scholarly journals Embedded Electronic Jacquard Guide Bar: A New Approach to Warp Knitting Using the Machine Jacquard Control System

2018 ◽  
Vol 26 (6(132)) ◽  
pp. 95-101
Author(s):  
Wen Ren ◽  
Sencai Lai
Keyword(s):  
Control System ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Communication Strategy ◽  
Circuit Board ◽  
Acrylate Copolymer ◽  
Control Scheme ◽  
Driver Circuit ◽  
Micro Controller Unit ◽  
Communication Methods

A fluorine-containing acrylate copolymer emulsion was prepared in this study, which was The jacquard control system is one of the crucial parts of a warp knitting machine. In this paper, we present a new jacquard control scheme called the embedded electronic jacquard guide bar (EEJGB). In this scheme, the Micro-Controller Unit (MCU), jacquard driver circuit, DC powers, and communication interfaces are integrated to achieve a simple structure, high reliability as well as ease of installation and maintenance. Specifically an innovative communication strategy with the advantages of fault tolerance and automatic addressing based on the Modbus serial bus is formulated. This paper describes the design of the hardware structure, communication methods of EEJGB, and printed circuit board (PCB), provided to demonstrate the feasibility of the method proposed.

Damage and Failures of CGA/BGA Assemblies Under Thermal Cycling and Dynamic Loadings

2013 ◽  
Author(s):  
Reza Ghaffarian
Keyword(s):  
Thermal Cycling ◽  
Mechanical Loading ◽  
Test Data ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Design Parameters ◽  
Mechanical Shock ◽  
Space Applications ◽  
High Processing

Commercial-off-the-shelf column/ball grid array packaging (COTS CGA/BGA) technologies in high-reliability versions are now being considered for use in high-reliability electronic systems. For space applications, these packages are prone to early failure due to the severe thermal cycling in ground testing and during flight, mechanical shock and vibration of launch, as well as other less severe conditions, such as mechanical loading during descent, rough terrain mobility, handling, and ground tests. As the density of these packages increases and the size of solder interconnections decreases, susceptibility to thermal, mechanical loading and cycling fatigue grows even more. This paper reviews technology as well as thermo-mechanical reliability of field programmable gate array (FPGA) IC packaging developed to meet demands of high processing powers. The FPGAs that generally come in CGA/PBGA packages now have more than thousands of solder balls/columns under the package area. These packages need not only to be correctly joined onto printed circuit board (PCB) for interfacing; they also should show adequate system reliability for meeting thermo-mechanical requirements of the electronics hardware application. Such reliability test data are rare or none for harsher environmental applications, especially for CGAs having more than a thousand of columns. The paper also presents significant test data gathered under thermal cycling and drop testing for high I/O PBGA/CGA packages assembled onto PCBs. Damage and failures of these assemblies after environmental exposures are presented in detail. Understanding the key design parameters and failure mechanisms under thermal and mechanical conditions is critical to developing an approach that will minimize future failures and will enable low-risk insertion of these advanced electronic packages with high processing power and in-field re-programming capability.

Advanced Materials for Printed Circuit Boards

1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Advanced Materials ◽  
Impregnation Method ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Worldwide Production ◽  
Board Industry

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

Research of Reliable Design of Printed Circuit Board Suited for Smart Grid

2012 ◽  
Vol 229-231 ◽  
pp. 1503-1506
Author(s):  
Chuan Liu ◽  
Zai Chao Huang ◽  
Peng Wu ◽  
Zhi Gang Wu ◽  
Lei Chen
Keyword(s):  
Smart Grid ◽  
Communication System ◽  
Energy Demand ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Self Healing ◽  
Stage Of Development ◽  
Pcb Design ◽  
Smart Grid Communication

Electric utilities faced with the prospect of increasing customer rates are seeking solutions to challenges presented by rising global energy demand, aging infrastructure, increasing fuel costs and renewable portfolio standards in light of climate change. Many consider Smart Grid to be one such solution. The most two significant characteristics of Smart Grid are self-healing ability and high reliability. As the bottom stage of development of Smart Grid communication system, the signal quality and self reliability of PCB design directly influence the entire performance of the communication system. This article focuses on analyzing reliable PCB design suited for Smart Grid communication system from power supply, thermal dispersion and trace routing.

