Impact of temperature and different types of trap charges on noise behavior of Non-uniform Body with Dual Material Source TFET (NUTFET-DMS)

2021 ◽  
Author(s):  
Jagritee Talukdar ◽  
Kavicharan Mummaneni
Keyword(s):  
Material Source ◽  
Different Types ◽  
Dual Material ◽  
Trap Charges

scholarly journals A reliability study of Non-uniform Si TFET with dual material source: Impact of interface trap charges and temperature

2021 ◽  
Author(s):  
Jagritee Talukdar ◽  
Kavicharan Mummaneni
Keyword(s):  
Interface Trap ◽  
Small Signal ◽  
Reliability Study ◽  
Material Source ◽  
Dc Characteristics ◽  
Signal Parameters ◽  
Source Voltage ◽  
The Impact ◽  
Dual Material ◽  
Trap Charges

Abstract The article reports the extraction of DC characteristics and small signal parameters of Non-uniform Si TFET with dual material source (NUTFET-DMS) at different frequencies followed by its reliability investigation. The reliability of the device is examined by analysing: 1) the impact of the presence of interface trap charges, 2) the impact of temperature variation (200 K- 400 K). In the analysis it has been observed that in case of absence of interface trap charges the increase in frequency reduces the value of parasitic capacitances. In addition, the presence of interface trap charges lessens the value of parasitic capacitances up to a certain gate to source voltage after that it shows a reverse effect. Further, it has been perceived that the effect of change in temperature is more on device ambipolar current when interface trap charges are present, whereas the reverse is true in the case of OFF state current and different parasitic capacitances.

Flicker Noise Analysis of Non-uniform Body TFET with Dual Material Source (NUTFET-DMS)

2021 ◽  
pp. 247-253
Author(s):  
Jagritee Talukdar ◽  
G. Amarnath ◽  
Kavicharan Mummaneni
Keyword(s):  
Flicker Noise ◽  
Noise Analysis ◽  
Material Source ◽  
Dual Material

Relating Friction in CMP to Topography Evolution

2005 ◽  
Author(s):  
Xiaolin Xie ◽  
Duane Boning
Keyword(s):  
Surface Topography ◽  
Integrated Circuit ◽  
Friction And Wear ◽  
Shallow Trench Isolation ◽  
Integrated Circuit Manufacturing ◽  
Scale Models ◽  
Trench Isolation ◽  
Model Predictions ◽  
Different Types ◽  
Dual Material

Die-scale models of chemical-mechanical polishing (CMP) have been previously reported for a number of different CMP processes used in integrated circuit manufacturing, including oxide, dual material shallow trench isolation, and dual material copper damascene processes. These models can dynamically predict the evolution of surface topography (e.g., local feature step heights, film thickness nonuniformity across the different pattern density regions of the chip, dishing, and erosion) for any time point during CMP. This topography evolution information can be applied to better understand the basis for observed friction and wear in the CMP process. In this work, we explore models of the macroscopic frictional force based on the surface topography. CMP endpoint measurements, such as those from motor current traces, enable verification of model predictions relating friction to CMP surface topography evolution, for different types of CMP processes and patterned chips.

The extinction time of a general birth and death process with catastrophes

1986 ◽  
Vol 23 (04) ◽  
pp. 851-858 ◽  
Author(s):  
P. J. Brockwell
Keyword(s):  
Laplace Transform ◽  
Size Distribution ◽  
Sufficient Conditions ◽  
Necessary And Sufficient Conditions ◽  
Death Process ◽  
Extinction Time ◽  
Birth And Death Process ◽  
Different Types ◽  
The Laplace Transform ◽  
Necessary And Sufficient

The Laplace transform of the extinction time is determined for a general birth and death process with arbitrary catastrophe rate and catastrophe size distribution. It is assumed only that the birth rates satisfyλ0= 0,λj> 0 for eachj> 0, and. Necessary and sufficient conditions for certain extinction of the population are derived. The results are applied to the linear birth and death process (λj=jλ, µj=jμ) with catastrophes of several different types.

Differentiating between different forms of moral obligations

2020 ◽  
Vol 43 ◽  
Author(s):  
Rajen A. Anderson ◽  
Benjamin C. Ruisch ◽  
David A. Pizarro
Keyword(s):  
Moral Character ◽  
Moral Obligations ◽  
Different Types

Abstract We argue that Tomasello's account overlooks important psychological distinctions between how humans judge different types of moral obligations, such as prescriptive obligations (i.e., what one should do) and proscriptive obligations (i.e., what one should not do). Specifically, evaluating these different types of obligations rests on different psychological inputs and has distinct downstream consequences for judgments of moral character.

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