scholarly journals Modulation of Thermal Transport of Micro-structured Materials from 3D Printing

2021 ◽  
Author(s):  
Qiangsheng Sun ◽  
Zhixiang Xue ◽  
Yang Chen ◽  
Ruding Xia ◽  
Jianmei Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
3D Printing ◽  
Thermal Transport ◽  
Scanning Speed ◽  
Industrial Applications ◽  
Structure Property ◽  
Structured Materials ◽  
Properties Of Materials ◽  
3D Printing Technique ◽  
Printing Speed

Abstract It is desirable to fabricate materials with adjustable physical properties that can be used in different industrial applications. Since the property of materials is highly dependent on its inner structure, the understanding of structure-property correlation is critical to the design of engineering materials. 3D printing appears as a mature method to effectively produce micro-structured materials. In this work, we created different stainless-steel microstructures by adjusting the speed of 3D printing and studied their relationship between thermal property and printing speed. Microstructure study demonstrates that highly porous structure appears at higher speed, and there is nearly linear relationship between porosity and printing speed. Thermal conductivity of samples fabricated by different printing speeds is characterized, then the correlation among the porosity, thermal conductivity, and scanning speed is established. Based on this correlation, the thermal conductivity of sample can be predicted from its printing speed. We fabricated a new sample at a different speed, and the measurement result of thermal conductivity agrees well with the predicted value from the correlation. To explore thermal transport physics, the effects of the pore structure and temperature on the thermal performance of the printed block are also studied. Our work demonstrates that the combination of the 3D printing technique and the printing speed control can realize regulation of the thermophysical properties of materials.

scholarly journals Anisotropic Thermal Conductivity of Nickel-Based Superalloy CM247LC Fabricated via Selective Laser Melting

2021 ◽  
Vol 11 (11) ◽  
pp. 4843
Author(s):  
Kyomin Kim ◽  
Jageon Koo ◽  
Eunju Park ◽  
Namhun Kim ◽  
Woochul Kim
Keyword(s):  
Thermal Conductivity ◽  
Elastic Modulus ◽  
3D Printing ◽  
Selective Laser Melting ◽  
Lattice Thermal Conductivity ◽  
Laser Melting ◽  
Nickel Based Superalloy ◽  
Anisotropic Thermal Conductivity ◽  
Plane Direction ◽  
Properties Of Materials

Efforts to enhance thermal efficiency of turbines by increasing the turbine inlet temperature have been further accelerated by the introduction of 3D printing to turbine components as complex cooling geometry can be implemented using this technique. However, as opposed to the properties of materials fabricated by conventional methods, the properties of materials manufactured by 3D printing are not isotropic. In this study, we analyzed the anisotropic thermal conductivity of nickel-based superalloy CM247LC manufactured by selective laser melting (SLM). We found that as the density decreases, so does the thermal conductivity. In addition, the anisotropy in thermal conductivity is more pronounced at lower densities. It was confirmed that the samples manufactured with low energy density have the same electron thermal conductivity with respect to the orientation, but the lattice thermal conductivity was about 16.5% higher in the in-plane direction than in the cross-plane direction. This difference in anisotropic lattice thermal conductivity is proportional to the difference in square root of elastic modulus. We found that ellipsoidal pores contributed to a direction-dependent elastic modulus, resulting in anisotropy in thermal conductivity. The results of this study should be beneficial not only for designing next-generation gas turbines, but also for any system produced by 3D printing.

Experimental investigations into extrusion-based 3D printing of PCL/CIP composites for microwave shielding applications

2020 ◽  
pp. 089270572092513
Author(s):  
Usharani Rath ◽  
Pulak Mohan Pandey
Keyword(s):  
3D Printing ◽  
Yield Strength ◽  
Process Parameters ◽  
Performance Test ◽  
Filler Concentration ◽  
Compressive Yield Strength ◽  
Microwave Shielding ◽  
Printing Technique ◽  
3D Printing Technique ◽  
Printing Speed

In the present work, a solvent-based extrusion 3D printing technique has been utilized to fabricate polymer composites comprising of polycaprolactone (PCL) polymer and carbonyl iron particles. A homogenous composite ink containing PCL and carbonyl iron filler particles with suitable solvent was synthesized with required viscosity for the 3D printing operation. Rectangular samples were successfully fabricated using the extrusion 3D printing technology. A response surface methodology was utilized for planning the set of fabrication experiments so as to estimate the effect of process parameters, namely infill density, printing speed and filler concentration on the printed composite density, percentage of shrinkage and compressive strength. Shrinkage was found to reduce with an increase in infill density and filler concentration. However, density was found to shoot up with an increase in infill density and filler concentration. Similarly, compressive yield strength was improved with an increase in infill density and filler concentration. Increase in shrinkage and density values and decrease in compressive yield strength value were noticed with an increase in the printing speed. Furthermore, a genetic algorithm multiobjective optimization tool was utilized to obtain optimum process parameters to minimize shrinkage, minimize density and maximize compressive yield strength for the electronics and microwave applications of the fabricated composite. A microwave shielding performance test of the developed composite was also carried out as a case study. The shielding performance test indicated the efficacy of the polymer composite fabricated using solvent-based extrusion 3D printing technique.

scholarly journals Decoupling electron and phonon transport in single-nanowire hybrid materials for high-performance thermoelectrics

2021 ◽  
Vol 7 (20) ◽  
pp. eabe6000
Author(s):  
Lin Yang ◽  
Madeleine P. Gordon ◽  
Akanksha K. Menon ◽  
Alexandra Bruefach ◽  
Kyle Haas ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Transport ◽  
Electrical Transport ◽  
High Performance ◽  
Figure Of Merit ◽  
Phonon Transport ◽  
Core Shell ◽  
Nanowire Diameter ◽  
High Performing ◽  
Polycrystalline Thin Films

