Embedded solutions: Fan-out and Embedded Die Packages market and technology trends

2015 ◽  
Vol 2015 (1) ◽  
pp. 000235-000238
Author(s):  
Jérôme Azémar
Keyword(s):  
Supply Chain ◽  
Business Models ◽  
Low Cost ◽  
High Volume ◽  
Added Value ◽  
System Level ◽  
Wafer Level ◽  
High Expectations ◽  
Interesting Approach ◽  
Pcb Manufacturing

Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key players. In this presentation we will focus on two main types of embedded packages, those that are most of interest at the moment: Fan-Out and Embedded Dies packages. The principle of Fan Out technology is to embed products in a molded compound and allow redistribution layers pitch to be independent from die size. This approach is already mature enough to have high volume products claimed by Nanium and Stats ChipPAC using eWLB type of Fan-Out. Market for Fan-Out packages in 2014 almost reached $200M and a 20% growth for the coming years is expected. Understanding the potential of that market and the high demand from telecom industry for a thin and cheap package, other important OSATs like SPIL or J-Devices are willing to enter the market with their own technologies. TSMC is also proposing its inFO process to its customers, confirming that foundries could look at the OSATs reserved market through wafer-level packages. Each player has its own view on how to gain market share and meet the challenges such as cost reduction, panel manufacturing, yield improvement, die shift… The principle of Embedded die packages has the same purpose of promoting high integration due to placing chips within the substrate but with a different approach: Embedding is done in laminate substrates. This process is pushed by PCB manufacturers such as AT&S and could create a new supply chain with new players. One of the main advantages is to use a mature and cheap manufacturing chain created for PCB manufacturing and then having low cost for a technology that would allow a good integration and access to both sides of the chips easily. On the other hand, Embedded Die technologies are still waiting for a high volume project that shall be coming once higher yield, better resolution and clarification of the supply chain will be achieved. In this presentation we will describe what the strategies to reach that goal are. Both technologies seem to be competing but are actually complementary and often targeting different markets. Key customers already qualified them and will open the gates for the fast growing packaging market. The presentation will provide an overview of the products announcements, commercialization roadmaps as well as market forecasts per application. Insights and trends into the different fan-out and embedded die packaging approaches by applications, business models and major players will be reviewed.

Embedded solutions: Fan-out and Embedded Dies Packages market and technology trends

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000182-000216 ◽  
Author(s):  
Jerome AZEMAR ◽  
Rozalia BEICA ◽  
Thibault BUISSON ◽  
Andrej IVANCOVIC ◽  
Amandine PIZZAGALLI
Keyword(s):  
Supply Chain ◽  
Business Models ◽  
Low Cost ◽  
High Volume ◽  
Added Value ◽  
System Level ◽  
Wafer Level ◽  
High Expectations ◽  
Interesting Approach ◽  
Pcb Manufacturing

Embedded packages are nowadays not anymore just an interesting approach for some specific application. Benefiting from 3D TSV high cost, and consequently delays, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key players. In this presentation we will focus on two main types of embedded packages, those that are most of interest at the moment: Fan-Out and Embedded Dies packages. The principle of Fan Out technology is to embed products in a molded compound and allow redistribution layers pitch to be independent from die size. This approach is already mature enough to have high volume products claimed by Nanium and Stats ChipPAC using eWLB type of Fan-Out. Market for Fan-Out packages in 2014 almost reached $200M and a 20% growth for the coming years is expected. Understanding the potential of that market and the high demand from telecom industry for a thin and cheap package, other important OSATs like SPIL or J-Devices are willing to enter the market with their own technologies. TSMC is also proposing its inFO process to its customers, confirming that foundries could look at the OSATs reserved market through wafer-level packages. Each player has its own view on how to gain market share and meet the challenges such as cost reduction, panel manufacturing, yield improvement, die shift… The principle of Embedded dies package has the same purpose of promoting high integration due to placing chips within the substrate but with a different approach: Embedding is done in laminate substrates. This process is pushed by PCB manufacturers such as AT&S and could create a new supply chain with new players. One of the main advantages is to use a mature and cheap manufacturing chain created for PCB manufacturing and then having low cost for a technology that would allow a good integration and access to both sides of the chips easily. On the other hand, Embedded Die technologies are still waiting for a high volume project that shall be coming once higher yield, better resolution and clarification of the supply chain will be achieved. In this presentation we will describe what the strategies to reach that goal are. Both technologies seem to be competing but are actually complementary and often targeting different markets. Key customers already qualified them and will open the gates for the fast growing packaging market. The presentation will provide an overview of the products announcements, commercialization roadmaps as well as market forecasts per application. Insights and trends into the different fan-out and embedded die packaging approaches by applications, business models and major players will be reviewed.

