scholarly journals On the physical basis for the creep of ice: the high temperature regime

2020 ◽  
Vol 66 (257) ◽  
pp. 401-414 ◽  
Author(s):  
D.M. Cole

AbstractThis work quantifies the increased temperature sensitivity of the constitutive behavior of ice with proximity to the melting point in terms of dislocation mechanics. An analysis of quasistatic and dynamic cyclic loading data for several ice types leads to the conclusion that high temperature (e.g. T ≥ −8°C) behavior is the result of a thermally induced increase in the number of mobile dislocations rather than an increase in the activation energy of dislocation glide or the introduction of a new deformation mechanism. The relationship between dislocation density and temperature is quantified and the model is shown to adequately represent the published minimum creep rate vs stress data for isotropic granular freshwater ice for −48 ≤ T ≤ −0.01°C.

2013 ◽  
Vol 372 ◽  
pp. 288-291 ◽  
Author(s):  
Saravut Thongkam ◽  
Sirikul Wisutmethangoon ◽  
Jessada Wannasin ◽  
Suchart Chantaramanee ◽  
Thawatchai Plookphol

Creep of rheocast 7075-T6 aluminum alloy produced by the Gas Induced Semi-Solid (GISS) process was investigated at temperature of 300 °C and stress range of 20-70 MPa and compared to that of wrought 7075-T651 aluminum alloy. The rheocast 7075-T6 alloy exhibited lower minimum creep rate and longer rupture time than the wrought 7075-T651 alloy. The total rupture strain of the rheocast alloy was shorter than that of the wrought one. According to the power law creep, the stress exponents, n of the rheocast 7075-T6 and the wrought 7075-T651 alloys were 5.9 and 7.9 respectively. Based on the determined n values, the creep deformation of both alloys was possibly controlled by the dislocation glide and climb-controlled mechanism.


1957 ◽  
Vol 24 (2) ◽  
pp. 207-213
Author(s):  
H. Laks ◽  
C. D. Wiseman ◽  
O. D. Sherby ◽  
J. E. Dorn

Abstract Experimental investigations on pure aluminum and its dilute solid-solution alloys revealed that the high-temperature creep rate ϵ̇ is related to the stress σ by ϵ̇ ∼ σn for low stresses and ϵ̇ ∼ eBσ for high stresses where n and B are constants independent of the creep strain and temperature. According to a preliminary dislocation-climb model for high-temperature creep, the activation energy for creep is that for self-diffusion, the effect of stress on the creep rate depends on the number of active Frank-Read sources, and the rate of climb depends on the structure as determined by the pattern of climbing dislocations. Many of the experimental observations on high-temperature creep can be accounted for by this model.


1998 ◽  
Vol 13 (9) ◽  
pp. 2610-2613 ◽  
Author(s):  
Kexin Chen ◽  
Changchun Ge ◽  
Jiangtao Li

The self-propagating high temperature synthesis (SHS) of Al–Zr–N system composite ceramics was investigated in this paper. The melting point of Al was low (Tm = 660 °C), while that of Zr was high (Tm =1855 °C). Therefore, Al will melt and coalesce during reaction, which inhibit diffusion of nitrogen from outside the metal compact to interior due to collapse of the pore openings, while Zr will not melt under the combustion temperature which is lower than its melting point. It will not affect the permeation of nitrogen under the conditions. Accordingly, the ratio of Al and Zr in the initial mixed powders will affect the permeation of nitrogen from outside the sample to the interior, which results in different phase formation of the products. In this study, the relationship between the combustion parameters and the phase formation of the products will be experimentally determined through XRD analysis, and then thermodynamically analyzed.


2011 ◽  
Vol 465 ◽  
pp. 443-446 ◽  
Author(s):  
Ferdinand Dobeš

High-temperature creep of a Fe3Al-type iron aluminide alloyed by niobium and different additions of carbon was studied in the temperature range from 600 to 800 °C. The alloys contained (atomic %) (i) 27.6 Al, 1.15 Nb, 0.19 C and (ii) 27.1 Al, 1.11Nb, 0.76 C (Fe balance). Creep tests were performed in compression at constant load with stepwise loading. Stress exponent and activation energy of the creep rate were determined. Creep resistance of the low-carbon alloy is better at lower temperatures, while the opposite is true at temperature of 800 °C.


2020 ◽  
Vol 90 (10) ◽  
pp. 1724
Author(s):  
Д.Ю. Ковалев ◽  
И.И. Чуев

ave been obtained by high-temperature X-ray powder diffraction study. The amorphous structure of nanosized Ni particles is stable up to 200 ℃. Ni nanocrystals are formed in the temperature range of 300–600 ℃. The sizes of the coherent scattering regions (CSR) depend on the temperature of isothermal annealing and they are in the 5–15 nm interval. The activation energy of nanocrystal growth has been estimated. It is 67.3 kJ/mol. The relationship between the unit cell parameter of nanocrystalline Ni and the size of the CSR has been determined. An increase in the CSR of Ni nanoparticles causes the increase in the cell metric.


2003 ◽  
Vol 762 ◽  
Author(s):  
A. Gordijn ◽  
J.K. Rath ◽  
R.E.I. Schropp

AbstractDue to the high temperatures used for high deposition rate microcrystalline (μc-Si:H) and polycrystalline silicon, there is a need for compact and temperature-stable doped layers. In this study we report on films grown by the layer-by-layer method (LbL) using VHF PECVD. Growth of an amorphous silicon layer is alternated by a hydrogen plasma treatment. In LbL, the surface reactions are separated time-wise from the nucleation in the bulk. We observed that it is possible to incorporate dopant atoms in the layer, without disturbing the nucleation. Even at high substrate temperatures (up to 400°C) doped layers can be made microcrystalline. At these temperatures, in the continuous wave case, crystallinity is hindered, which is generally attributed to the out-diffusion of hydrogen from the surface and the presence of impurities (dopants).We observe that the parameter window for the treatment time for p-layers is smaller compared to n-layers. Moreover we observe that for high temperatures, the nucleation of p-layers is more adversely affected than for n-layers. Thin, doped layers have been structurally, optically and electrically characterized. The best n-layer made at 400°C, with a thickness of only 31 nm, had an activation energy of 0.056 eV and a dark conductivity of 2.7 S/cm, while the best p-layer made at 350°C, with a thickness of 29 nm, had an activation energy of 0.11 V and a dark conductivity of 0.1 S/cm. The suitability of these high temperature n-layers has been demonstrated in an n-i-p microcrystalline silicon solar cell with an unoptimized μc-Si:H i-layer deposited at 250°C and without buffer. The Voc of the cell is 0.48 V and the fill factor is 70 %.


Alloy Digest ◽  
1970 ◽  
Vol 19 (12) ◽  

Abstract CRM MOLYBDENUM-50 RHENIUM is a high-melting-point alloy for applications such as electronics tube components, electrical contacts, thermionic converters, thermocouples, heating elements and rocket thrusters. All products are produced by powder metallurgy. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Mo-11. Producer or source: Chase Brass & Copper Company Inc..


Alloy Digest ◽  
1970 ◽  
Vol 19 (8) ◽  

Abstract CRM RHENIUM is a commercially pure, high-melting-point metal for applications such as electronics tube components, electrical contacts, thermionic converters, thermocouples, heating elements and rocket thrusters. All products are produced by powder metallurgy. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Re-1. Producer or source: Chase Brass & Copper Company Inc..


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