Analysis of nano-creep deformation of epoxy adhesive in optical fiber connector for long-term reliability prediction

2019 ◽  
Vol 52 ◽  
pp. 101975 ◽  
Author(s):  
Kota Shikama ◽  
Atsushi Aratake ◽  
Yasuhiro Koike
2001 ◽  
Vol 124 (1) ◽  
pp. 54-58 ◽  
Author(s):  
Shan-Tung Tu ◽  
Jian-Ming Gong ◽  
Xiang Ling ◽  
Xiao-Yuan He

Creep deformation localization is a common occurrence generally found in high temperature components, typically at weldments and geometrical discontinuities. The deformation in a small region cannot be measured by a conventional displacement gage. A new technique for measuring long-term local creep deformation was developed. It uses quartz optical fiber marking, remote monitoring, and image processing. Long-term measurements of the creep deformations of base metal, weld metal, and heat-affected zone in cross-weld specimens were performed at high temperature, which verify the new technique. Strain distributions and evolutions in the weldments are obtained.


2014 ◽  
Vol 624 ◽  
pp. 712-714
Author(s):  
Pei Yun Ao

According to the structural characteristics of optical fiber connector Ceramic insert core, this article analyzed the structure technology of it. Based on Mold wizard module and Pro/Moldsign module. We conducted injection mold design of optical fiber connector ceramic insert core; Put forward the flow characteristics of zirconia powder injection feeding and binder, lubricants and other additive formulation.


2021 ◽  
Vol 21 (8) ◽  
pp. 4444-4449
Author(s):  
Bongjin Chung ◽  
Shin Sungchul ◽  
Jaeho Shim ◽  
Seongwoo Ryu

Epoxy adhesive was analyzed under long term thermal aging and mechanical properties and chemical degradation were observed by X-ray photoelectron spectroscopy (XPS). Long term thermal exposure of epoxy causes a noticeable reduction in adhesive properties. We developed a predictive model of temperature and time dependent aging. The temperature dependent aging behavior of epoxy adhesive shows good agreement with conventional Arrhenius equations. Using XPS analysis, we also discovered a correlation between chemical degradation and the adhesive properties. Decay of C–C bonding ratio induced chain-scission of epoxy adhesive; increase of total numbers of C–O and C═O induced oxidation of epoxy adhesive during thermal exposure.


Sensors ◽  
2018 ◽  
Vol 18 (11) ◽  
pp. 3754 ◽  
Author(s):  
Yongji Yan ◽  
Xu Zhang ◽  
Haopeng Li ◽  
Yu Ma ◽  
Tianci Xie ◽  
...  

A novel ultraviolet (UV) optical fiber sensor (UVOFS) based on the scintillating material La2O2S:Eu has been designed, tested, and its performance compared with other scintillating materials and other conventional UV detectors. The UVOFS is based on PMMA (polymethyl methacrylate) optical fiber which includes a scintillating material. Scintillating materials provide a unique opportunity to measure UV light intensity even in the presence of strong electromagnetic interference. Five scintillating materials were compared in order to select the most appropriate one for the UVOFS. The characteristics of the sensor are reported, including a highly linear response to radiation intensity, reproducibility, temperature response, and response time (to pulsed light) based on emission from a UV source (UV fluorescence tube) centered on a wavelength of 308 nm. A direct comparison with the commercially available semiconductor-based UV sensor proves the UVOFS of this investigation shows superior performance in terms of accuracy, long-term reliability, response time and linearity.


2004 ◽  
Vol 10 (2) ◽  
pp. 107-112 ◽  
Author(s):  
Romualdas Kliukas ◽  
Antanas Kudzys

An effect of service and proof actions on probabilistic reliability (serviceability, safety and durability) of building elements (components and members) of existing enclosure and bearing structures is under consideration. Time‐dependent models for reliability assessment of elements under sustained variable and multicycle actions are presented. Revised reliability indices of existing elements exposed to service permanent and variable actions are discussed. It is recommended to assess the long‐term reliability index of elements taking into account the effect of latent defects. Truncated probability distributions of physical‐mechanical resistances of elements and an effect of their latent defects on reliability index assessment are taken into account. Methodological peculiarities of durability prediction of elements and avoiding unfounded premature repairs or replacements are analysed. The applied illustration of the presented method on the probabilistic reliability prediction of deteriorating concrete covers is demonstrated.


2005 ◽  
Vol 297-300 ◽  
pp. 1545-1550 ◽  
Author(s):  
Chang Min Suh ◽  
Sang Chun Kim ◽  
Jung Sik Chae

In this paper, the effects of chamfering conditions on the surface roughness of ZrO2 ferrule applied to an optical fiber connector were investigated. The mesh number of the diamond wheel, the grinding speed of the spindle, the feed rate, and the initial cutting depth during grinding chamfer were regarded as the main parameters that have an effect on the surface roughness. Among these parameters, optimal combinations for chamfering conditions were obtained by using the Taguchi method. In addition, analytic values for maximum surface roughness (Rmax) estimated by the theoretical equations which were derived from the formative model of surface roughness on the grinding chamfer were compared with those of the experiments.


Author(s):  
Daniel Dousek ◽  
Matěj Komanec ◽  
Ailing Zhong ◽  
Dmytro Suslov ◽  
Stanislav Zvánovec ◽  
...  

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000189-000195
Author(s):  
Milton Watts ◽  
K. Rob Harker

Quartzdyne Electronics has invested millions of device test hours in life testing of circuits in both powered and un-powered tests. In addition to time at temperature, these tests include thermal cycling and high impact drop testing. Recent projects have required the use of larger packages and components as we have expanded the variety of circuits that we build. It is desirable to predict the effects of these changes on long-term reliability before investing in tooling. In this study we will compare a new design which contains these larger components to the simpler, smaller designs for which we have extensive life-test data. Using a physics-of-failure approach, component mounting stresses will be analyzed using finite element modeling. These results will be compared to pre and post-aging shear strengths of actual components of varying sizes. Aging models will then be developed to predict the reliability of the new design based on the comparative stress margins of the individual components coupled with circuit complexity. Once validated, the aging models will enable reliability prediction and trade-off analysis for future designs.


2020 ◽  
Vol 57 (15) ◽  
pp. 152201
Author(s):  
董雪岩 Dong Xueyan ◽  
李平雪 Li Pingxue ◽  
章曦 Zhang Xi ◽  
杨卫鑫 Yang Weixin

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