Study on the Effect of High Temperature Quenching on the Surface Roughness of Yellow Sandstone

Author(s):  
Cui-zhu Zhao ◽  
Zhi-hao Dong ◽  
Rui Hu ◽  
Ren-lin Zhang ◽  
Yu-xin Gao
Author(s):  
Xueyang Han ◽  
ChiaTsong Chen ◽  
Cheol-Min Lim ◽  
Kasidit Toprasertpong ◽  
Mitsuru Takenaka ◽  
...  

Abstract It is demonstrated in this work that a high temperature thermal process including oxidation and N2 annealing at 850 oC can provide tensile strain of ~0.58 % at maximum into Ge-on-Insulator (GOI) structures without any special patterning or external stressors. The different impacts of oxidation and annealing on tensile strain generation, surface roughness and crystal qualities in the GOI structures fabricated by Ge condensation and wafer bonding are systematically examined. Tensile strain of 0.47 % is achieved without severe thermal damages under the optimal thermal process condition, which indicates the high potential of the present method for improving the performance of GOI n-channel MOSFETs. The influence of thermal expansion mismatch between Ge and SiO2 are suggested as a possible physical origin of high amount of tensile strain into GOI structures.


2018 ◽  
Vol 7 (2.13) ◽  
pp. 389
Author(s):  
Muksin R. Harahap ◽  
Ahmad Bakhori ◽  
Suhardi Napid ◽  
Muhammad Rafiq Yanhar ◽  
Abdurrozzaq Hasibuan

To improve the productivity of this machining perhaps it may be recommended in a dry cutting but a dry cutting is recognized very sensitive to a high temperature. In this case, in order to overcome is perhaps required by using a tool carbide either in layers or without any layers whereby each layer has certain superior. There was conducted an experiment to have an optimum cutting on a carbon steel VCN-150 using a layers tool carbide  and Respond Surface Method (RSM) with a CCD operation. The result of study recommended that condition optimum cutting shall be achieved (When cutting tc ) on a medium machining refers to ISO 3685 and medium surface roughness (Ra ) ISO 1320. Statistically, there is no found significant difference between a dry and wet cutting on optimum dry condition.  


2010 ◽  
Vol 24 (15n16) ◽  
pp. 3005-3010 ◽  
Author(s):  
KAZUTOSHI KATAHIRA ◽  
HITOSHI OHMORI ◽  
MASAYOSHI MIZUTANI ◽  
JUN KOMOTORI

To investigate the possibility of developing a new surface modification method by the combined process of ELID grinding and high-temperature oxidization, we treated ELID finished specimens and polished specimens by high-temperature oxidization in the atmosphere and performed detailed analysis to determine how the treatment would change the specimen surfaces. The ELID-series showed high quality surface roughness and excellent tribological characteristics as compared with the polished-series. The improved surface properties of the ELID-series seem to result from formation of fine, uniform structures of spinel-type multiple oxides FeCr 2 O 4 and Cr 2 O 3 on the surface by high-temperature oxidization.


2010 ◽  
Vol 645-648 ◽  
pp. 783-786
Author(s):  
Tatsunori Sugimoto ◽  
Masataka Satoh ◽  
Tohru Nakamura ◽  
K. Mashimo ◽  
Hiroshi Doi ◽  
...  

The impact of CF4 plasma treatment on the surface roughening of SiC has been investigated for N ion implanted SiC(0001) which is implanted with the energy range from 15 to 120 keV at a dose of 9.2 x 1014/cm2. The N ion implanted sample, which is processed by CF4 plasma, shows small surface roughness of 1.6 nm after annealing at 1700 oC for 10 min, while the sample without CF4 plasma treatment shows the large surface roughness (6.6nm) and micro step structure. XPS measurements reveals that CF4 plasma treatment is effective to dissolved the residual oxide on the surface of SiC which is not removed by BHF acid of SiO2 layer on SiC. It is strongly suggested that the formation of micro step structure with the increase of the surface roughness is promoted by the residual oxide such as SiCOx, on SiC.