Fan-Out Wafer-Level-Packaging: Market and Technology Trends

2016 ◽  
Vol 2016 (1) ◽  
pp. 000176-000179 ◽  
Author(s):  
Jérôme Azémar
Keyword(s):  
Cost Reduction ◽  
Flip Chip ◽  
Business Models ◽  
Semiconductor Industry ◽  
Cost Benefit ◽  
High Volume ◽  
Added Value ◽  
System Level ◽  
Wafer Level ◽  
High Expectations

Abstract The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore's law in its foundation. Advanced nodes do not bring the desired cost benefit anymore and R&D investments in new lithography solutions and devices below 10nm nodes are rising substantially. In order to answer market demands, the industry seeks further performance and functionality boosts in integration. While scaling options remain uncertain in the shorter term and continue to be investigated, the spotlight turns to advanced packages. Emerging packages such as fan-out wafer level packages and 2.5D/3D IC solutions together with more conventional but upgraded flip chip BGAs aim to bridge the gap and revive the cost/performance curve while at the same time adding more functionality through integration. Embedded packages are nowadays not anymore just an interesting approach for specific applications. Benefiting from 3D TSV high cost, these packages could fit the high expectations of the industry. Indeed, added value of embedded packages in terms of integration, reliability and even cost at system level is already clear for manufacturers. Embedded packages lacked success until 2013–2014 because of long time of qualification, few players involved and customer convincing time. The situation changed with new product announcements and strong involvement of some key players, lately most notably TSMC. In this work we will focus on one main type of embedded package of most interest at the moment: Fan-Out wafer level package. The principle of Fan-Out technology is to embed products in a mold compound and allow redistribution layer pitch to be independent from die size. This approach is already mature enough to have high volume products claimed by Nanium and JCET/Stats ChipPAC using eWLB type of Fan-Out, with many other developments from OSATs and an aggressive technology from TSMC (inFO). The market for Fan-Out packages in 2015 almost reached $500M, with potential breakthrough events in store in 2016 that could triple the 2015 market and continue further with more than 30% growth. Understanding the potential of that market and the high demand from telecom industry for a thin and cheap package, other important OSATs like Powertech or Amkor are willing to enter the market with their own technologies. TSMC is also proposing its inFO process to its customers, confirming that foundries could look at the OSATs reserved market through wafer-level packages. Each player has its own view on how to gain market share and meet the challenges such as cost reduction, panel manufacturing, yield improvement, die shift… The presentation will provide an overview of the products announcements, commercialization roadmaps as well as market forecasts per application. Insights and trends into the different fan-out packaging approaches by applications, business models and major players will be reviewed.

A University of Greenwich Case Study of Cloud Computing

2015 ◽  
pp. 1140-1161 ◽  
Author(s):  
Victor Chang ◽  
Gary Wills
Keyword(s):  
Cloud Computing ◽  
Supply Chain ◽  
Business Model ◽  
Business Models ◽  
The Other ◽  
Added Value ◽  
It Services ◽  
Success Criteria ◽  
The University

This chapter proposes a new Supply Chain Business Model in the Education domain and demonstrates how Education as a Service (EaaS) can be delivered. The implementation at the University of Greenwich (UoG) is used as a case study. Cloud computing business models are classified into eight Business Models; this classification is essential to the development of EaaS. A pair of the Hexagon Models are used to review Cloud projects against success criteria; one Hexagon Model focuses on Business Model and the other on IT Services. The UoG case study demonstrates the added value offered by Supply Chain software deployed by private Cloud, where an Oracle suite and SAP supply chain can demonstrate supply chain distribution and is useful for teaching. The evaluation shows that students feel more motivated and can understand their coursework better.

