Extended Discussion and Analytical Tools

2021 ◽  
pp. 119-169
Author(s):  
Anders Melander ◽  
David Andersson ◽  
Fredrik Elgh ◽  
Fredrik Fjellstedt ◽  
Malin Löfving
Keyword(s):  
Analytical Tools ◽  
Extended Discussion

In situ TEM studies of irradiation effects for materials improvement

1991 ◽  
Vol 49 ◽  
pp. 452-453
Author(s):  
Charles W. Allen
Keyword(s):  
Nuclear Reactor ◽  
Austenitic Stainless Steels ◽  
High Energy ◽  
Point Of View ◽  
In Situ Tem ◽  
Irradiation Effects ◽  
Tem Analysis ◽  
Radiation Induced ◽  
Analytical Tools

Irradiation effects studies employing TEMs as analytical tools have been conducted for almost as many years as materials people have done TEM, motivated largely by materials needs for nuclear reactor development. Such studies have focussed on the behavior both of nuclear fuels and of materials for other reactor components which are subjected to radiation-induced degradation. Especially in the 1950s and 60s, post-irradiation TEM analysis may have been coupled to in situ (in reactor or in pile) experiments (e.g., irradiation-induced creep experiments of austenitic stainless steels). Although necessary from a technological point of view, such experiments are difficult to instrument (measure strain dynamically, e.g.) and control (temperature, e.g.) and require months or even years to perform in a nuclear reactor or in a spallation neutron source. Consequently, methods were sought for simulation of neutroninduced radiation damage of materials, the simulations employing other forms of radiation; in the case of metals and alloys, high energy electrons and high energy ions.

Kritik der Politischen Ökonomie im 21. Jahrhundert.

2017 ◽  
Vol 47 (188) ◽  
pp. 453-470 ◽  
Author(s):  
Hans-Peter Büttner
Keyword(s):  
Political Economy ◽  
Critical Theory ◽  
Scientific Community ◽  
New World ◽  
Neoclassical Economics ◽  
Price Theory ◽  
Transformation Problem ◽  
Iron Cage ◽  
Analytical Tools

While the majority of the scientific community holds Marxian Value and Price Theory to be internally inconsistent because of the so-called “transformation problem”, these claims can be sufficiently refuted. The key to the solution of the “transformation problem” is quite simple, so this contribution, because it requires the rejection of simultanism and physicalism, which represent the genuine method of neoclassical economics, a method that is completely incompatible with Marxian Critique of Political Economy. Outside of the iron cage of neoclassical equilibrium economics, Marxian ‘Capital’ can be reconstructed without neoclassical “pathologies” and offers us a whole new world of analytical tools for a critical theory of capitalist societies and its dynamics.

PENGARUH MOTIVASI KERJA, KOMPETENSI, DAN KOMPENSASI TERHADAP KINERJA KARYAWAN RUMAH SAKIT UMUM DAERAH (RSUD) KABUPATEN KEPULAUAN MENTAWAI

2020 ◽  
Author(s):  
Syofrinal
Keyword(s):  
Linear Regression ◽  
Work Motivation ◽  
Regression Coefficient ◽  
Employee Performance ◽  
Primary Data ◽  
Coefficient Of Determination ◽  
Reliability Test ◽  
Mentawai Islands ◽  
Regression Test ◽  
Analytical Tools

The purpose of this study is to test the Influence of Work Motivation, Competence, and Compensation Against Performance Employees Regional General Hospital (RSUD) Mentawai Islands District. This study is a census. The data used are primary data by taking sample of 79 (seventy nine) respondents. This research uses analytical tools such as validity, reliability test, multiple linear regression test, t test, F test and coefficient of determination (R2). The results of this study illustrate that all variables have an effect on employee performance except the compensation variable. The results can be described by the equation Y = 12.752 + 0.248X1 + 0.396X2 + 0.051 X3, where X1 = Work Motivation, X2 = Competence, and X3 = Compensation. This means that the constant of 12.752 states that factors other than the variables X1, X2, and X3 that affect employee performance of 12,752. Work Motivation coefficient of 0.248 states that if the variable X1 added one unit will add the effect of employee performance of 0.248 with the assumption that the competence and compensation variables are constant. The regression coefficient X2 of 0.396 is that if the variable X2 increases one unit will increase the employee performance by 0.396 with the assumption that the variable of work motivation and compensation is constant. Furthermore, with X3 regression coefficient of 0.051. This means that with other factors considered constant, the effect of compensation is less than that of work motivation and competence.

