Thermal-Enhanced and Cost-Effective 3D IC Integration With TSV (Through-Silicon Via) Interposers for High-Performance Applications

2010 ◽  
Author(s):  
John H. Lau ◽  
Y. S. Chan ◽  
S. W. Ricky Lee
Keyword(s):  
Low Power ◽  
High Power ◽  
Heat Sink ◽  
High Performance ◽  
Low Cost ◽  
Bottom Surface ◽  
Heat Spreader ◽  
Creep Theory ◽  
Integration System ◽  
3D Ic

A low-cost (with bare chips) and high (electrical, thermal, and mechanical) performance 3D IC integration system-in-package (SiP) is designed and described. This system consists of a silicon interposer with through-silicon vias (TSV) [1–24] and redistribution layers (RDL), which carries the high-power flip chips with microbumps on its top surface and the low-power chips at its bottom surface. TSVs in the high- and low-power chips are optional but should be avoided. The backside of the high-power chips is attached to a heat spreader with or w/o a heat sink. This 3D IC integration system is supported (packaged) by a simple conventional organic substrate. The heat spreader (with or w/o heat sink) and the substrate are connected by a ring stiffener, which provides adequate standoff for the 3D IC integration system. This novel structural design offers potential solutions for high-power, high-performance, high pin-count, ultra fine-pitch, small real-estate, and low-cost applications. Thermal management and reliability of the proposed systems are demonstrated by simulations based on heat-transfer theory and time and temperature dependent creep theory.

A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS

2015 ◽  
Vol 2015 (1) ◽  
pp. 000627-000632 ◽  
Author(s):  
Swapan K. Bhattacharya ◽  
Fei Xie ◽  
Han Wu ◽  
Kelley Hodge ◽  
Keck Pathammavong ◽  
...  
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
High Reliability ◽  
Low Cost ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Cycle Times ◽  
High Adhesion ◽  
Machine Cycle

The objective of this study is to design and fabricate a high reliability LED Insulated Metal Substrate (IMS) package to complex heat sink attachment using an advanced thermal interface material (TIM). The assembly consists of LED IMS parts bonded to a heat spreader/sink using an advanced TIM and a corner bond material to quickly and accurately secure the LEDs in position. The corner bond adhesive is snap cured for fast machine cycle times while the high performance, high adhesion TIM materials cure throughout the rest of the assembly operation. This approach allows high accuracy LED bonding without the need for alignment pins or fasteners to anchor to the IMS. The IMS attached to the heat sink is then electrically interconnected with a thin flex substrate on top of the IMS. This approach is expected to replace the current mechanical fastners and low strength silicone TIM materials and reduce the cycle time and overall placement cost which are key drivers especially for the automotive industry.

scholarly journals Full-Bridge Active-Clamp Forward-Flyback Converter with an Integrated Transformer for High-Performance and Low Cost Low-Voltage DC Converter of Vehicle Applications

Energies ◽  
2020 ◽  
Vol 13 (4) ◽  
pp. 863 ◽  
Author(s):  
Jaeil Baek ◽  
Han-Shin Youn
Keyword(s):  
High Power ◽  
High Performance ◽  
Low Voltage ◽  
Low Cost ◽  
Primary Root ◽  
Input Voltage ◽  
Oxide Semiconductor ◽  
Duty Ratio ◽  
Voltage Range ◽  
Active Clamp

This paper presents a full-bridge active-clamp forward-flyback (FBACFF) converter with an integrated transformer sharing a single primary winding. Compared to the conventional active-clamp-forward (ACF) converter, the proposed converter has low voltage stress on the primary switches due to its full-bridge active-clamp structure, which can leverage high performance Silicon- metal–oxide–semiconductor field-effect transistor (Si-MOSFET) of low voltage rating and low channel resistance. Integrating forward and flyback operations allows the proposed converter to have much lower primary root mean square (RMS) current than the conventional phase-shifted-full-bridge (PSFB) converter, while covering wide input/output voltage range with duty ratio over 0.5. The proposed integrated transformer reduces the transformer conduction loss and simplify the secondary structure of the proposed converter. As a result, the proposed converter has several advantages: (1) high heavy load efficiency, (2) wide input voltage range operation, (3) high power density with the integrated transformer, and (4) low cost. The proposed converter is a very promising candidate for applications with wide input voltage range and high power, such as the low-voltage DC (LDC) converter for eco-friendly vehicles.

A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000006-000011
Author(s):  
N Palavesam ◽  
W Hell ◽  
A Drost ◽  
C Landesberger ◽  
C Kutter ◽  
...  
Keyword(s):  
Low Power ◽  
Organic Electronics ◽  
High Performance ◽  
Low Cost ◽  
Physical Object ◽  
Successful Implementation ◽  
Electrical Measurements ◽  
Sensors And Actuators ◽  
Human Machine Interaction ◽  
Roll To Roll

Abstract The emerging Internet-of-Everything (IoE) framework aims to revolutionise human-machine interaction where billions of sensors and actuators placed on almost every physical object will be tasked to communicate with each other. A substantial fraction of these devices will be placed on locations that would undergo repeated bending deformation (such as sensors for prosthetics, human body and robots) or on curved surfaces (like interior as well as exterior of automobiles, buildings and industrial equipment). Therefore, flexible sensors and actuators delivering high performance at low power requirements and manufactured at low cost will be the key for successful implementation of IoE. Though massive developments achieved in printed and organic electronics have enabled them to fulfil the required flexibility and low cost demands of IoE applications, printed and organic electronics often fall short of the high performance and low power requirements demonstrated by silicon ICs. Flexible chip foil packages fabricated by integrating ultra-thin bare silicon ICs fulfil the aforementioned demands posed by IoE applications and therefore, they are often considered as potential enablers of IoE. Here, we present an innovative roll-to-roll manufacturing compatible low cost approach for direct metal interconnection and integration of ultra-thin silicon ICs. The thickness of the fabricated flexible packages with the integrated and interconnected ultra-thin ICs were as thin as 100 μm. Electrical measurements conducted on the 60 fabricated samples with interconnected flexible ultra-thin ICs revealed a very promising yield of 94%.

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

Design of Velocity Measuring System of Car Based on MCU

2013 ◽  
Vol 373-375 ◽  
pp. 363-366
Author(s):  
Jing Sheng Yu ◽  
Hong Qiang Sun
Keyword(s):  
Mathematical Model ◽  
Power Consumption ◽  
Low Power ◽  
Control Systems ◽  
Basic Principle ◽  
High Performance ◽  
Low Cost ◽  
Measuring System ◽  
Low Power Consumption ◽  
Velocity Measuring

It describes the basic principle of velocity parameters measuring of car in operation, establishes the related mathematical model. It disigns an intelligent, integrated digital solutions to combination instrumentation of the car based on MC9S12DP256B. This system has advantages of high performance, high precision, low cost, low power consumption, good stability, sensitive respond and expandability. The system measures and shows online velocity parameters of the car. It has fuction such as safety alarm. The system reserves bus interface such as SCI and CAN, correspondences easily with other electronic engine control systems of the car.

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