Overview of Whisker-Mitigation Strategies for High-Reliability Electronic Systems

2016 ◽  
pp. 159-186
Author(s):  
David Pinsky
Keyword(s):  
High Reliability ◽  
Mitigation Strategies ◽  
Electronic Systems

Evolution of Fault Self-Repairing Circuit with High Reliability

2013 ◽  
Vol 462-463 ◽  
pp. 654-657
Author(s):  
Jian An Lou ◽  
Yang Li ◽  
Jian Hua Yu
Keyword(s):  
Evolutionary Algorithm ◽  
System Design ◽  
Continuous Improvement ◽  
High Reliability ◽  
Structure And Function ◽  
Digital System ◽  
Electronic Systems ◽  
Electromagnetic Environment ◽  
Digital System Design ◽  
And Function

With the continuous improvement of the complexity of the microelectronic system, its reliability risk is becoming more and more obvious. In order to improve the reliability of electronic systems in complex electromagnetic environment, this paper proposes a new fault self-repairing method; the idea is to realize controllable silicon evolution on the FPGA. A MicroBlaze CPU and VRC array are designed, and the CPU runs the evolutionary algorithm to configure the VRC array, dynamically changing the structure and function of the circuit, so as to obtain high reliability of the digital fault self-repairing circuit. Evolving fault self-repairing technology provides a new way for the high reliability of the digital system design.

The Method of Modeling Thermal Process for High Reliability On-Board Radio-Electronic Systems

2020 ◽  
Author(s):  
Yury N. Kofanov ◽  
Ekaterina Yu. Kozlova ◽  
Egor Yu. Poluyko ◽  
Victoria K. Malievskaya ◽  
Lusine E. Mirzoyan ◽  
...  
Keyword(s):  
Thermal Process ◽  
High Reliability ◽  
Electronic Systems ◽  
Radio Electronic

Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging

2014 ◽  
Vol 783-786 ◽  
pp. 2758-2764
Author(s):  
Chang Woo Lee ◽  
Young Ki Ko ◽  
Yong Ho Ko ◽  
Jung Hwan Bang
Keyword(s):  
High Speed ◽  
Composite Solder ◽  
High Reliability ◽  
Low Cost ◽  
Molten Solder ◽  
Electronic Systems ◽  
Filling Material ◽  
3 Dimensional ◽  
Cu Pillar Bump ◽  
3D Packaging

The development of 3D integration is necessarily required for high speed, high density, small size, and multi-functional electronic devices. Through silicon via (TSV) technology has been rapidly developed to fulfill the demand of the next generation of multifunctional electronic systems as one of the most alternative applications for 3D packaging. In this study, low cost and high speed molten solder-filling of TSV and bonding process by using micro bump was investigated. Micro bumps were formed with two step, Cu pillar bump and Sn-Ag cap bump by using electroplating. The size of micro-bumps was 10 and 20um and the precise content of the bump was developed with good planarity by adding reflow process. Additionally, the SiC nanoparticle composite solder was fabricated for low CTE filling material. From the results, it is possible that the CTE of composite solder added 1.0wt% SiC nanoparticles had decreased until 15.0ppm/°C. Comparing CTE of pure Sn, which was about 24.0ppm/°C, it was very low CTE and lower then CTE of Cu (16.5ppm/°C). Even if the electrical resistance of nanopowder composite solder is increased, the increasing rate is very slow until 1.0 wt%. However, the resistance changing rate is rapidly increased over the 1.0wt%. From the result, it is expected that nanopowder composite solder can contribute high reliability of molten solder filling TSV.

scholarly journals Electrical Machines and Power Electronics for Starter-Generators in More Electric Aircrafts: A Technology Review

2019 ◽  
Author(s):  
Jonas Kristiansen Nøland ◽  
Matteo Leandro ◽  
Jon Are Suul ◽  
Marta Molinas ◽  
Robert Nilssen
Keyword(s):  
Power Systems ◽  
High Reliability ◽  
Power Conversion ◽  
Integrated System ◽  
Electrical Machines ◽  
Electronic Systems ◽  
Power Electronic ◽  
Electric Aircraft ◽  
Potential Benefits ◽  
Open Issues

