Kinetic Study of the Atmospheric Oxidation of a Series of Epoxy Compounds by OH Radicals

The kinetics of the gas-phase reactions of hydroxyl radicals with cyclohexene oxide (CHO), 1,2-epoxyhexane (EHX), 1,2-epoxybutane (12EB), trans-2,3-epoxybutane (tEB) and cis-2,3-epoxybutane (cEB) have been investigated using the relative rate technique. The experiments have been performed at (298 ± 3) K and (760 ± 10) Torr total pressure of synthetic air using different reference compounds in a 1080 l Quartz Reactor (QUAREC) and a 480 l Duran glass chamber. The following room temperature rate coefficients (cm3 molecule−1 s−1) were obtained: k1 (OH+CHO) = (5.93 ± 1.78) × 10−12, k2 (OH+EHX) = (5.77 ± 1.29) × 10−12, k3 (OH+12EB) = (1.98 ± 0.39) × 10−12, k4 (OH+cEB) = (1.50 ± 0.26) × 10−12, k5 (OH+tEB) = (1.81 ± 0.42) × 10−12. With the exception of previous studies for 1,2-epoxybutane and cyclohexene oxide, this is to the best of our knowledge the first kinetic study of the reaction of these compounds with OH radicals. Atmospheric lifetimes, reactivity trends and atmospheric implications are discussed considering the epoxy compound rate coefficients obtained in the present study. In addition to a direct comparison with the literature data where possible, the results from the present study are compared with values estimated from the Structure Activity Relationship method.

Усиление внутреннего слоя многослойного композита базальтопластиком в виде сотовой структуры

In our studies we present a multilayer structure consisting of outer layers of two-ply basalt composed of basalt fabric impregnated with an epoxy compound and an inner layer of polyurethane reinforced with basalt, having the same composition, formed in conjugate hexagonal prisms, and forming a cellular framework. The main part describes the technological sequence of obtaining basalt face layers, basalt hexagonal cellular frame, and filling it with a liquid reaction mass of rigid polyurethane system. The formation of a single multilayer composite structure is shown. We also present the results of the experimental research of strength of a laminated composite and its inner layer without facing layers when tested for static bending with concentrated load increasing at a constant rate and compression testing up to 10% of relative deformation. It describes the effect of the size of hexagonal prismatic cells of the frame on the physical and mechanical characteristics of the middle layer. The reduction of the cell size results in the increase of the composite strength. The dependence of the composite density on the size of the cells of the basalt frame has been studied.

Research of physically modified antifriction-wear-resistant composite polymer materials and coatings on their basis for machine-building purpose

The article presents the results of studies of the tribotechnical properties of composite thermosetting polymeric materials based on an epoxy compound and ultrasonicated oligomeric fillers operating under conditions of contact interaction with a pulp using the example of raw cotton. Regularities of changes in tribotechnical properties (coefficient of friction, intensity of wear) of composite thermosetting epoxy polymeric materials associated with their filling with organomineral fillers and ultrasonic treatment, in contact with raw cotton have been revealed. The temperature and the magnitude of the electrostatic charge arising in the friction zone of rubbing polymer- cotton and composite-cotton pairs on the type and content of organic-mineral fillers were studied.

Temperature-Triggered/Switchable Thermal Conductivity of Epoxy Resins

The pronouncedly low thermal conductivity of polymers in the range of 0.1–0.2 W m−1 K−1 is a limiting factor for their application as an insulating layer in microelectronics that exhibit continuously higher power-to-volume ratios. Two strategies can be applied to increase the thermal conductivity of polymers; that is, compounding with thermally conductive inorganic materials as well as blending with aromatic units arranged by the principle of π-π stacking. In this study, both strategies were investigated and compared on the example of epoxy-amine resins of bisphenol A diglycidyl ether (BADGE) and 1,2,7,8-diepoxyoctane (DEO), respectively. These two diepoxy compounds were cured with mixtures of the diamines isophorone diamine (IPDA) and o-dianisidine (DAN). The epoxy-amine resins were cured without filler and with 5 wt.-% of SiO2 nanoparticles. Enhanced thermal conductivity in the range of 0.4 W·m−1·K−1 was observed exclusively in DEO-based polymer networks that were cured with DAN (and do not contain SiO2 fillers). This observation is argued to originate from π-π stacking of the aromatic units of DAN enabled by the higher flexibility of the aliphatic carbon chain of DEO compared with that of BADGE. The enhanced thermal conductivity occurs only at temperatures above the glass-transition point and only if no inorganic fillers, which disrupt the π-π stacking of the aromatic groups, are present. In summary, it can be argued that the bisphenol-free epoxy-amine resin with an epoxy compound derivable from natural resources shows favorably higher thermal conductivity in comparison with the petrol-based bisphenol-based epoxy/amine resins.

