An Integrated Circuit for Biphasic Pulse Generator with Variable Parameters

2021 ◽  
Vol 21 (4) ◽  
pp. 286-291
Author(s):  
Shinyong Shim ◽  
Jaehoon Sung ◽  
Sung June Kim
Keyword(s):  
Integrated Circuit ◽  
Pulse Generator ◽  
Variable Parameters ◽  
Biphasic Pulse

Design and Device Mismatch Analysis of CSS–UWB Pulse Generator

2021 ◽  
Author(s):  
Saif Benali ◽  
Imen Barraj ◽  
Hatem Trabelsi
Keyword(s):  
Integrated Circuit ◽  
Spread Spectrum ◽  
Pulse Generator ◽  
Random Parameter ◽  
Pulse Frequency ◽  
Ring Oscillator ◽  
Ultra Wideband ◽  
Ramp Generator ◽  
Device Mismatch ◽  
The Impact

This paper presents the design of a Chirp Spread Spectrum (CSS), ultra-wideband (UWB), pulse generator (PG) and device mismatch impact on its performance. The proposed CSS-PG is built using a differential ring oscillator (RO) controlled by a ramp generator, allowing varying linearly the pulse frequency with time over the CSS pulse duration. Device mismatches and random variations during integrated circuit manufacturing are the most critical imperfections in high precision differential UWB voltage controlled RO circuit. These mismatches lead to behavioral variations of the PG. The proposed CSS-UWB-PG is designed and analyzed using CMOS 0.18[Formula: see text][Formula: see text]m technology. The CSS-PG presents an output swing of 266[Formula: see text]mV Vpp for 20[Formula: see text]nsec and consumes 1.72[Formula: see text]mW for a PRF of 10[Formula: see text]MHz. The simulated PSD covers the UWB low band from 3[Formula: see text]GHz to 5[Formula: see text]GHz and complies with the FCC regulations. For [Formula: see text] mismatch, the simulation results show a maximum relative accuracy on oscillation frequency and phase noise of 3.43% and 6.9%, respectively. Monte Carlo and process simulation are performed to study the impact of the random parameter variation on this CSS-PG. Theses simulations show the robustness of the proposed design as the PG PSD is still inside the FCC-UWB mask and its bandwidth is greater than 500[Formula: see text]MHz.

Development of Programmable Multichannel Biphasic Pulse Generator for FES

2017 ◽  
Vol 44 (3) ◽  
pp. 126-128
Author(s):  
Kunal Bhoyania ◽  
◽  
Chetan B.Bhatt ◽  
Chirag Panchal
Keyword(s):  
Pulse Generator ◽  
Biphasic Pulse

Research the load capacity of microcircuits

2020 ◽  
Vol 23 (3) ◽  
pp. 74-81
Author(s):  
Katerina S. Yarantseva ◽  
Gennady P. Shopin ◽  
Mikhail N. Piganov ◽  
Vladimir S. Andrusenko
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Pulse Generator ◽  
Load Capacity ◽  
Rectangular Pulse ◽  
Voltage Reference ◽  
Pulse Counter ◽  
Operating Modes ◽  
Low Levels ◽  
Definition Of

The device for the definition of the integrated circuits load-driving capability is offered. Device for determining the output capability of microcircuits refers to the field of microminiaturization and the technology of radio electronic equipment and can be used to control the parameters of microcircuits during their production. The device contains a rectangular pulse generator, an integrated circuit that is being tested, a repeater, load, a switch, an AND gate, a comparator, a pulse counter and a voltage reference, a vibrator, a reversible pulse counter, a decoder, and an indicator. Technical result when implementing the disclosed solution is high accuracy and reliability of determining load capacity of microcircuits. The proposed device allows increasing accuracy and reliability of defining circuits load-driving capacity. It also allows testing of TTL, Schottky-TTL, and MOSFET circuits. There are two switchable operating modes for testing fan-out for logical high and low levels. It is easy to replace a circuit that is being tested and load.

Waveform Analysis of a Transmission Line Pulse Generator by Use of Wavelet Transform

2014 ◽  
Vol 668-669 ◽  
pp. 1166-1169
Author(s):  
Zhen Guang Liang ◽  
Xue Gu
Keyword(s):  
Wavelet Transform ◽  
Transmission Line ◽  
Frequency Spectrum ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Pulse Generator ◽  
Frequency Component ◽  
Circuit Board ◽  
Waveform Analysis ◽  
High Frequency Component

With good repeatability and simple structure, transmission line pulse (TLP) has been used in immunity test of integrated circuit and printed circuit board. A TLP generator is first manufactured and its output waveform is presented. By using wavelet transform, the waveform is denoised and discriminated to components inherent to system function and parasitic parameters. Frequency spectrum changed with time is also obtained by continuous wavelet transform of complex morlet. Decomposed damping oscillation component and high frequency component in instant frequency spectrum show influence of inductance in circuit on the waveform. Improvement of rising time and overshoot is achieved by change of probe connection with shorter grounding line.

scholarly journals ANALISA CLOCK GENERATOR PADA RANGKAIAN POWER SUPPLY UNTUK APLIKASI TRIGER IC TTL DILABORATORIUM DIGITAL PROGRAM STUDI TEKNIK ELEKTRONIKA DI POLITEKNIK NEGERI MALANG

2021 ◽  
Vol 9 (1) ◽  
pp. 10-14
Author(s):  
Hariyanto ◽  
Rosita Ferdiyana
Keyword(s):  
Power Supply ◽  
Integrated Circuit ◽  
Pulse Generator ◽  
Clock Generator ◽  
Generator Circuit ◽  
Digital Counter ◽  
Clock Generators

The good performance of a clock generator circuit in the power supply for triger TTL IC is very influential on the success of the lab. A series. Therefore, the effectiveness of use must be adapted to its use in the practicum. To create a clock generator circuit as a source of pulses from a digital counter IC, a timer IC can be used. This pulse generator or clock generator can be used for clock sources in making counters up and down. Clock generators are often referred to as clock generators. The pulse generator in making the circuit is often used linear integrated circuit (IC: Integrated Circuit). A linear IC that is commonly used in general is usually the NE555 which is a timer IC. As a timer it can also be used analogically as a Clock Generator or pulse generator which can generally generate the frequency or time as needed.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

Characterization of RF Sputtered ZnO Piezoelectric Films Using Transmission Electron Microscope

1975 ◽  
Vol 33 ◽  
pp. 86-87
Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn
Keyword(s):  
Integrated Circuit ◽  
Acoustic Waves ◽  
New Technology ◽  
Surface Acoustic Waves ◽  
Electromechanical Properties ◽  
Leading Role ◽  
Saw Devices ◽  
Transmission Electron ◽  
High Degree

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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