<div>Safety-critical power conversion systems play a major role in the paradigm shift towards more electric aircraft (MEA) architectures. This paper reviews the electrical machines and their power electronic systems that are currently competing in the application of integrated starter-generators (S/Gs) in MEA power systems. Motivated by the strict requirements of sufficient electrical starting capability, super-high power density and ultra-high reliability, additional considerations on the overall system design are necessary, including the power electronic converters (PECs) and integrated thermal designs. These aspects are discussed not only in the light of their many benefits but also of the challenges introduced by the continuous advancements and emerging innovations in the power conversion technology. In achieving the MEA goals and capitalize on all potential benefits, optimization-based design approaches will be necessary, where the aggregation of electric machines, PECs and the aircraft grid is considered as an integrated system to be optimized. This review highlights the importance of these aspects and offers a view on future perspectives and open issues.</div>

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Mahendra Harsha ◽  
Jeff Suhling ◽  
Kai Goebel
Keyword(s):  
Thermal Cycling ◽  
Microstructural Evolution ◽  
Thermal Aging ◽  
Prolonged Exposure ◽  
Residual Life ◽  
High Reliability ◽  
Electronic Systems ◽  
Damage Initiation ◽  
Aging Conditions ◽  
Insight Into

Electronics in high reliability applications may be stored for extended periods of time prior to deployment. Prior studies have shown the elastic modulus and ultimate tensile strength of the SAC leadfree alloys reduces under prolonged exposure to high temperatures [Zhang 2009]. The thermal cycle magnitudes may vary over the lifetime of the product. Long-life systems may be re-deployed several times over the use life of the product. Previously, the authors have identified damage pre-cursors for correlation of the damage progression with the microstructural evolution of damage in second level interconnects [Lall 2004a-d, 2005a-b, 2006a-f, 2007a-e, 2008a-f, 2009a-d, 2010a-j]. Leadfree assemblies with Sn3Ag0.5Cu solder have been subjected to variety of thermal aging conditions including 60°C, 85°C and 125°C for periods of time between 1-week and 2-months, thermal cycling from −55°C to 125°C, −40°C to 95°C and 3°C to 100°C. The presented methodology uses leading indicators of failure based on microstructural evolution of damage to identify accrued damage in electronic systems subjected to sequential stresses of thermal aging and thermal cycling. Damage equivalency relationships have been developed to map damage accrued in thermal aging to the reduction in thermo-mechanical cyclic life based on damage proxies. Accrued damage between different thermal cyclic magnitudes has also been mapped for from −55°C to 125°C, −40°C to 95°C and 3°C to 100°C thermal cycles. The presented method for interrogation of the accrued damage for the field deployed electronics, significantly prior to failure, may allow insight into the damage initiation and progression of the deployed system. The expected error with interrogation of system state and assessment of residual life has been quantified.

Sensor Integration: Feynman or Moore?

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 000001-000051
Author(s):  
Benedetto Vigna
Keyword(s):  
High Reliability ◽  
Semiconductor Industry ◽  
Manufacturing Cost ◽  
Electronic Systems ◽  
Silicon Sensors ◽  
Industrial Internet ◽  
Future Challenges ◽  
New Business ◽  
Manufacturing Techniques ◽  
New Generation

Sensors are all around us: they are in cars, in smartphones, in factories, in pacemakers, in drones, in smart speakers and in many other places with the ultimate goal to sense and to monitor parameters of importance and interest in our daily environment. They play an essential bridge between electronic systems and the user or environment. Today they already enable a multibillion dollar industry and they continue to create new business opportunities in many markets, such as automotive, consumer and personal electronics. Most importantly they are the enablers of emerging applications in Healthcare Industry and Industrial Internet of Things. There is no doubt that sensors will leave a sign in the new generation of home and factory robots, the autonomous cars, enabled by Artificial Intelligence. Thanks to their high reliability, high performances and low manufacturing cost, the most commercially successfull sensors available today are realized in silicon (i.e. Image Sensors and MEMS) and they use the same manufacturing techniques of the CMOS industry, whose evolution has been dictated by the famous G. Moore's law. Since the market for silicon sensors has been much smaller than overall semiconductor industry, sensors have been always classified as part of the so called “More than Moore” world. There are many books, article and publications on “More than Moore” subject, but considering the strong contribution to the sector given by the visionary Nobel Prize P. R. Feynman, envisioning the possibility to miniaturize the microsystems and to stack specialized silicon wafers to realize a complex versatile microsystem, time is come to see the Sensors as part of the “Feynman Roadmap” instead of “More than Moore” roadmap. After an extensive look-back over the current situation, this talk will address the future challenges of “Feynman Roadmap.”

