The Construction of an EBSD Stage for the Electroscan E3 SEM

2000 ◽  
Vol 6 (S2) ◽  
pp. 796-797
Author(s):  
Peter Yurek ◽  
Stuart McKernan ◽  
Kyung-Ho Lee
Keyword(s):  
Electron Backscatter Diffraction ◽  
Light Level ◽  
Environmental Scanning ◽  
Geological Samples ◽  
Low Light ◽  
Insulating Materials ◽  
Computing Power ◽  
Backscatter Diffraction ◽  
Application Specific ◽  
Environmental Sem

With recent advances in computing power and application specific software it has become practical for smaller microcopy labs to either purchase or build a electron backscatter diffraction (EBSD) systems. This system can be used to probe the crystallography and microstructure of many different materials. One set of such materials is geological samples from deep within the earth's crust. In collaboration with the Geology and Geophysics department an EBSD system has been built to function with the Philips Electroscan E3 Environmental Scanning Electron Microscope (ESEM). Using an existing low light level SIT camera, the system was completed with the addition of a phosphor screen and appropriate software and acquisition cards.One main advantage of the ESEM for EBSD is that since it is an environmental SEM samples can be imaged without coating. For insulating materials this is means that the sample can be imaged without coating.

Advances in strain measurement using electron-backscatter diffraction in the Scanning Electron Microscope

1994 ◽  
Vol 52 ◽  
pp. 602-603
Author(s):  
D. J. Dingley
Keyword(s):  
Strain Measurement ◽  
Electron Backscatter Diffraction ◽  
Light Level ◽  
Electron Back Scatter Diffraction ◽  
Photographic Film ◽  
Low Light ◽  
Television Camera ◽  
Diffraction Patterns ◽  
Backscatter Diffraction

The technique of electron back scatter diffraction, EBSD, is well established for measurement of crystal orientation in bulk polycrystalline samples. Analytical procedures for determining crystal phase from them have also been established. In addition several papers have been published describing the application of the method for strain measurement. In these latter studies the EBSPs were recorded on photographic film and all measurements made after digitising the patterns and transferring the data to a SEMPER image processing package. Strain measurement was based on determination of the diffuseness of the diffraction pattern. In the present studies analysis was carried out on digitised television images of the diffraction patterns imaged live on a phosphor screen.EBSPs were obtained in a JEOL 6400 SEM fitted with a tungsten filament. The patterns were imaged on a P20/P40 phosphor directly coupled through a coherent fibre optic bundle to a SIT low light level television camera with 700 line resolution.

Automatic idexing of electron-backscatter diffraction patterns

1994 ◽  
Vol 52 ◽  
pp. 598-599
Author(s):  
S. I. Wright
Keyword(s):  
Feature Detection ◽  
Electron Backscatter Diffraction ◽  
Video Camera ◽  
Light Level ◽  
Lattice Orientation ◽  
Low Light ◽  
Diffraction Patterns ◽  
Digital Image Enhancement ◽  
Backscatter Diffraction

A typical Backscatter Kikuchi Diffraction pattern (BKD, also referred to in the literature as an EBSP or a BEKP) is shown in figure 1. Since the bands in the pattern represent planes in the diffracting volume, the lattice orientation can be determined from their geometrical arrangement. The task of correctly orienting a BKD can be broken into two parts: 1) finding the salient features in the pattern (either the diffraction bands or the intersections of the bands) and 2) using these features to determine the lattice orientation. Recent advances in feature detection in BKDs along with methods for digital image enhancement will be described in some detail. The determination of orientation from a set of detected bands (or intersections of bands) will also be discussed.Dingley has demonstrated that lattice orientation can be practically obtained from BKDs by imaging the diffraction patterns using a low light level video camera and indexing the patterns with the aid of an online computer.