Digitalization to Reduce Tasks Without Added Value or Human Contact in a Pandemic

2021 ◽  
pp. 25-45
Author(s):  
Md. Masudul Hassan ◽  
Samira Islam Resmi
Keyword(s):  
Supply Chain ◽  
Labor Markets ◽  
Business Models ◽  
Business Processes ◽  
Added Value ◽  
Major Influence ◽  
Business Context ◽  
Sales Channels ◽  
Human Contact ◽  
Operational Costs

Digitalization is the use of technological innovations within the business context with a major influence on products, services, business processes, sales channels, and supply channels. The associated potential advantages include, among others, increased sales or productivity, innovations in price creation, and new sorts of client interaction. Global enterprises are facing supply chain issues, and consequently, potentially higher operational costs, lower inventory, and the prospects of lower demand will make them reluctant to disburse resources and time to connect in M&A and financing activities, predominantly if valuations of targets remain high. Digitalization of the supply chain (DSC) could be a way that companies can start to strategize and accomplish trade strength against supply chain disturbance. The main focus of this chapter is that digitalization enhances prosperity without human contact in a pandemic, will alter labor markets, and impacts business models.

Embedded SIP Modules for next-GEN Heterogeneous “POWER-Devices”

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000383-000407
Author(s):  
Kevin Moody ◽  
Nick Stukan
Keyword(s):  
Supply Chain ◽  
Business Models ◽  
High Reliability ◽  
Semiconductor Industry ◽  
Thermal Dissipation ◽  
System Level ◽  
Electrical Performance ◽  
Power Devices ◽  
Embedded Technology ◽  
New Device

In this paper will focus on the comprehension of System-in-Package (SiP) with embedded active and passive components integration will be described. Embedding of semiconductor chips into substrates provides many advantages that have been noted. It allows the smallest package form-factor with high degree of miniaturization through sequentially stacking of multiple layers containing embedded devices that are optimized for electrical performance with short and geometrically well controlled copper interconnects. In addition, the embedding gives a homogeneous mechanical environment of the chips, resulting in good reliability at system level. Furthermore, embedded technology is an excellent resolution to Power management challenges dealing with new device technologies (Si, GaS, GaN) and optimization on the thermal dissipation with improved efficiency. Embedded technology comes with many challenges in 2019, primarily design for manufacturability (DFM) and maturity. Customers are looking for better-performance capability and pricing normally that means same or lower than die free package cost (DFPC) comparison. This paper will discuss the challenges bring to market the Embedded SIP Modules for next-GEN Heterogeneous “POWER-Devices” Today, the embedded process is being developed by printed circuit board (PCB) manufacturers creating a new supply chain, bringing new players into the semiconductor industry. This new supply chain comes along with new business models. As a result of the increasing interest in implementing embedding technologies, ACCESS Semiconductors in China is committed to be a leader in the adaptation of embedding technologies, with over 10-yrs mature coreless technology and proved design rules for low profile dimensions with seamless Ti/Cu sputtering and Cu pillar interconnect giving advantages in both electrical & power performance. ACCESS Patented “Via-in-Frame” technology provides High Reliability (MSL1, PCT, BHAST) at Cost Effective in high panel utilization for HVM, using standard substrate/PCB known material sets, no need for wafer bumping/RDL, over-mold or under-fill cost adders. ACCESS Semiconductors is currently in HVM on single die 2L, and LVM on multi-devices actives/passives 4L SiP construction both platforms are driven from the power market segment. In-development on Die Last & Frameless (MeSiP) platforms utilizing hybrid technology (mSAP) and Photo Imageable Dielectric (PID) materials for cost down solutions in HVM by Q1FY2020. Also, ACCESS Semiconductors total turn-key solutions will include front-of-line (FOL) and end-of-line (EOL) capability from wafer handling, back-grinding, and dicing with KGD traceability thru the embedded chip process, frame/strip singulation, FT, marking pack & ship providing additional 30% cost reduction in the future. Here's an illustration of Embedded Technology Roadmap and Product Platforms.

Advanced SiP Packaging Technologies of IPD for Mobile Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 1-20
Author(s):  
Geun Sik Kim ◽  
Kai Liu ◽  
Flynn Carson ◽  
Seung Wook Yoon ◽  
Meenakshi Padmanathan
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Autonomous Systems ◽  
System Level ◽  
Design And Technology ◽  
Wafer Level ◽  
Future Technology ◽  
Rf Transceivers ◽  
And Performance ◽  
3D Stacking

IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-signal devices. Already well known as a key enabler of system-in-packages (SiPs), IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units, and digital processors. The application area for IPD will continue to evolve, especially as new packaging technology, such as flipchip, 3D stacking, wafer level packaging become available to provide vertical interconnections within the IPD. New applications like silicon interposers will become increasingly significant to the market. Currently the IPD market is being driven primarily by RF or wireless packages and applications including, but not limited to, cell phones, WiFi, GPS, WiMAX, and WiBro. In particular, applications and products in the emerging RF CMOS market that require a low cost, smaller size, and high performance are driving demand. In order to get right products in size and performance, packaging design and technology should be considered in device integration and implemented together in IPD designs. In addition, a comprehensive understanding of electrical and mechanical properties in component and system level design is important. This paper will highlight some of the recent advancements in SiP technology for IPD and integration as well as what is developed to address future technology requirements in IPD SiP solutions. The advantage and applications of SiP solution for IPD will be presented with several examples of IPD products. The design, assembly and packaging challenges and performance characteristics will be also discussed.

3D Technology Applications Market Trends & Key Challenges

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000363-000400
Author(s):  
Thibault Buisson ◽  
Amandine Pizzagalli ◽  
Eric Mounier ◽  
Rozalia Beica
Keyword(s):  
Supply Chain ◽  
Business Models ◽  
Semiconductor Industry ◽  
High Volume ◽  
Advanced Technology ◽  
Passive Component ◽  
Process Technology ◽  
3D Integration ◽  
3D Technology ◽  
Major Player

Semiconductor industry, for more than four decades, has rigorously followed Moore's Law in scaling down the CMOS technologies. Although several new materials and processes are being developed to address the challenges of future technology nodes, in the coming years they will be limited with respect to functionalities that future devices will require. As a consequence a clear trend of moving from CMOS to package and system architecture can be observed. Three-dimensional (3D) technology using the well-known Through Silicon Via (TSV) interconnect is one the emerging option, considered today the most advanced technology, that could enable various heterogeneous integration. Indeed such technology is not limited to the CMOS scaling in itself, it is rather based on bringing more functionalities by stacking different type of devices (Logic, Memory, Analog, MEMS, Passive component...) while reducing the form factor of the packaging. This functional diversification is also known as More-than-Moore. In addition, considering Known Good Die approach, each component of the 3D package could have a different manufacturer using different wafer sizes and node technology, thus bringing more complexity but also more opportunities and responsibilities to the supply chain. There are several business models identified, either using vertical integration or collaborative approach, if a dominant one will emerge or several tactics will co-exist, it is still remains a key question that need to be answered. The supply chain interaction and key players will be addressed in this presentation, including current and future standardization needs. This is today a key for the manufacturing of advanced 3D devices. 3D integration is considered today a new paradigm for the semiconductor industry, since it will drive evolution for packages for the coming decades. Due to several advantages that TSV technology can bring, several platforms have started. 3D WLCSP, 2.5D interposers & 3DIC are the main platforms that will be studied in this paper. Market forecasts in terms of wafer starts, market revenue, segments and end-products as well as supply chain activities and major player interactions will be presented. The industry has enthusiastically been waiting for mass production of 3D ICs. Although some small level of production has already been reported, the adoption rate in high volume manufacturing (HVM) is still low due to unresolved challenges that the industry still needs to address. Process technology is not fully mature, there are still many challenges in bonding and de-bonding, testing as well as thermal management that have to be overcome. Furthermore, design tools have to be fully released to enable proper 3D integration design. Looking at the time to market it is foreseen that device such as the Hybrid Memory Cube, combining high-speed logic with a multiple stacks of TSV bonded memories, will come into high volume production in 2014. This will definitely change the world of the memory market and will significantly speed up the adoption of 3D technologies. Technology roadmaps for 3D integration will also be included in the manuscript and reviewed during the presentation.

scholarly journals Corporate Social Responsibility Influencing Sustainability within the Fashion Industry. A Systematic Review

2020 ◽  
Vol 12 (21) ◽  
pp. 9167
Author(s):  
Thorey S Thorisdottir ◽  
Lara Johannsdottir
Keyword(s):  
Corporate Social Responsibility ◽  
Supply Chain ◽  
Social Responsibility ◽  
Business Models ◽  
Low Cost ◽  
Fashion Industry ◽  
Scientific Databases ◽  
Academic Publications ◽  
Architecture And Design ◽  
Corporate Social

