scholarly journals Performance Analysis and Development of a Semiconductor Junction Rectifier with Multicolor Coding for Indoor Farm Applications

2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
E. D. Kanmani Ruby ◽  
M. Umadevi ◽  
C. Kanmani Pappa ◽  
W. Edwin Santhkumar ◽  
V. Janani ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Semiconductor Diode ◽  
Heat Management ◽  
Communication Interface ◽  
Smart Lighting ◽  
Power Regulation ◽  
Semiconductor Junction ◽  
Driver Circuit ◽  
Metal Body

This paper aims to build a smart lighting system with applications such as remote for controlling power supply and optimizing heat management in the metal body of the semiconductor diode and with a printed circuit board for agriculture. The semiconductor diode strips with multiple colors are lined up and configured as a LED lamp with proper casing and heat sink. It has a driver circuit with required power regulation that is able to control the intensity of light for photosynthesis and plant growth requirements. The system uses hydroponics to plant the water, thus decreasing the usage of fertilizers. The entire system is controlled remotely using necessary communication interface application.

scholarly journals An ASIC-Based Miniaturized System for Online Multi-Measurand Monitoring of Lithium-Ion Batteries

Batteries ◽  
2021 ◽  
Vol 7 (3) ◽  
pp. 45
Author(s):  
Giuseppe Manfredini ◽  
Andrea Ria ◽  
Paolo Bruschi ◽  
Luca Gerevini ◽  
Michele Vitelli ◽  
...  
Keyword(s):  
Lithium Ion Batteries ◽  
Printed Circuit Board ◽  
Lithium Ion ◽  
Cell Voltage ◽  
Circuit Board ◽  
Communication Interface ◽  
Sensor Interface ◽  
Direct Measurements ◽  
In Series ◽  
A Cell

To better asses the ageing and to reduce the hazards involved in the use of Lithium-Ion Batteries, multi-measurand monitoring units and strategies are urged. In this paper, a Cell Management Unit, based on the SENSIPLUS chip, a recently introduced multichannel, multi-mode sensor interface, is described. SENSIPLUS is a single System on a Chip combined with a reduced number of external components, resulting in a highly miniaturized device, built on 20 × 8 mm2 printed circuit board. Thanks to SENSIPLUS’ versatility, the proposed system is capable of performing direct measurements (EIS, cell voltage) on the cell it is applied to, and reading different kinds of sensors. The SENSIPLUS versatile digital communication interface, combined with a digital isolator, enable connection of several devices to a single bus for parallel monitoring a large number of cells connected in series. Experiments performed by connecting the proposed system to a commercial Lithium-Ion Battery and to capacitive and resistive sensors are described. In particular, the capability of measuring the cell internal impedance with a resolution of 120 μΩ is demonstrated.

scholarly journals Embedded Electronic Jacquard Guide Bar: A New Approach to Warp Knitting Using the Machine Jacquard Control System

2018 ◽  
Vol 26 (6(132)) ◽  
pp. 95-101
Author(s):  
Wen Ren ◽  
Sencai Lai
Keyword(s):  
Control System ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Communication Strategy ◽  
Circuit Board ◽  
Acrylate Copolymer ◽  
Control Scheme ◽  
Driver Circuit ◽  
Micro Controller Unit ◽  
Communication Methods

A fluorine-containing acrylate copolymer emulsion was prepared in this study, which was The jacquard control system is one of the crucial parts of a warp knitting machine. In this paper, we present a new jacquard control scheme called the embedded electronic jacquard guide bar (EEJGB). In this scheme, the Micro-Controller Unit (MCU), jacquard driver circuit, DC powers, and communication interfaces are integrated to achieve a simple structure, high reliability as well as ease of installation and maintenance. Specifically an innovative communication strategy with the advantages of fault tolerance and automatic addressing based on the Modbus serial bus is formulated. This paper describes the design of the hardware structure, communication methods of EEJGB, and printed circuit board (PCB), provided to demonstrate the feasibility of the method proposed.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint

2004 ◽  
Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Gold Surface ◽  
Circuit Board ◽  
Lead Free ◽  
Processing Temperature ◽  
The European Union ◽  
Printed Circuit ◽  
Higher Temperature ◽  
Tin Silver Copper

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.

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