High Reliability Pb-Free Printed Circuit Board Assembly

2010 ◽  
Vol 450 ◽  
pp. 9-12
Author(s):  
S.D.T. Weller ◽  
I.P. Jones ◽  
Ian M. Fox ◽  
Terry Hirst
Keyword(s):  
Process Parameters ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Electroless Nickel ◽  
Cycling Performance ◽  
Circuit Board ◽  
Optimum Process ◽  
Printed Circuit Board Assembly ◽  
Circuit Board Assembly ◽  
Lead Free Solders

The solderability and reliability of SnAgCu and SnAgCuSbBiNi lead-free solders were assessed against SnPbAg solder on a range of PCB finishes. A novel solderability test has been developed to assess the solder system’s ability to realign when a deliberately inaccurate solder stencil printing process was applied. This has shown to be an excellent way to compare PCB finishes and solders, as well as define process parameters. Electroless Nickel Immersion Gold (ENIG) finish proved to give the best solderability and the optimum process parameters were also found. SnPbAg solder has shown superior thermal cycling performance compared to SnAgCu.

scholarly journals Performance Analysis and Development of a Semiconductor Junction Rectifier with Multicolor Coding for Indoor Farm Applications

2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
E. D. Kanmani Ruby ◽  
M. Umadevi ◽  
C. Kanmani Pappa ◽  
W. Edwin Santhkumar ◽  
V. Janani ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Semiconductor Diode ◽  
Heat Management ◽  
Communication Interface ◽  
Smart Lighting ◽  
Power Regulation ◽  
Semiconductor Junction ◽  
Driver Circuit ◽  
Metal Body

This paper aims to build a smart lighting system with applications such as remote for controlling power supply and optimizing heat management in the metal body of the semiconductor diode and with a printed circuit board for agriculture. The semiconductor diode strips with multiple colors are lined up and configured as a LED lamp with proper casing and heat sink. It has a driver circuit with required power regulation that is able to control the intensity of light for photosynthesis and plant growth requirements. The system uses hydroponics to plant the water, thus decreasing the usage of fertilizers. The entire system is controlled remotely using necessary communication interface application.

New Packaging Substrate Technology,Ibss (Interpenetrating Polymer Network Build Up Structure System)

1996 ◽  
Vol 445 ◽  
Author(s):  
Motoo Asai
Keyword(s):  
Printed Circuit Board ◽  
Layer Structure ◽  
High Reliability ◽  
Low Cost ◽  
Polymer Network ◽  
High Heat ◽  
Temperature Cycling ◽  
Interpenetrating Polymer Network ◽  
Circuit Board ◽  
Structure System

AbstractWe have developed a new type of printed circuit board which is called “IBSS” (Interpenetrating polymer network Build up Structure System) for the purpose of meeting the demand of high density routing, high reliability and low cost substrates in IC packages. The new technology achieves 50μm line / 50μm space and 100μm diameter photo‐via hole. Full additive method is applied for patterning, and the build‐up method is used to form the multi‐layer structure. The newly developed photo‐imagable dielectric resin, “IPN”, which has a glass transition of 200'C, a copper peel strength of 1.5kg/cm, and withstands 1000 cycles of temperature cycling (TCB), is used for IBSS. IPN is composed of high heat resistant photo‐sensitive epoxy and supper engineering plastic. This IBSS technology is suitable for direct chip attachment. This paper presents the characteristics IBSS.

Designing Surface-Mounted Components for High Reliability

1994 ◽  
Vol 116 (3) ◽  
pp. 232-239
Author(s):  
J. Rasty ◽  
W. Kolarik ◽  
B. Chen
Keyword(s):  
Printed Circuit Board ◽  
Signal To Noise Ratio ◽  
High Reliability ◽  
Design Procedure ◽  
Circuit Board ◽  
Vibration Direction ◽  
Finite Element Software ◽  
Analysis System ◽  
Von Mises ◽  
Von Mises Stresses

Recent emphasis of the Department of Defense (DOD) on the reliability and integrity of avionics has spurred a new wave of research on this subject. This paper presents the results of a parametric investigation conducted to study the effect of vibration direction, boundary conditions, stiffeners and/or point supports, lead type, lead height, and the layout of the components on the natural frequencies and stresses exerted on a typical printed circuit board (PCB) used in avionics. The “robust design” procedure was adopted using a series of computer-simulated experiments. A finite element software, EMRC-FEAP, was utilized to estimate the maximum von Mises stresses within the critical leads, while the statistical analysis system (SAS) software was employed to analyze the natural frequency responses of the system and the signal-to-noise ratio (SNR) of the stresses induced at critical leads.

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Circuit World ◽  
2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Chong Hooi Lim ◽  
M.Z. Abdullah ◽  
I. Abdul Azid ◽  
C.Y. Khor ◽  
M.S. Abdul Aziz ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Deformation Analysis ◽  
Content Type ◽  
Printed Circuit ◽  
Bga Packages ◽  
Flexible Printed Circuit ◽  
Flow Effects

Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection. Design/methodology/approach The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu). Findings It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors. Practical implications This study provides a better understanding of the process control in FPCB assembly. Originality/value This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

Sign in / Sign up

Export Citation Format

Share Document