The fashion industry, one of the largest industries in the world, is a complicated phenomenon, driven by aspirations of symbolic lifestyle and the creativity of architecture and design. It pushes the use of natural resources to its limits by mass production and a low-cost structure that motivates consumerism at large. The purpose of this study is to explore corporate social responsibility and how it influences sustainability within the fashion industry. A systematic literature review was carried out. This encompassed the academic publications available in two scientific databases focusing on Corporate Social Responsibility (CSR), sustainability, and fashion, covering the period 2003–2019. The findings indicate that the CSR approach taken by managers within the fashion industry is focused on sustainability, business models, and/or supply chain innovation, with commitments undertaken concerning the economy, environment, and/or society, wherein the production of eco-friendly products and workers’ safety are emphasized. Actions that tie CSR and sustainability with companies’ actions are presented in a micro-meso-macro framework, where brand equity, culture, supply chain management, activism, and human rights are evident. The findings of the study are relevant for academia, practitioners, and policymakers, as they provide insight into the operations and impacts of domestic and multinational fashion companies, outlining the most relevant studies on the topic, and also highlighting research trends and gaps in the field.

Logistics Providers As Integrators of Intelligent Supply Chain Systems: an Innovative Aspect

2020 ◽  
Vol 9 (2) ◽  
pp. 28-34
Author(s):  
E. Kamchatova
Keyword(s):  
Supply Chain ◽  
Supply Chains ◽  
Information And Communication Technologies ◽  
Business Models ◽  
Service Providers ◽  
Response Times ◽  
Consumer Preferences ◽  
Added Value ◽  
Innovative Technologies ◽  
Logistics Service

This article is devoted to determining the role and place of logistics providers in managing international supply chains, analyzing their classifications and transforming business models in supply chains in the context of active e-Commerce development, as well as identifying specific features of system and virtual integrators of supply chains that can significantly increase the level of logistics service. Active use of e-Commerce leads to a significant reduction in response times to demand and encourages supply chain managers to constantly search for new solutions and innovative technologies that enable companies involved in the logistics chain to effectively interact with each other and jointly respond to changing consumer demands. In some cases, we are talking about creating new approaches and replacing existing technologies aimed at achieving the set results in terms of speed and flexibility in choosing options to meet consumer demand. Thus, the analysis allows us to state that logistics mediation as a special sphere of business activity has passed the stage of formation. The prerequisites for its improvement are primarily related to the implementation of the strategy of innovative balanced development of the national economy and further development of the logistics services market. Starting with the 3PL model, all logistics service providers actively use information and communication technologies, work in both retail and e-Commerce formats, and develop on the principle of system outsourcing, creating significant added value for their customers by saving time and resources, sharing responsibilities, and responding quickly to changes in consumer preferences. We can state with confidence that if earlier logistics was considered as a function of providing business, now it determines the system way of doing business and its innovative technologies.

E-commerce logistics in supply chain management

2017 ◽  
Vol 117 (10) ◽  
pp. 2263-2286 ◽  
Author(s):  
Ying Yu ◽  
Xin Wang ◽  
Ray Y. Zhong ◽  
G.Q. Huang
Keyword(s):  
Supply Chain ◽  
Supply Chain Management ◽  
Business Models ◽  
Big Data Analytics ◽  
System Level ◽  
Asia Pacific ◽  
Furniture Industry ◽  
Chain Management ◽  
Content Type ◽  
New Business

Purpose The purpose of this paper is to present the state-of-the-art E-commerce logistics in supply chain management by investigating worldwide implementations and corresponding models together with supporting techniques via furniture industry. Design/methodology/approach Typical E-commerce logistics companies from North America, Europe, and Asia Pacific are comprehensively investigated so as to get the lessons and insights from these practices. Findings Future technologies like Internet of Things, Big Data Analytics, and Cloud Computing would be possibly adopted to enhance the E-commerce logistics in terms of system level, operational level, and decision-making level that may be real time and intelligent in the next decade. Research limitations/implications This paper takes the furniture industry for example to illustrate the E-commerce logistics and supply chain management (LSCM). Other industries like electronic appliance industry are not considered. Practical implications Opportunities and future perspectives are summarized from practical implementations so that interested parties like E-commerce and logistics companies are able to get some guidance when they are contemplating the business. Social implications E-commerce is booming with the development of new business models and will be continuously boosted in the near future. With large number of enterprises carrying out E-commerce, logistics has been largely influenced. Originality/value Insights and lessons from this paper are significant for academia and practitioners for considering E-commerce LSCM.

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