Organic-inorganic hybrids have recently emerged as a class of high-performing thermoelectric materials that are lightweight and mechanically flexible. However, the fundamental electrical and thermal transport in these materials has remained elusive due to the heterogeneity of bulk, polycrystalline, thin films reported thus far. Here, we systematically investigate a model hybrid comprising a single core/shell nanowire of Te-PEDOT:PSS. We show that as the nanowire diameter is reduced, the electrical conductivity increases and the thermal conductivity decreases, while the Seebeck coefficient remains nearly constant—this collectively results in a figure of merit, ZT, of 0.54 at 400 K. The origin of the decoupling of charge and heat transport lies in the fact that electrical transport occurs through the organic shell, while thermal transport is driven by the inorganic core. This study establishes design principles for high-performing thermoelectrics that leverage the unique interactions occurring at the interfaces of hybrid nanowires.

scholarly journals Gaining a better understanding of the extrusion process in fused filament fabrication 3D printing: a review

2021 ◽  
Author(s):  
Bahaa Shaqour ◽  
Mohammad Abuabiah ◽  
Salameh Abdel-Fattah ◽  
Adel Juaidi ◽  
Ramez Abdallah ◽  
...  
Keyword(s):  
3D Printing ◽  
Numerical Models ◽  
Extrusion Process ◽  
Analytical Models ◽  
Limiting Factor ◽  
Fused Filament Fabrication ◽  
Promising Tool ◽  
Relevant Work ◽  
3D Printing Technique ◽  
Required Quality

AbstractAdditive manufacturing is a promising tool that has proved its value in various applications. Among its technologies, the fused filament fabrication 3D printing technique stands out with its potential to serve a wide variety of applications, ranging from simple educational purposes to industrial and medical applications. However, as many materials and composites can be utilized for this technique, the processability of these materials can be a limiting factor for producing products with the required quality and properties. Over the past few years, many researchers have attempted to better understand the melt extrusion process during 3D printing. Moreover, other research groups have focused on optimizing the process by adjusting the process parameters. These attempts were conducted using different methods, including proposing analytical models, establishing numerical models, or experimental techniques. This review highlights the most relevant work from recent years on fused filament fabrication 3D printing and discusses the future perspectives of this 3D printing technology.

scholarly journals Optimization of the composition in a composite material for microelectronics application using the Ising model

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yoshihiko Imanaka ◽  
Toshihisa Anazawa ◽  
Fumiaki Kumasaka ◽  
Hideyuki Jippo
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Ising Model ◽  
Specific Gravity ◽  
Simulated Annealing Algorithm ◽  
Optimization Problems ◽  
Industrial Applications ◽  
Thermal Dissipation ◽  
Materials Informatics ◽  
Combinatorial Optimization Problems

AbstractTailored material is necessary in many industrial applications since material properties directly determine the characteristics of components. However, the conventional trial and error approach is costly and time-consuming. Therefore, materials informatics is expected to overcome these drawbacks. Here, we show a new materials informatics approach applying the Ising model for solving discrete combinatorial optimization problems. In this study, the composition of the composite, aimed at developing a heat sink with three necessary properties: high thermal dissipation, attachability to Si, and a low weight, is optimized. We formulate an energy function equation concerning three objective terms with regard to the thermal conductivity, thermal expansion and specific gravity, with the composition variable and two constrained terms with a quadratic unconstrained binary optimization style equivalent to the Ising model and calculated by a simulated annealing algorithm. The composite properties of the composition selected from ten constituents are verified by the empirical mixture rule of the composite. As a result, an optimized composition with high thermal conductivity, thermal expansion close to that of Si, and a low specific gravity is acquired.

Design of 3D printed bioinspired nacre-like structured materials with significantly enhanced thermal conductivity

2021 ◽  
Vol 118 (13) ◽  
pp. 131903
Author(s):  
Haohuan Wang ◽  
Zhengyong Huang ◽  
Jian Li ◽  
Feipeng Wang ◽  
Zhanzu Feng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Structured Materials ◽  
3D Printed ◽  
Enhanced Thermal Conductivity

scholarly journals Fabrication of Porous Hydrogenation Catalysts by a Selective Laser Sintering 3D Printing Technique

ACS Omega ◽  
2019 ◽  
Vol 4 (7) ◽  
pp. 12012-12017 ◽  
Author(s):  
Elmeri Lahtinen ◽  
Lotta Turunen ◽  
Mikko M. Hänninen ◽  
Kalle Kolari ◽  
Heikki M. Tuononen ◽  
...  
Keyword(s):  
3D Printing ◽  
Selective Laser Sintering ◽  
Laser Sintering ◽  
Hydrogenation Catalysts ◽  
Printing Technique ◽  
3D Printing Technique

scholarly journals Study of anisotropic thermal conductivity in textured thermoelectric alloys by Raman spectroscopy

RSC Advances ◽  
2021 ◽  
Vol 11 (39) ◽  
pp. 24456-24465
Author(s):  
Rapaka S. C. Bose ◽  
K. Ramesh
Keyword(s):  
Crystal Structure ◽  
Thermal Conductivity ◽  
Raman Spectroscopy ◽  
Transport Properties ◽  
Thermal Transport ◽  
Layered Crystal ◽  
Layered Crystal Structure ◽  
Thermal Transport Properties ◽  
Anisotropic Thermal Conductivity ◽  
P Type

Polycrystalline p-type Sb1.5Bi0.5Te3 (SBT) and n-type Bi2Te2.7Se0.3 (BTS) compounds possessing layered crystal structure show anisotropic electronic and thermal transport properties.

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