Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration

2013 ◽  
Vol 2013 (1) ◽  
pp. 000389-000396
Author(s):  
J. H. Lau ◽  
H. C. Chien ◽  
S. T. Wu ◽  
Y. L. Chao ◽  
W. C. Lo ◽  
...  
Keyword(s):  
Low Cost ◽  
Manufacturing Processes ◽  
Heat Spreader ◽  
3D Ic ◽  
Through Silicon Via ◽  
Enabling Technologies ◽  
Temporary Bonding ◽  
Carrier Wafer ◽  
Key Enabling Technologies ◽  
Handling Method

Thin-wafer handling is one of the key enabling technologies for 2.5D/3D IC integration. Usually, it temporary bonds the TSV (through-silicon via)/RDL (redistribution layer) wafer (e.g., passive and active interposers) to a supporting carrier wafer with an adhesive, backgrinds the TSV/RDL interposer wafer to very thin (≤100μm), goes through all the necessary processes, and then de-bonds the thin TSV/RDL interposer wafer from the carrier wafer. In this study, a different route will be taken which eliminates the temporary bonding and de-bonding processes. Emphasis is placed on using a heat-spreader wafer as a supporting carrier wafer during the manufacturing processes and after the assembly is completed (diced), the heat-spreader remains on the thin TSV/RDL interposer. This is a very simple and low-cost thin-wafer handling method for 2.5D/3D IC integration.

Oxide Liner, Barrier and Seed Layers, and Cu-Plating of Blind Through Silicon Vias (TSVs) on 300mm Wafers for 3D IC Integration

2011 ◽  
Vol 2011 (1) ◽  
pp. 000001-000007
Author(s):  
Chien-Ying Wu ◽  
Shang-Chun Chen ◽  
Pei-Jer Tzeng ◽  
John H. Lau ◽  
Yi-Feng Hsu ◽  
...  
Keyword(s):  
Cross Sections ◽  
3D Integration ◽  
Leakage Currents ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Enabling Technologies ◽  
Key Enabling Technologies ◽  
Silicon Vias ◽  
Seed Layers

In this study, key enabling technologies such as the oxide liner by the PECVD, the barrier and seed layers by the PVD, and Cu-plating of blind TSVs on 300mm wafers for 3D integration are investigated. Emphases are placed on the determination and optimization of the important parameters for each of the key enabling technologies. Also, leakage currents of the fabricated Cu-filled TSVs are measured. Furthermore cross sections and SEM of the fabricated TSVs are provided and examined.

Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

2010 ◽  
Author(s):  
John H. Lau ◽  
Y. S. Chan ◽  
S. W. Ricky Lee
Keyword(s):  
Low Power ◽  
High Power ◽  
Heat Sink ◽  
High Performance ◽  
Low Cost ◽  
Bottom Surface ◽  
Heat Spreader ◽  
Creep Theory ◽  
Integration System ◽  
3D Ic

A low-cost (with bare chips) and high (electrical, thermal, and mechanical) performance 3D IC integration system-in-package (SiP) is designed and described. This system consists of a silicon interposer with through-silicon vias (TSV) [1–24] and redistribution layers (RDL), which carries the high-power flip chips with microbumps on its top surface and the low-power chips at its bottom surface. TSVs in the high- and low-power chips are optional but should be avoided. The backside of the high-power chips is attached to a heat spreader with or w/o a heat sink. This 3D IC integration system is supported (packaged) by a simple conventional organic substrate. The heat spreader (with or w/o heat sink) and the substrate are connected by a ring stiffener, which provides adequate standoff for the 3D IC integration system. This novel structural design offers potential solutions for high-power, high-performance, high pin-count, ultra fine-pitch, small real-estate, and low-cost applications. Thermal management and reliability of the proposed systems are demonstrated by simulations based on heat-transfer theory and time and temperature dependent creep theory.

Oxide Liner, Barrier and Seed Layers, and Cu Plating of Blind Through Silicon Vias (TSVs) on 300 mm Wafers for 3D IC Integration

2012 ◽  
Vol 9 (1) ◽  
pp. 31-36 ◽  
Author(s):  
Chien-Ying Wu ◽  
Shang-Chun Chen ◽  
Pei-Jer Tzeng ◽  
John H. Lau ◽  
Yi-Feng Hsu ◽  
...  
Keyword(s):  
Leakage Current ◽  
Cross Sections ◽  
3D Integration ◽  
3D Ic ◽  
Through Silicon Vias ◽  
Enabling Technologies ◽  
Key Enabling Technologies ◽  
Silicon Vias ◽  
Seed Layers

In this study, key enabling technologies such as the oxide liner by the PECVD, the barrier and seed layers by the PVD, and Cu plating of blind TSVs on 300 mm wafers for 3D integration are investigated. Emphasis is placed on the determination and optimization of the important parameters for each of the key enabling technologies. Also, the leakage current of the fabricated Cu-filled TSVs is measured. Furthermore, cross sections and SEM of the fabricated TSVs are examined.

