconnects to Silicon Integrated Circuits

1987 ◽  
Vol 108 ◽  
Author(s):  
Charles A. Steidel
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Wire Bonding ◽  
Small Scale ◽  
Limiting Factor ◽  
Single Chip ◽  
Paper Briefly ◽  
Package Design ◽  
Silicon Integrated Circuits ◽  
Future Direction

ABSTRACTThere are three predominant interconnection technologies in use today for silicon integrated circuits: wire bonding; TAB (tape automated bonding); and C4 (controlled collapse chip connection). This paper briefly reviews each of these technologies for their strengths and weaknesses but focuses especially on wire bonding for single chip VLSI applications.Although wire bonding has been in widespread use ever since the invention of the small scale integrated circuit, the technique is still applicable for today's much larger and denser chips. With leadcounts up to 250 or even higher, many challenges are presented for equipment accuracy and speed and in package design, where novel techniques often are required to prevent the package from being the limiting factor in chip interconnection. These challenges are discussed in some detail.The paper concludes with a discussion of the future direction for mechanical connections as influenced by the technical and cost requirements of both the chip and the system in which it resides.

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

2021 ◽  
Vol 2021 (HiTEC) ◽  
pp. 000069-000075
Author(s):  
Liangyu Chen ◽  
Philip G. Neudeck ◽  
David J. Spry ◽  
Glenn M. Beheim ◽  
Gary W. Hunter
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Circuit Board ◽  
Packaging System ◽  
Ceramic Substrates ◽  
Al2o3 Ceramic ◽  
Low Dielectric ◽  
Die Attach

Abstract Along with the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is a good electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

Adhesion Strength at High Temperatures Affected by Moisture for Die-Attach Materials of Integrated Circuit Packages

2005 ◽  
Author(s):  
Hiroyuki Tanaka ◽  
Takashi Numata
Keyword(s):  
Adhesion Strength ◽  
High Temperatures ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Large Change ◽  
Circuit Board ◽  
Material Interface ◽  
Element Analysis ◽  
Moisture Concentration ◽  
Die Attach

This paper presents a method of finite element analysis for calculating moisture concentration in non-isothermal and non-steady states of moisture for integrated circuit packages composed of dissimilar moisture-permeable materials. The method can address non-Fickian behavior of materials in moisture diffusivity. Specimens were put on a hot plate after pre-conditioning in a moist environment. Distribution of moisture concentration in the specimen used in adhesion strength measurement was calculated in the temperature-change process. Comparatively large change in moisture concentration occurs in the neighborhood of the dissimilar material interface during that process, demonstrating that adhesion strength between die-attach material and printed circuit board at high temperatures might have greater moisture-sensitivity than at low temperatures.

scholarly journals ESD Diode Protection Incorporated on Leadframe Package

2020 ◽  
pp. 30-33
Author(s):  
Frederick Ray I. Gomez ◽  
Edwin M. Graycochea Jr. ◽  
Nerie R. Gomez ◽  
Rennier S. Rodriguez
Keyword(s):  
Integrated Circuit ◽  
Electrostatic Discharge ◽  
Electronic Devices ◽  
Circuit Board ◽  
Surface Mount Technology ◽  
Package Design ◽  
Surface Mount ◽  
Before And After ◽  
Board Level

With the new die technology becomes smaller and thinner, silicon die circuit metallization also becomes smaller, thus electronic devices like quad-flat no-leads multi-row (QFN-mr) semiconductor leadframe package design become more sensitive and prone to electrostatic discharge (ESD) damages. This paper focused and introduced an additional surface mount technology by attaching diodes before and after diebonding process to protect the whole package and to prevent package related issues encountered. With this diode attached on the silicon die and leads, added protection could be achieved on the integrated circuit (IC) mounted on the circuit board level.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

TEM study of phosphorus-implanted pseudomorphic Si0.88Ge0.12 on Si(100)

1995 ◽  
Vol 53 ◽  
pp. 468-469
Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
Integrated Circuit ◽  
High Speed ◽  
Room Temperature ◽  
Strain Relaxation ◽  
Bipolar Transistors ◽  
Sige Hbt ◽  
Integrated Circuit Manufacturing ◽  
Microstructural Behavior

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.

Teachers' Stereotypes of Children Who Wear Hearing Aids

1981 ◽  
Vol 12 (3) ◽  
pp. 139-144 ◽  
Author(s):  
Cletus G. Fisher ◽  
Kenneth Brooks
Keyword(s):  
Elementary School ◽  
School Child ◽  
Hearing Aids ◽  
Hearing Aid ◽  
Social Implications ◽  
Elementary School Child ◽  
Classroom Teachers ◽  
Frequency Of Occurrence ◽  
Service Training

Classroom teachers were asked to list the traits they felt were characteristic of the elementary school child who wears a hearing aid. These listings were evaluated according to the desirability of the traits and were studied regarding frequency of occurrence, desirability, and educational, emotional, and social implications. The results of the groupings are discussed in terms of pre-service and in-service training.

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