The Impact of the Acidic Environment on the Mechanical Properties of Epoxy Compounds in Different Conditions

The aim of this work was to determine the impact of the acidic environment on the mechanical properties of two epoxy compounds in different conditions. The samples were made from the epoxy compounds composed of the epoxy resin (based on Bisphenol A), triethylenetetramine curing agent (unmodified compound), and calcium carbonate (CaCO3) (modified compound). The epoxy compound samples were seasoned for the following period of time (i.e., one week, one month, and three months). The environment was tap water and the acidic environment had three different concentrations of acetic acid (3%, 6%, and 9%). Strength tests of the epoxy compound samples were carried out in accordance with the ISO 604 standard. In the case of the modified composition, it is noted that the samples immersed in tap water were characterized by a higher strength than in acidic environments. A similar tendency was observed for unmodified compositions, although the differences were smaller than for the modified compositions. It was also noticed that the increase in the pH of the acidic solution in many analyzed cases contributed to the decrease in mechanical properties, although the immersion time in the acidic solution is important.

Bisphenol-Free Epoxy Resins Derived from Natural Resources Exhibiting High Thermal Conductivity

Polymers commonly have low thermal conductivity in the range of 0.1–0.2 W·m−1·K−1, which is a limiting factor for their usage in the course of continuously increasing miniaturization and heat generation in electronic applications. Two strategies can be applied to increase the transport of phonons in polymers: (i) the embedment of thermally conductive inorganic materials and (ii) the involvement of aromatic units enabling anisotropy by π–π stacking. In this study, the thermal conductivity of resins based on bisphenol A diglycidyl ether BADGE and 1,2,7,8-diepoxyoctane DEO was compared. DEO can be derived from pseudo-pelletierine, which is contained in the bark of the pomegranate tree. The epoxy compounds were cured with isophorone diamine IPDA, o-dianisidine DAN, or mixtures of the both diamines. Notably, isophorone diamine is derived from isophorone of which the latter naturally occurs in cranberries. The formulations were produced without filler or with 5 wt.-% of SiO2 nanoparticles. Significantly enhanced thermal conductivity in the range of 0.4 W·m−1·K−1 occurs only in DEO-based polymer networks that were cured with DAN (and do not contain SiO2 fillers). This observation is argued to originate from π–π stacking of the aromatic units of DAN enabled by the higher flexibility of the aliphatic carbon chain of DEO compared to that of BADGE. This assumption is further supported by the facts that significantly improved thermal conductivity occurs only above the glass-transition temperature and that nanoparticles appear to disrupt the π–π stacking of the aromatic groups. In summary, it can be argued that the bisphenol-free epoxy/amine resin with an epoxy compound derivable from natural resources shows favorably higher thermal conductivity in comparison to the petrol-based epoxy/amine resins.

An Experimental Study to Determine Mechanical and Thermophysical Characteristics of Thin-Walled Carbon Plastic Antenna Reflectors

High requirements are imposed on the mass and dimensional stability of reflectors of onboard mirror space antennas in promising communication satellites. To meet these requirements, new design and layout schemes for reflectors using composite materials are being developed. The use of flat reinforced carbon fabric composites in these designs is of particular interest. A technique is developed for the experimental determination of mechanical and thermophysical characteristics of the carbon fiber used in a thin-walled shell (0.6 mm) of the onboard space antenna reflector. Data are obtained on the elastic modulus of the carbon fiber based on Aspro-A80 carbon fabric and Huntsman Araldite LY8615 US/XB 5173 Hardener epoxy compound in two directions. The thermal conductivity of the material in the plane of reinforcement is determined.

The influence of mold temperature on thermoset in-mold forming

A new process, called thermoset in-mold forming, for combining thermoset master forming and thermoset forming in one mold is in development. A pre-impregnated continuous-fiber reinforced sheet based on epoxy (prepreg) is formed in the injection molding machine, followed by instantaneous overmolding of a short-fiber reinforced epoxy compound in one step. Compared with conventional processes in which thermoset injection molding, prepreg compression molding, and hence curing of the materials are separated, the new process allows for the combination in one step and simultaneous curing of both components. The result is a hybrid component, which features a continuous-fiber reinforced part for higher mechanical performance and a short-fiber reinforced part with high design freedom for integration of additional functions. For a successful combination of both materials in one process, it is essential to investigate the bond strength between them in relation to the processing parameters and their influence on the degree of cure. This paper analyzes the influence of the mold temperature in this process on curing degree, bond strength, and the processing viscosity.