Thin Wafer Handling of 300mm Wafer for 3D IC Integration

2011 ◽  
Vol 2011 (1) ◽  
pp. 000202-000207 ◽  
Author(s):  
H. H. Chang ◽  
J. H. Lau ◽  
W. L. Tsai ◽  
C. H. Chien ◽  
P. J. Tzeng ◽  
...  
Keyword(s):  
State Of The Art ◽  
3D Ic ◽  
Critical Issues ◽  
Temporary Bonding ◽  
Carrier Wafer

In this study, thin wafer handling of 300mm wafer for 3D IC Integration is investigated. Emphasis is placed on the determination of the effect of a dicing tape on thin-wafer handling of wafers with Cu-Au pads, Cu-Ni-Au UBM, and TSV interposer with RDL. Also, thin-wafer handling critical issues such as the chip/interposer wafer, carrier wafer, temporary bonding, thinning, backside process, de-bonding, and assembly are presented and their potential solutions are discussed. Finally, state-of-the-art of materials and equipments for thin-wafer handling are examined.

scholarly journals Key Enabling Technologies for Point-of-Care Diagnostics

Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 3607 ◽  
Author(s):  
Elisabetta Primiceri ◽  
Maria Chiriacò ◽  
Francesca Notarangelo ◽  
Antonio Crocamo ◽  
Diego Ardissino ◽  
...  
Keyword(s):  
Point Of Care ◽  
Low Cost ◽  
Detection Methods ◽  
Common People ◽  
Everyday Objects ◽  
Enabling Technologies ◽  
Point Of Care Diagnostics ◽  
Major Trend ◽  
Key Enabling Technologies ◽  
Highly Sensitive Detection

A major trend in biomedical engineering is the development of reliable, self-contained point-of-care (POC) devices for diagnostics and in-field assays. The new generation of such platforms increasingly addresses the clinical and environmental needs. Moreover, they are becoming more and more integrated with everyday objects, such as smartphones, and their spread among unskilled common people, has the power to improve the quality of life, both in the developed world and in low-resource settings. The future success of these tools will depend on the integration of the relevant key enabling technologies on an industrial scale (microfluidics with microelectronics, highly sensitive detection methods and low-cost materials for easy-to-use tools). Here, recent advances and perspectives will be reviewed across the large spectrum of their applications.

Construction and mechanistic understanding of high-performance all-air-processed perovskite solar cells via mixed-cation engineering

2021 ◽  
Author(s):  
Wenyuan Zhang ◽  
Lang He ◽  
Yuanchao Li ◽  
Dongyan Tang ◽  
Xin Li ◽  
...  
Keyword(s):  
Solar Cells ◽  
High Performance ◽  
Low Cost ◽  
Perovskite Solar Cells ◽  
Manufacturing Processes ◽  
Mixed Cation ◽  
Mechanistic Understanding

All-air-processed perovskite solar cells (PSCs) have attracted increasing attention due to low cost and simplified manufacturing processes. At present, to fabricate efficient and stable PSCs in the air is expected....

Electrochemically induced structural reconstruction in promoting Zn storage performances of CaMn3O6 cathode for superior long life aqueous Zn-ion battery

2021 ◽  
Author(s):  
peisheng guo ◽  
gongzheng yang ◽  
Chengxin Wang
Keyword(s):  
Energy Storage ◽  
Large Scale ◽  
Storage Systems ◽  
Low Cost ◽  
Zinc Ion ◽  
Manufacturing Processes ◽  
Energy Storage Systems ◽  
Long Life

Aqueous zinc-ion batteries (AZIBs) have been regarded as alternative and promising large-scale energy storage systems due to their low cost, convenient manufacturing processes, and high safety. However, their development was...

High Heat Resistant Peelable Temporary Bonding Film and New Debonding System with Xe Flash Light Irradiation

2020 ◽  
Vol 2020 (1) ◽  
pp. 000302-000306
Author(s):  
Yuta Akasu ◽  
Emi Miyazawa ◽  
Tetsuya Enomoto ◽  
Yasuyuki Oyama ◽  
Shogo Sobue ◽  
...  
Keyword(s):  
Chemical Resistance ◽  
High Heat ◽  
Light Irradiation ◽  
Wafer Surface ◽  
Assembly Process ◽  
Test Vehicle ◽  
Packaging Process ◽  
Release System ◽  
Temporary Bonding ◽  
Carrier Wafer

Abstract We have developed a new temporary bonding film (TBF) and new debonding system with Xe flash light irradiation, named photonic release system, for advanced package assembly process. Since new TBF has a high Tg over 200 °C after curing and shows good chemical resistance to developer, resist stripper, and plating chemicals, no delamination, voiding, and swelling were observed after thermal and chemical treatment in the bonded structure of wafer and glass carrier. In addition, by adopting a metal-sputtered glass carrier, wafer could be debonded by Xe flash light irradiation in less than 1 ms through the glass carrier with no damage. Residual TBF on the wafer surface could be peeled off smoothly at ambient temperature without residue on the wafer. In this research, we also demonstrated the good applicability of this temporary bonding film to the typical packaging process by using test vehicle including 12 inch mold wafer and the advantage of photonic release system.

COOL™ Hose Qualification Process of the First EN1474-2 LNG Floating Hose

2011 ◽  
Author(s):  
Jean Pierre F. Queau ◽  
Giorgio E. Torre
Keyword(s):  
Product Design ◽  
Design Assessment ◽  
Enabling Technologies ◽  
Key Enabling Technologies ◽  
Guidelines And Recommendations ◽  
Design And Testing ◽  
Tandem Offloading

In 2005, SBM Offshore recognized that in future offshore Floating LNG Production Units, key enabling technologies would be required to ensure the safe and reliable tandem offloading to LNG Carriers. The foundation was thus laid down for the development of the COOL™ Hose: A cryogenic marine floating hose that would enable the tandem offloading between two vessels offshore. This paper presents, after an introduction to the COOL™ Hose design (Hose in Hose concept-HiH), the different steps in the qualification process following the EN1474-2 [1] guidelines and recommendations for design and testing of LNG transfer hoses. This qualification process has been endorsed by two Classification Societies ABS and DNV and has resulted in a Certificate of Fitness for Service from DNV and a Product Design Assessment Certificate from ABS making the SBM COOL™ Hose, the first EN1474-2 qualified LNG floating hose.

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