The influence of surface topography on the electromechanical characteristics of parallel-plate MEMS capacitors

2005 ◽  
Vol 15 (5) ◽  
pp. 1068-1075 ◽  
Author(s):  
Lior Kogut
Keyword(s):  
Surface Topography ◽  
Parallel Plate

An Etch-Back Planarization Process Using A Sacrificial Polymide Layer

1991 ◽  
Vol 240 ◽  
Author(s):  
J. R. Lothian ◽  
T. R. Fullowan
Keyword(s):  
Surface Topography ◽  
Dielectric Layer ◽  
Rate Ratio ◽  
Parallel Plate ◽  
Etch Rate ◽  
Dielectric Film ◽  
Sacrificial Layer ◽  
Loading Effect ◽  
Planarization Process ◽  
Etching System

ABSTRACTAn etch-back polymide planarization process for the emitter contact of AlGaAs/GaAs HBTs using PC-1500 is presented. The degree of surface topography has a major impact on the yield in HBT fabrication. A planarization process using a spin-on sacrificial layer to produce a planar interlevel dielectric layer would be very beneficial in allowing thicker and more uniform emitter contacts therefore enhancing the yield and current handling capability. The PC-1500 polymer flows at 200°C and provides a much better planarity than regular photoresist. For patterns from -3 μm to 250 this polymer can achieve 80% to 92% planarity. The wafers were etched in a parallel plate, single wafer reactive ion-etching system with a mixture of oxygen and Freon-14. The etch rate of this polymer increased with the oxygen content of the discharge then became fairly constant at high O2 concentrations while the etch rate of the underlying dielectric film (SiN) was proportional to the Freon 14 content. This new polymer shows little loading effect. A 1:1 etch rate ratio of SiN to PC-1500 was established for good planarity.

The Broad Applications of the Scanning Electron Microscope

1969 ◽  
Vol 27 ◽  
pp. 20-21
Author(s):  
C. T. Nightingale ◽  
S. E. Summers ◽  
T. P. Turnbull
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Light Microscopy ◽  
Surface Topography ◽  
Great Depth ◽  
Resolving Power ◽  
Depth Of Field ◽  
Pictorial Representations ◽  
Scanning Electron

The ease of operation of the scanning electron microscope has insured its wide application in medicine and industry. The micrographs are pictorial representations of surface topography obtained directly from the specimen. The need to replicate is eliminated. The great depth of field and the high resolving power provide far more information than light microscopy.

Effects of Ion Beam Milling on Surface Topography

1973 ◽  
Vol 31 ◽  
pp. 84-85
Author(s):  
P.G. Pawar ◽  
P. Duhamel ◽  
G.W. Monk
Keyword(s):  
Surface Topography ◽  
Ion Beam ◽  
Solid Material ◽  
Beam Current ◽  
Atomic Mass ◽  
Micro Milling ◽  
Ion Milling ◽  
Controlled Atmospheres ◽  
Milling Operations ◽  
Sufficient Energy

A beam of ions of mass greater than a few atomic mass units and with sufficient energy can remove atoms from the surface of a solid material at a useful rate. A system used to achieve this purpose under controlled atmospheres is called an ion miliing machine. An ion milling apparatus presently available as IMMI-III with a IMMIAC was used in this investigation. Unless otherwise stated, all the micro milling operations were done with Ar+ at 6kv using a beam current of 100 μA for each of the two guns, with a specimen tilt of 15° from the horizontal plane.It is fairly well established that ion bombardment of the surface of homogeneous materials can produce surface topography which resembles geological erosional features.

The Structure of Radiation Cross-Linked Poly (ethylene oxide) Gels

1971 ◽  
Vol 29 ◽  
pp. 76-77
Author(s):  
C. E. Cluthe ◽  
G. G. Cocks
Keyword(s):  
Molecular Weight ◽  
Ethylene Oxide ◽  
Parallel Plate ◽  
Average Molecular Weight ◽  
Radical Reaction ◽  
Free Radical Reaction ◽  
Nitrogen Gas ◽  
Poly Ethylene Oxide ◽  
Poly Ethylene ◽  
Initial Viscosity

Aqueous solutions of a 1 weight-per cent poly (ethylene oxide) (PEO) were degassed under vacuum, transferred to a parallel plate viscometer under a nitrogen gas blanket, and exposed to Co60 gamma radiation. The Co60 source was rated at 4000 curies, and the dose ratewas 3.8x105 rads/hr. The poly (ethylene oxide) employed in the irradiations had an initial viscosity average molecular weight of 2.1 x 106.The solutions were gelled by a free radical reaction with dosages ranging from 5x104 rads to 4.8x106 rads.