BRUSH WELLMAN ALLOY 360

Alloy Digest ◽  
1985 ◽  
Vol 34 (11) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
High Performance ◽  
High Reliability ◽  
Heat Treating ◽  
Electronic Systems ◽  
Heavy Duty ◽  
Mechanical And Physical Properties

Abstract BRUSH WELLMAN ALLOY 360 combines unique mechanical and physical properties required in high reliability electrical/electronic systems, heavy-duty controls, electromechanical devices and other high-performance applications. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, joining, and surface treatment. Filing Code: Ni-326. Producer or source: Brush Wellman Inc..

Application of EMI Filter in Design of Switching Power Supply

2013 ◽  
Vol 385-386 ◽  
pp. 1305-1308
Author(s):  
Pan Feng Guo ◽  
Jian Song ◽  
Hong Zhang ◽  
Xin Li ◽  
Rui Lu
Keyword(s):  
Power Supply ◽  
High Reliability ◽  
Power Converter ◽  
Experimental Results ◽  
Electronic Systems ◽  
Power Electronic ◽  
Switching Power Supply ◽  
Switching Power ◽  
Output Waveform ◽  
Emi Filter

Because of its high reliability and stable output, switching power supply is widely used in power electronic systems, but it is can not be ignored that its self-generated electromagnetic has a profound effect on the whole system. In order to suppress conducted interference generated by switching power supply, this article proposed a cascaded technology about the integrated EMI filter, and a simulation is carried out for the power converter output waveform. Experimental results show that this cascaded technology about the integrated EMI filter has a good inhibition on the harmonic.

Anti-Radiation Design and Irradiation Test of Antifuse FPGA

2013 ◽  
Vol 380-384 ◽  
pp. 3249-3253
Author(s):  
Kai Feng Zhang ◽  
Shang Feng Chen ◽  
Shan Zhu Xiao
Keyword(s):  
Heavy Ions ◽  
Design Method ◽  
High Reliability ◽  
Space Environment ◽  
Low Power Consumption ◽  
Electronic Systems ◽  
Test Results ◽  
Single Event ◽  
Space Applications ◽  
Irradiation Test

Antifuse FPGA because for its low power consumption, high reliability, high security, etc., are widely used in space electronic systems. However, antifuse FPGA running in the space environment is also vulnerable to space radiation. This paper analyzes the single event effects in antifuse FPGA in detail and put forward the TMR and EDAC anti-SEE hardening design and implementation methods. The ground heavy ions accelerated test is conducted to verify the design of hardening; test results and analysis show that the hardening design method can effectively improve the COTS antifuse FPGA for space applications reliability.

Power Supply Prognostics and Health Management of High Reliability Electronic Systems in Rugged Environment

2011 ◽  
Vol 474-476 ◽  
pp. 1195-1200 ◽  
Author(s):  
Yong Guan ◽  
Sheng Zhen Jin ◽  
Li Feng Wu ◽  
Wei Pan ◽  
Yong Mei Liu ◽  
...  
Keyword(s):  
Power System ◽  
Embedded System ◽  
Power Supply ◽  
Health Management ◽  
High Reliability ◽  
Electronic System ◽  
Fixed Time ◽  
Electronic Systems ◽  
Prognostics And Health Management ◽  
Healing Model

The high reliable embedded system in rugged environment has huge potential application value. There are 34% faults in electronic system by the cause of the fault of power system. So the prognostics mechanism and the algorithm of power health has been a core support technology in applications. the fault and the deterioration and healing model of the power system in rugged environment is constructed by analysis of FFP, DFP and healing(alleviation)for improving the reliability, the usability and the maintainability. And many questions such as fixed-time maintenance and back-down maintenance depending on conventional statistical method are solved fundamentally. Finally, the prognostics and health management methods of power health in domestic and foreign presently are contrasted and analyzed.

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