Rapid Prototyping Tape Stencils for the Application of Solder Paste

2017 ◽  
Vol 2017 (1) ◽  
pp. 000652-000658
Author(s):  
Mimi X. Yang ◽  
Karen Dowling ◽  
Debbie Senesky ◽  
H.-S. Philip Wong
Keyword(s):  
Rapid Prototyping ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Solder Paste ◽  
Electrically Conductive ◽  
Printed Circuit ◽  
Solder Bumps ◽  
Small Device ◽  
Bond Pads ◽  
Silicon Device

Abstract This works describes a promising method for rapid prototyping tape stencils for the application of solder paste. This process is appropriate for research settings requiring developmental flexibility and the ability to deal with small device dies. This work compares the volume of solder paste deposited versus aperture volume for several common tape materials and several common printed circuit board (PCB) stencil materials. The solder deposits are then reflowed to identify which aperture and solder paste parameters can generate successful solder bumps. Electrically conductive solder bonds for small bond pads (100 μm and larger) are demonstrated between silicon device dies and glass dies using this process.

Site Redressing Techniques and Rework of Lead-Free Chip Scale Packages

2003 ◽  
Author(s):  
Arun Gowda ◽  
Anthony Primavera ◽  
K. Srihari
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Printed Circuit ◽  
Free Solder ◽  
The Individual ◽  
Component Assembly ◽  
Free Area

The implementation of lead-free solder into an electronics assembly process necessitates the reassessment of the individual factors involved in component attachment and rework. A component assembly undergoes multiple thermal cycles during rework. With the use of lead-free solder, the assemblies are subjected to higher assembly and rework temperatures than those required for eutectic tin-lead assemblies. The rework of lead-free area array components involves the removal of defective component, preparation of the printed circuit board attachment pad (site redressing), solder paste replenishment or flux deposition, and component placement and reflow. This paper primarily focuses on the site redressing aspect of lead-free rework, followed by the development of rework processes for lead-free chip scale packages utilizing the knowledge gained in the site redressing studies.

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

1996 ◽  
Vol 118 (2) ◽  
pp. 101-104 ◽  
Author(s):  
John Lau ◽  
Eric Schneider ◽  
Tom Baker
Keyword(s):  
Mathematical Analysis ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Plane Shock ◽  
Printed Circuit ◽  
Flip Chips ◽  
Solder Bumps ◽  
Out Of Plane ◽  
Vibration Tests

The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy.

FTIR analysis of printed-circuit board residue

1996 ◽  
Vol 54 ◽  
pp. 264-265
Author(s):  
Sharon A. Myers ◽  
Troy D. Cognata ◽  
Hugh Gotts
Keyword(s):  
Integrated Circuit ◽  
Isopropyl Alcohol ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Ftir Analysis ◽  
Cotton Swab ◽  
Electrically Conductive ◽  
Printed Circuit ◽  
The Times ◽  
The Individual

Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resistor R161, were seen to have a slight white haze/ low gloss appearance on the surface of the PCB. To test if the residue was electrically conductive, five boards were selected whose sole failure was R161. The resistance of the individual resistors was measured with a digital multimeter (DMM). The resistor was then cleaned with isopropyl alcohol and a cotton swab. Each board was retested at ICT and the individual resistors measured again with a DMM. Cleaning the area surrounding the resistor with isopropyl alcohol, corrected the failure four of the times.

scholarly journals Design and Implementation of Solder Paste Dispenser Based on Linear Drive System

2019 ◽  
Vol 3 (2) ◽  
pp. 338
Author(s):  
Riky Tri Yunardi ◽  
Moh. Zakky Zulfiar ◽  
Rr. Wanda Auruma Putri ◽  
Deny Arifianto
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Solder Paste ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Design And Implementation ◽  
Stepper Motors ◽  
Drive Systems

In the technology to create prototypes for electronic hardware is usually constructed using surface mount device printed circuit board (SMD PCB). In this paper introduces the design and implementation of low-cost electrical solder paste dispenser that supports the PCB solder process. The design consists of a nozzle and linear drive systems based on stepper motors operating with electric power to push the plunger down to drop the solder paste on the board. To test the performance of solder paste that has been designed verified by experiment. Solder paste dispenser design was tested using SMD resistor with the solder pads of different sizes for R0603, R0805, and R1206 on PCB. The results showed that the design of the prototype was able to put the pasta in various field pads between 0.54 mm2, 0.91 mm2 and 1.44 mm2 for standard solder pads with an error in the 2% - 5%. Based on the results, the device has been shown to potentially be used to attach electronic components to printed circuit boards.

A Novel Low Cost Technique to Perform Concurrent Topside and Backside Analysis of a Bare Die

2011 ◽  
Author(s):  
Raj Kabadi ◽  
Win Thandar Swe
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Small Scale ◽  
Cover Slip ◽  
Printed Circuit ◽  
Glass Cover ◽  
Glass Cover Slip ◽  
Bond Pads

Abstract A novel low cost technique to facilitate concurrent topside and backside imaging of a bare die for optical fault localization purposes is presented. The technique overcomes the restrictions posed by unavailability of a suitable package or limited choices that may be present at a small scale packaging lab. The difficulties imposed on backside preparation of commonly used ceramic packages are overcome by providing an alternative that is relatively less expensive and easier to implement. This is accomplished by mounting the bare die on a glass cover slip using a suitable adhesive and wire bonding the bond pads to a specially designed printed circuit board. This method is being successfully utilized on multiple failure analysis requests received in our lab.

scholarly journals The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 960 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Solder Joint ◽  
Strain Energy ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Solder Paste ◽  
Element Analysis ◽  
Printed Circuit ◽  
Shock Testing ◽  
Polymer Addition

To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit board. The effect of repetitive thermal stress on the solder joints was then analyzed experimentally using thermal shock testing (−40 °C to 125 °C) over 2000 cycles. The viscoplastic stress–strain curves generated in the solder were simulated using finite element analysis, and the hysteresis loop was calculated. The growth and propagation of cracks in the solder were also predicted using strain energy formulas. It was confirmed that the epoxy paste dispersed the stress inside the solder joint by externally supporting the solder fillet, and crack formation was suppressed, improving the lifetime of the solder joint.

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