Transmission Electron Microscopy and Scanning Capacitance Microscopy Analysis of Dislocation-Induced Leakages in n-channel I/O Transistors

2005 ◽  
Author(s):  
M.L. Anderson ◽  
P. Tangyunyong ◽  
T.A. Hill ◽  
C.Y. Nakakura ◽  
T.J. Headley ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
New Product Development ◽  
Yield Enhancement ◽  
Product Development Process ◽  
Product Lines ◽  
Scanning Capacitance Microscopy ◽  
Transmission Electron ◽  
Complementary Techniques ◽  
Analytical Tools

Abstract By combining transmission electron microscopy (TEM) [1] with scanning capacitance microscopy (SCM) [2], it is possible to enhance our understanding of device failures. At Sandia, these complementary techniques have been utilized for failure analysis in new product development, process validation, and yield enhancement, providing unique information that cannot be obtained with other analytical tools. We have previously used these instruments to identify the root causes of several yield-limiting defects in CMOS device product lines [3]. In this paper, we describe in detail the use of these techniques to identify electrically active silicon dislocations in failed SRAMs and to study the underlying leakage mechanisms associated with these defects.

Submicron Simultaneous IR and Raman Spectroscopy (IR+Raman): Breakthrough Developments in Optical Photothermal IR (O-PTIR) Combined for Enhanced Failure Analysis

2019 ◽  
Author(s):  
Jay Anderson ◽  
Mustafa Kansiz ◽  
Michael Lo ◽  
Curtis Marcott
Keyword(s):  
Raman Spectroscopy ◽  
Failure Analysis ◽  
Data Quality ◽  
Raman Spectra ◽  
Spatial Resolution ◽  
Far Field ◽  
Field Mode ◽  
Microscopic Scale ◽  
Analytical Tools ◽  
Ir And Raman

Abstract Failure analysis of organics at the microscopic scale is an increasingly important requirement, with traditional analytical tools such as FTIR and Raman microscopy, having significant limitations in either spatial resolution or data quality. We introduce here a new method of obtaining Infrared microspectroscopic information, at the submicron level in reflection (far-field) mode, called Optical-Photothermal Infrared (O-PTIR) spectroscopy, that can also generate simultaneous Raman spectra, from the same spot, at the same time and with the same spatial resolution. This novel combination of these two correlative techniques can be considered to be complimentary and confirmatory, in which the IR confirms the Raman result and vice-versa, to yield more accurate and therefore more confident organic unknowns analysis.

X-Ray Tomography for Electronic Packages

2000 ◽  
Author(s):  
Deepak Goyal
Keyword(s):  
3D Imaging ◽  
Development Time ◽  
Analytical Techniques ◽  
Electronic Packages ◽  
X Ray ◽  
Imaging Capability ◽  
Imaging Results ◽  
Key Drivers ◽  
Analytical Tools ◽  
Non Destructive

Abstract Next generation assembly/package development challenges are primarily increased interconnect complexity and density with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools/techniques to support this technical roadmap. The key challenge in the analytical tools/techniques is the development of non-destructive imaging for improved time to information. This paper will present the key drivers for the non-destructive imaging, results of literature search and evaluation of key analytical techniques currently available. Based on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized.

Analysis and Identification of Off-Odor Compounds in Electronic Systems

2006 ◽  
Author(s):  
Mary Ann Nailos ◽  
Dan Stein ◽  
Lawrence T. Nielsen ◽  
Anna Iwasinska
Keyword(s):  
Volatile Compounds ◽  
Electronic Systems ◽  
Detection Thresholds ◽  
Detection And Identification ◽  
Odor Compounds ◽  
Novel Method ◽  
Odor Analysis ◽  
Analytical System ◽  
Task Perception ◽  
Analytical Tools

Abstract The detection and identification of substances that give rise to aromas and off-odors is often a difficult task. Perception of odors is very subjective and odor detection thresholds vary from person to person. The identification of trace levels of compounds responsible for perceived odors is difficult using conventional analytical tools. This paper will focus on a novel method for sampling and analyzing aromatic volatile compounds using an analytical system specifically designed for odor analysis.

BGA and Advanced Package Wire to Wire Bonding for Backside Emission Microscopy

1999 ◽  
Author(s):  
Jim B. Colvin
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Wire Bonding ◽  
Preparation Technique ◽  
Low Profile ◽  
Normal Test ◽  
Silicon Thickness ◽  
Working Distance ◽  
Polished Side ◽  
Analytical Tools

Abstract A new method of preparation will be shown which allows traditional fixturing such as test heads and probe stations to be utilized in a normal test mode. No inverted boards cabled to a tester are needed since the die remains in its original package and is polished and rebonded to a new package carrier with the polished side facing upward. A simple pin reassignment is all that is needed to correct the reverse wire sequence after wire to wire bonding or wire to frame bonding in the new package frame. The resulting orientation eliminates many of the problems of backside microscopy since the resulting package orientation is now frontside. The low profile as a result of this technique allows short working distance objectives such as immersion lenses to be used across the die surface. Test equipment can be used in conjunction with analytical tools such as the emission microscope or focused ion beam due to the upright orientation of the polished backside silicon. The relationship between silicon thickness and transmission for various wavelengths of light will be shown. This preparation technique is applicable to advanced packaging methods and has the potential to become part of future assembly processes.

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