AlN/Ga-based Liquid Metal/PDMS Ternary Thermal Grease for Heat Dissipation in Electronic Devices

2018 ◽  
Vol 47 (9) ◽  
pp. 2668-2674 ◽  
Author(s):  
Liu Han ◽  
Liu Huiqiang ◽  
Lin Zuoye ◽  
Chu Sheng
Keyword(s):  
Liquid Metal ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Thermal Grease

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

scholarly journals Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1893 ◽  
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Jihye An ◽  
Siyeon Choi ◽  
Jinho Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Internal Heat ◽  
Upward Trend ◽  
Heat Transfer Medium ◽  
Conductive Materials ◽  
Increasing Trend ◽  
Thermal Grease

As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m·k over the silicon base, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.

High thermal conductivity liquid metal pad for heat dissipation in electronic devices

2018 ◽  
Vol 124 (5) ◽  
Author(s):  
Zuoye Lin ◽  
Huiqiang Liu ◽  
Qiuguo Li ◽  
Han Liu ◽  
Sheng Chu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Thermal Conductivity

Thermal Conductivity of Diamond-Containing Grease

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Hung-En Chou ◽  
Shang-Ray Yang ◽  
Sea-Fue Wang ◽  
James C. Sung
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
Terminal Group ◽  
Thermal Interface Material ◽  
Particle Sizes ◽  
Thermal Interface ◽  
Thermal Grease ◽  
Single Filler

As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, researches on diamond-containing TGs remain rare. In this study, four kinds of TGs in which diamond served as essential filler were prepared and hot disk technique was applied to measure their thermal conductivity k(TG). After two unoverlapped particle sizes were selected, the volumetric filler content, terminal group, and viscosity of a polydimethylsiloxane (PDMS) matrix were modified in sequence. Based on the preferred recipe of a single-filler TG, two double-filler TG series were prepared by retaining the large diamonds and replacing the small ones by Al2O3 or ZnO, respectively. Depending on the content, it was found that diamond was not always the best choice for small filler. The highest k(TG), which was 23 times greater than the original k(PDMS), appeared in a ZnO-containing double-filler grease (=3.52 W/mK). The prediction for the maximum attainable thermal conductivity was preliminarily supported.

Experimental Investigation on the Heat Dissipation Performance of Bismuth-Based Alloy Thermal Conductive Sheet

2021 ◽  
Vol 1035 ◽  
pp. 655-662
Author(s):  
Qian Yu Wang ◽  
Chang Li Cai ◽  
Zhong Shan Deng
Keyword(s):  
Thermal Resistance ◽  
Power Density ◽  
High Power ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Thermal Interface Materials ◽  
High Power Density ◽  
Interface Thermal Resistance ◽  
Thermal Grease ◽  
Interface Materials

At present, the existing thermal interface materials (TIMs) cannot meet the heat dissipation requirements of some high-power density electronic devices. In this study, Bi-based low melting point alloy was made into a thermal conductive sheet to reduce the interface thermal resistance. The thermal conductivity of a thermal conductive sheet was found to be 37.83 W/(m·K), 10 times higher than Dow Corning 5021 thermal grease. In addition, the surface morphology of the Bi-based alloy thermal conductive sheet was changed in this experiment, which was divided into textured and planer type, and the measured interface thermal resistance values lower than Dow Corning 5021 thermal grease by approximately 30% and 27%, respectively. The results prove this Bi-based alloy thermal conductive sheets have the ideal heat dissipation performance and their wide application prospects in high-power density electronic devices.

Heat dissipation system based on electromagnetic driven rotational flow of liquid metal coolant

2021 ◽  
pp. 1-14
Author(s):  
Lei Wang ◽  
Xudong Zhang ◽  
Dr. Jing Liu ◽  
Yixin Zhou
Keyword(s):  
Liquid Metal ◽  
Thermal Resistance ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Electric Heater ◽  
Power Relationship ◽  
Rotational Flow ◽  
Large Power ◽  
Dissipation System

Abstract Liquid metal owns the highest thermal conductivity among all the currently available fluid materials. This property enables it to be a powerful coolant for the thermal management of large power device or high flux chip. In this paper, a high-efficiency heat dissipation system based on the electromagnetic driven rotational flow of liquid metal was demonstrated. The velocity distribution of the liquid metal was theoretically analyzed and numerically simulated. The results showed that the velocity was distributed unevenly along longitudinal section and the maximum velocity appears near the anode. On the temperature distribution profile of the heat dissipation system, the temperature on the electric heater side was much higher than the other regions and the role of the rotated liquid metal was to homogenize the temperature of the system. In addition, the thermal resistance model of the experimental device was established, and several relationships such as thermal resistance-power curve were experimentally measured. The heating power could be determined from the temperature-power relationship graph once the maximum control temperature was given. The heat dissipation method introduced in the paper provides a novel way for fabricating compact chip cooling system.

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

2003 ◽  
Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Thermal Conditions ◽  
Simulation Software ◽  
Operating Conditions ◽  
Power Electronic ◽  
Stress Concentrations ◽  
Multiphysics Simulation ◽  
Multiphysics Simulations

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.

Reconfigurable electronic devices enabled by laser-sintered liquid metal nanoparticles

2019 ◽  
Vol 4 (1) ◽  
pp. 015004 ◽  
Author(s):  
Shanliangzi Liu ◽  
Michelle C Yuen ◽  
Rebecca Kramer-Bottiglio
Keyword(s):  
Liquid Metal ◽  
Metal Nanoparticles ◽  
Electronic Devices

Self-healing and stretchable conductor based on embedded liquid metal patterns within imprintable dynamic covalent elastomer

2022 ◽  
Author(s):  
Xiaoliang Chen ◽  
Peng Sun ◽  
Hongmiao Tian ◽  
Xiangming Li ◽  
Chunhui Wang ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Electronic Devices ◽  
Electronic Systems ◽  
Self Healing ◽  
Next Generation ◽  
Critical Elements ◽  
Stretchable Conductors ◽  
Stretchable Conductor

Flexible and stretchable conductors are critical elements for constructing soft electronic systems and have recently attracted tremendous attention. Next generation electronic devices call for self-healing conductors that can mimic the...

Sign in / Sign up

Export Citation Format

Share Document