scholarly journals Thermal Decomposition of Printed Circuit Board in the Presence of Zinc Oxide under Inert and Oxidative Atmosphere: Emission Behavior of Inorganic Brominated Compounds

Engineering ◽  
2018 ◽  
Vol 10 (09) ◽  
pp. 606-615 ◽  
Author(s):  
Osamu Terakado ◽  
Shunsuke Kuzuhara ◽  
Hironori Takagi ◽  
Masahiro Hirasawa
Author(s):  
Zhixiao Zhang ◽  
Xintian Zhao ◽  
Eilhann Kwon ◽  
Marco J. Castaldi

As a result of electronic industry development in China, significant amount of Printed Circuit Board (PCBs) wastes are generated. The thermal decomposition via combustion or pyrolysis/gasification is considered to be a feasible disposal way for PCBs. To understand the consequences of pyrolysis, gasification or combustion in WTE facilities, thermo-gravimetric analysis (TGA) has been carried to characterize the thermal decomposition mechanisms and extract the kinetic parameters in various atmospheres (N2, CO2 and air) to simulate different regions in WTE applications. TGA tests in N2 atmosphere showed there was only one significant reaction in the low temperature range of 270∼350°C, which was the decomposition of epoxy resin in PCBs. The behavior in CO2 atmosphere was similar with that in N2. However, the PCBs oxidation process in air atmosphere showed two thermal decomposition steps. One was the thermal decomposition similar to the volatilization in N2 atmosphere and the second step showed oxidation behavior. Some pre-processing was investigated to explore possible benefits in WTE combustion. PCBs waste was pyrolyzed using a microwave tubular furnace. The liquid product were collected and then identified by means of gas chromatography–mass spectrometry (GC–MS). Most of the Br contained in PCBs was released into non-condensable gas in the form of HBr. The liquid product contained a large amount of phenolic compounds, bisphenol A and other aromatic compounds that can be used to produce related chemical products or used in WTE facilities. The experimental results including the thermal kinetic parameters and microwave induced pyrolysis indicate the complex mechanisms that take place during the pyrolysis of PCBs wastes.


2017 ◽  
Vol 46 (6) ◽  
pp. 3732-3737 ◽  
Author(s):  
Pham Van Thanh ◽  
Le Thi Quynh Nhu ◽  
Hong Hanh Mai ◽  
Nguyen Viet Tuyen ◽  
Sai Cong Doanh ◽  
...  

2014 ◽  
Vol 55 ◽  
pp. 7-13 ◽  
Author(s):  
Michael Jacobs ◽  
Sriram Muthukumar ◽  
Anjan Panneer Selvam ◽  
Jon Engel Craven ◽  
Shalini Prasad

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


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