Low-Loss Images in a Stem/Tem Microscope

1976 ◽  
Vol 34 ◽  
pp. 496-497 ◽  
Author(s):  
David C. Joy ◽  
Dennis M. Maher
Keyword(s):  
High Resolution ◽  
Surface Topography ◽  
Beam Direction ◽  
Low Loss ◽  
Specimen Holder ◽  
Glancing Angle ◽  
High Resolution Images ◽  
Set Up ◽  
Conventional Manner ◽  
Objective Type

High-resolution images of the surface topography of solid specimens can be obtained using the low-loss technique of Wells. If the specimen is placed inside a lens of the condenser/objective type, then it has been shown that the lens itself can be used to collect and filter the low-loss electrons. Since the probeforming lenses in TEM instruments fitted with scanning attachments are of this type, low-loss imaging should be possible.High-resolution, low-loss images have been obtained in a JEOL JEM 100B fitted with a scanning attachment and a thermal, fieldemission gun. No modifications were made to the instrument, but a wedge-shaped, specimen holder was made to fit the side-entry, goniometer stage. Thus the specimen is oriented initially at a glancing angle of about 30° to the beam direction. The instrument is set up in the conventional manner for STEM operation with all the lenses, including the projector, excited.

A procedure for cross-sectioning materials for TEM analysis without ion milling

1990 ◽  
Vol 48 (4) ◽  
pp. 742-743
Author(s):  
J.P. Benedict ◽  
Ron Anderson ◽  
S. J. Klepeis
Keyword(s):  
Surface Topography ◽  
Milling Time ◽  
Specimen Preparation ◽  
Ion Milling ◽  
Cleaning Operation ◽  
Tem Analysis ◽  
Platinum Silicide ◽  
Surface Alteration ◽  
Polishing Damage ◽  
Tools And Methods

Traditional specimen preparation procedures for non-biological samples, especially cross section preparation procedures, involves subjecting the specimen to ion milling for times ranging from minutes to tens of hours. Long ion milling time produces surface alteration, atomic number and rough-surface topography artifacts, and high temperatures. The introduction of new tools and methods in this laboratory improved our ability to mechanically thin specimens to a point where ion milling time was reduced to one to ten minutes. Very short ion milling times meant that ion milling was more of a cleaning operation than a thinning operation. The preferential thinning and the surface topography that still existed in briefly ion milled samples made the study of interfaces between materials such as platinum silicide and silicon difficult. These two problems can be eliminated by completely eliminating the ion milling step and mechanically polishing the sample to TEM transparency with the procedure outlined in this communication. Previous successful efforts leading to mechanically thinned specimens have shown that problems center on tool tilt control, removal of polishing damage, and specimen cleanliness.

High Resolution Low Loss Microscopy of Crystalline Surfaces

1980 ◽  
Vol 38 ◽  
pp. 162-163
Author(s):  
William Krakow ◽  
Alec N. Broers
Keyword(s):  
Electron Microscopy ◽  
High Resolution ◽  
Surface Topography ◽  
Secondary Electron ◽  
Objective Lens ◽  
Surface Imaging ◽  
Low Loss ◽  
Fine Grained ◽  
Scanning Electron ◽  
Crystalline Surfaces

Low-loss scanning electron microscopy can be used to investigate the surface topography of solid specimens and provides enhanced image contrast over secondary electron images. A high resolution-condenser objective lens has allowed the low-loss technique to resolve separations of Au nucleii of 50Å and smaller dimensions of 25Å in samples coated with a fine grained carbon-Au-palladium layer. An estimate of the surface topography of fine grained vapor deposited materials (20 - 100Å) and the surface topography of underlying single crystal Si in the 1000 - 2000Å range has also been investigated. Surface imaging has also been performed on single crystals using diffracted electrons scattered through 10−2 rad in a conventional TEM. However, severe tilting of the specimen is required which degrades the resolution 15 to 100 fold due to image forshortening.

How nanoscale surface steps promote ice growth on feldspar: microscopy observation of morphology-enhanced condensation and freezing

Nanoscale ◽  
2019 ◽  
Vol 11 (44) ◽  
pp. 21147-21154 ◽  
Author(s):  
Raymond W. Friddle ◽  
Konrad Thürmer
Keyword(s):  
Surface Topography ◽  
Video Microscopy ◽  
Microscopy Observation ◽  
Atmospheric Dust ◽  
Ice Growth ◽  
Surface Steps

Video microscopy and AFM are used to relate surface topography to a mineral's ability to promote ice growth. On feldspar, abundant as atmospheric dust, basic surface steps can facilitate condensation and freezing when air becomes saturated.

Enhanced performance of supercapacitors by constructing a “mini parallel-plate capacitor” in an electrode with high dielectric constant materials

2020 ◽  
Vol 8 (32) ◽  
pp. 16661-16668
Author(s):  
Huayao Tu ◽  
Shouzhi Wang ◽  
Hehe Jiang ◽  
Zhenyan Liang ◽  
Dong Shi ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Carbon Fiber ◽  
Parallel Plate ◽  
Sandwich Structure ◽  
High Dielectric Constant ◽  
Parallel Plate Capacitor ◽  
Plate Capacitor ◽  
Fiber Metal ◽  
High Dielectric ◽  
Mini Plate

The carbon fiber/metal oxide/metal oxynitride layer sandwich structure is constructed in the electrode to form a mini-plate capacitor. High dielectric constant metal oxides act as dielectric to increase their capacitance.

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