Positive threshold voltage shift in AlGaN/GaN HEMTs with p-type NiO gate synthesized by magnetron reactive sputtering

2018 ◽  
Vol 462 ◽  
pp. 799-803 ◽  
Author(s):  
Tong Zhang ◽  
Lei Wang ◽  
Xiaobo Li ◽  
Yuyu Bu ◽  
Taofei Pu ◽  
...  
2019 ◽  
Vol 66 (6) ◽  
pp. 2544-2550 ◽  
Author(s):  
Sayak Dutta Gupta ◽  
Ankit Soni ◽  
Vipin Joshi ◽  
Jeevesh Kumar ◽  
Rudrarup Sengupta ◽  
...  

2007 ◽  
Vol 1035 ◽  
Author(s):  
Maria Merlyne De Souza ◽  
Richard B Cross ◽  
Suhas Jejurikar ◽  
K P Adhi

AbstractThe performance of ZnO TFTs fabricated via RF sputtering, with Aluminium Nitride (AlN) as the underlying insulator are reported. The surface roughness of ZnO with AlN is lower than that with SiN by at least 5 times, and that with SiO2 by 30 times. The resulting mobility for the three insulators AlN, SiN, SiO2 using identical process is found to be 3, 0.2-0.7 and 0.1-0.25 cm2/Vs respectively. There does not appear to be any corresponding improvement in the stability of the AlN devices. The devices demonstrate significant positive threshold voltage shift with positive gate bias and negative threshold voltage shift with negative gate bias. The underlying cause is surmised to be ultra-fast interface states in combination with bulk traps in the ZnO.


2014 ◽  
Vol 3 (6) ◽  
pp. Q120-Q126 ◽  
Author(s):  
M. K. Bera ◽  
Y. Liu ◽  
L. M. Kyaw ◽  
Y. J. Ngoo ◽  
S. P. Singh ◽  
...  

2009 ◽  
Vol 56 (12) ◽  
pp. 3203-3206 ◽  
Author(s):  
Jone F. Chen ◽  
Kuen-Shiuan Tian ◽  
Shiang-Yu Chen ◽  
Kuo-Ming Wu ◽  
J. R. Shih ◽  
...  

2021 ◽  
pp. 1-1
Author(s):  
Hui Guo ◽  
Hehe Gong ◽  
Pengfei Shao ◽  
Xinxin Yu ◽  
Jin Wang ◽  
...  

2012 ◽  
Vol 2012 ◽  
pp. 1-4 ◽  
Author(s):  
Bradley D. Christiansen ◽  
Eric R. Heller ◽  
Ronald A. Coutu ◽  
Ramakrishna Vetury ◽  
Jeffrey B. Shealy

Reports to date of GaN HEMTs subjected to forward gate bias stress include varied extents of degradation. We report an extremely robust GaN HEMT technology that survived—contrary to conventional wisdom—high forward gate bias (+6 V) and current (>1.8 A/mm) for >17.5 hours exhibiting only a slight change in gate diode characteristic, little decrease in maximum drain current, with only a 0.1 V positive threshold voltage shift, and, remarkably, a persisting breakdown voltage exceeding 200 V.


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