Thermal Budget for Fabricating A Dual Gate Deep-Submicron CMOS with Thin Pure Gate Oxide

1995 ◽  
Author(s):  
Kunihiro Suzuki ◽  
Akira Satoh ◽  
Takayuki Aoyama ◽  
Itaru Namura ◽  
Fumihiko Inoue ◽  
...  
1996 ◽  
Vol 35 (Part 1, No. 2B) ◽  
pp. 1496-1502 ◽  
Author(s):  
Kunihiro Suzuki ◽  
Akira Satoh ◽  
Takayuki Aoyama ◽  
Itaru Namura ◽  
Fumihiko Inoue ◽  
...  

2003 ◽  
Vol 42 (Part 1, No. 4B) ◽  
pp. 1892-1896 ◽  
Author(s):  
Chihoon Lee ◽  
Donggun Park ◽  
Namhyuk Jo ◽  
Chanseong Hwang ◽  
Hyeong Joon Kim ◽  
...  

2001 ◽  
Vol 37 (12) ◽  
pp. 788 ◽  
Author(s):  
Shyh-Fann Ting ◽  
Yean-Kuen Fang ◽  
Chien-Hao Chen ◽  
Chih-Wei Yang ◽  
Mo-Chiun Yu ◽  
...  

2008 ◽  
Vol 48 (11-12) ◽  
pp. 1786-1790 ◽  
Author(s):  
Y.T. Chiang ◽  
Y.K. Fang ◽  
Y.J. Huang ◽  
T.H. Chou ◽  
S.Y. Yeh ◽  
...  

2000 ◽  
Vol 610 ◽  
Author(s):  
G. Curello ◽  
R. Rengarajan ◽  
J. Faul ◽  
H. Wurzer ◽  
J. Amon ◽  
...  

AbstractIn this work, we report on the effect of different dual gate oxide (DGox) processes on the electrical properties of CMOS devices in deep submicron embedded DRAM (eDRAM) technology. Also discussed, is the effect of N+ Ion Implantation on the diffusion / segregation behaviour of B and In channel dopants. In particular, it will be shown that the N+ dose required to obtain a certain combination of dual gate oxide thickness varies with the gate oxide process. Effects of N+ dose on the In and B channel profiles are studied using SIMS. The impact of “thickness-equivalent” DGox processes on short channel effect (SCE) and carrier mobility is analyzed and tradeoffs for optimization of device performances are discussed.


2001 ◽  
Vol 48 (10) ◽  
pp. 2310-2316 ◽  
Author(s):  
In-Ho Nam ◽  
Jae Sung Sim ◽  
Sung In Hong ◽  
Byung-Gook Park ◽  
Jong Duk Lee ◽  
...  

2000 ◽  
Author(s):  
T. Ogura ◽  
H. Kotaki ◽  
S. Kakimoto ◽  
S. Zaima ◽  
Y. Yasuda

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