2020 ◽  
Vol 10 (3) ◽  
pp. 996 ◽  
Author(s):  
Altan Alpay Altun ◽  
Thomas Prochaska ◽  
Thomas Konegger ◽  
Martin Schwentenwein

Due to the high level of light absorption and light scattering of dark colored powders connected with the high refractive indices of ceramic particles, the majority of ceramics studied via stereolithography (SLA) have been light in color, including ceramics such as alumina, zirconia and tricalcium phosphate. This article focuses on a lithography-based ceramic manufacturing (LCM) method for β-SiAlON ceramics that are derived from silicon nitride and have excellent material properties for high temperature applications. This study demonstrates the general feasibility of manufacturing of silicon nitride-based ceramic parts by LCM for the first time and combines the advantages of SLA, such as the achievable complexity and low surface roughness (Ra = 0.50 µm), with the typical properties of conventionally manufactured silicon nitride-based ceramics, such as high relative density (99.8%), biaxial strength (σf = 764 MPa), and hardness (HV10 = 1500).


2010 ◽  
Vol 25 (4) ◽  
pp. 708-710 ◽  
Author(s):  
Atsushi Ogura ◽  
Daisuke Kosemura ◽  
Shingo Kinoshita

4H-silicon carbide (SiC) wafers were annealed at 1300 and 1600 °C for 30 min and 60 min in a conventional and purified Ar atmosphere. The surface roughness before and after annealing was evaluated by atomic force microscopy. The surface roughness before annealing was approximately 2.37 nm in root mean square. The roughness, after annealing for 30 min at 1300 and 1600 °C in a conventional Ar furnace, was increased to 4.53 and 14.9 nm, respectively. The roughness, after annealing for 60 min, was 5.01 and 19.1 nm, respectively. In this study, the G3 grade Ar gas (99.999%) was supplied in the conventional furnace tube. When the Ar gas was purified to an impurity concentration of less than 1 ppb, and it was supplied in the leak-tight furnace tube, the roughness after 30-min annealing improved 4.27 and 6.93 nm at 1300 and 1600 °C, respectively. The roughness after 60-min annealing was also reduced to 3.54 and 9.28 nm, respectively. We assume that a significant reduction of H2O concentration in the annealing atmosphere might play an important role in suppressing surface roughening of SiC during high-temperature annealing.


2011 ◽  
Vol 228-229 ◽  
pp. 458-463
Author(s):  
Ming Hai Wang ◽  
Hu Jun Wang ◽  
Zhong Hai Liu

Isotropic pyrolyric graphite (IPG) is a new kind of brittle material, it not only has the general advantages of ordinal carbonaceous materials such as high temperature resistance, lubrication and abrasion resistance, but also has the advantages of impermeability and machinability that carbon/carbon composite doesn’t have. So it can be used for sealing the aeronautics and astronautics engines turbine shaft and the ethylene high-temperature equipment. The mechanism of this material removal during the precision cutting was analyzed by using the theory of strain gradient. The critical cutting thickness of IPG was calculated for the first time. Furthermore, the cutting process parameters such as cutting depth and feed rate which corresponding to the scale of brittle-ductile transition deformation of IPG was calculated. The prediction model of surface roughness in precision cutting of IPG was developed based on the Genetic algorithm. Using the surface roughness prediction model, the study investigates the influence of the cutting speed, the feed rate and the cutting depth on surface roughness in precision turning process was researched.


2014 ◽  
Vol 487 ◽  
pp. 71-74
Author(s):  
Zaliman Sauli ◽  
Vithyacharan Retnasamy ◽  
Aaron Koay Terr Yeow ◽  
Goh Siew Chui ◽  
K. Anwar ◽  
...  

Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of CF4and Argon gaseous. A total of three controllable process variables, with 8 sets of experiments were scrutinized using a systematically designed design of experiment (DOE). The three variables in the investigation are ICP power, Bias power, and working pressure. The estimate of the effect calculated for ICP power, Bias power, and working pressure are-6.3608, -3.2858, and-5.394 respectively. All three factors gave negative effects. This implies that the surface roughness decreases when ICP power, Bias power, and working pressure is high. The ICP Power is the most influential factor followed by working pressure, and bias power.


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