Software pattern recognition applied to nanodiffraction patterns from a STEM instrument

1986 ◽  
Vol 44 ◽  
pp. 694-695
Author(s):  
G.Y. Fan ◽  
J.M. Cowley
Keyword(s):  
Image Processing ◽  
Pattern Recognition ◽  
Computer Software ◽  
Processing System ◽  
Light Level ◽  
Host Computer ◽  
Low Light ◽  
Image Processing System ◽  
Recent Developments ◽  
On Line

In recent developments, the ASU HB5 has been modified so that the timing, positioning, and scanning of the finely focused electron probe can be entirely controlled by a host computer. This made the asynchronized handshake possible between the HB5 STEM and the image processing system which consists of host computer (PDP 11/34), DeAnza image processor (IP 5000) which is interfaced with a low-light level TV camera, array processor (AP 400) and various peripheral devices. This greatly facilitates the pattern recognition technique initiated by Monosmith and Cowley. Software called NANHB5 is under development which, instead of employing a set of photo-diodes to detect strong spots on a TV screen, uses various software techniques including on-line fast Fourier transform (FFT) to recognize patterns of greater complexity, taking advantage of the sophistication of our image processing system and the flexibility of computer software.

Detector strategies for environmental scanning electron microscopy

1992 ◽  
Vol 50 (2) ◽  
pp. 1296-1297
Author(s):  
Klaus-Ruediger Peters
Keyword(s):  
High Vacuum ◽  
Environmental Scanning Electron Microscopy ◽  
Charge Carriers ◽  
Environmental Scanning ◽  
Surface Information ◽  
X Ray ◽  
Detector Electrode ◽  
Electrons And Ions ◽  
Low Energy Electrons ◽  
Environmental Sem

Environmental SEM operate at specimen chamber pressures of ∼20 torr (2.7 kPa) allowing stabilization of liquid water at room temperature, working on rugged insulators, and generation of an environmental secondary electron (ESE) signal. All signals available in conventional high vacuum instruments are also utilized in the environmental SEM, including BSE, SE, absorbed current, CL, and X-ray. In addition, the ESEM allows utilization of the flux of charge carriers as information, providing exciting new signal modes not available to BSE imaging or to conventional high vacuum SEM.In the ESEM, at low vacuum, SE electrons are collected with a “gaseous detector”. This detector collects low energy electrons (and ions) with biased wires or plates similar to those used in early high vacuum SEM for SE detection. The detector electrode can be integrated into the first PLA or positioned at any other place resulting in a versatile system that provides a variety of surface information.

Low-light-level three-dimensional video microscope with long working distance objective lenses

1994 ◽  
Vol 52 ◽  
pp. 226-227
Author(s):  
W. Lin ◽  
J. Gregorio ◽  
T.J. Holmes ◽  
D. H. Szarowski ◽  
J.N. Turner
Keyword(s):  
Three Dimensional ◽  
Light Level ◽  
Stereo Pair ◽  
Light Illumination ◽  
Initial Image ◽  
Low Light ◽  
Image Recording ◽  
Depth Discrimination ◽  
Video Microscope ◽  
Working Distance

A low-light level video microscope with long working distance objective lenses has been built as part of our integrated three-dimensional (3-D) light microscopy workstation (Fig. 1). It allows the observation of living specimens under sufficiently low light illumination that no significant photobleaching or alternation of specimen physiology is produced. The improved image quality, depth discrimination and 3-D reconstruction provides a versatile intermediate resolution system that replaces the commonly used dissection microscope for initial image recording and positioning of microelectrodes for neurobiology. A 3-D image is displayed on-line to guide the execution of complex experiments. An image composed of 40 optical sections requires 7 minutes to process and display a stereo pair.The low-light level video microscope utilizes long working distance objective lenses from Mitutoyo (10X, 0.28NA, 37 mm working distance; 20X, 0.42NA, 20 mm working distance; 50X, 0.42NA, 20 mm working distance). They provide enough working distance to allow the placement of microelectrodes in the specimen.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

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