Surface Effects on the Mechanical Behavior of Buckled Thin Film

2013 ◽  
Vol 80 (2) ◽  
Author(s):  
Yong Wang ◽  
Xue Feng ◽  
Bingwei Lu ◽  
Gangfeng Wang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Tension ◽  
Mechanical Behavior ◽  
Flexible Electronics ◽  
Geometric Nonlinearity ◽  
Surface Elasticity ◽  
Surface Effects ◽  
Design Strategy ◽  
Piezoelectric Effects

The buckling of thin films with natural nonlinearity can provide a useful tool in many applications. In the present paper, the mechanical properties of controllable buckling of thin films are investigated by accounting for both geometric nonlinearity and surface effects at nanoscale. The effects of surface elasticity and residual surface tension on both static and dynamic behaviors of buckled thin films are discussed based on the surface-layer-based model. The dynamic design strategy for buckled thin films as interconnects in flexible electronics is proposed to avoid resonance in a given noise environment based on the above analysis. Further discussion shows that the thermal and piezoelectric effects on mechanical behavior of buckled thin film are equivalent to that of residual surface tension.

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

2009 ◽  
Author(s):  
Khalid Alzoubi ◽  
Susan Lu ◽  
Bahgat Sammakia ◽  
Mark Poliks
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Polyethylene Terephthalate ◽  
Flexible Electronics ◽  
Electrical Resistance ◽  
Thermal Stresses ◽  
Electronic Systems ◽  
Total Width ◽  
Flexible Substrates ◽  
Polyethylene Naphthalate

Flexible electronics represent an emerging area in the electronics packaging and systems integration industry with the potential for new product development and commercialization in the near future. Manufacturing electronics on flexible substrates will produce low cost devices that are rugged, light, and flexible. However, electronic systems are vulnerable to failures caused by mechanical and thermal stresses. For electronic systems on flexible substrates repeated stresses below the ultimate tensile strength or even below the yield strength will cause failures in the thin films. It is known that mechanical properties of thin films are different from those of bulk materials; so, it is difficult to extrapolate bulk material properties on thin film materials. The objective of this work is to study the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated flexible substrates were studied, including thin film thickness, temperature, and humidity. A series of experiments for sputter-deposited copper on PET substrates were performed. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. High magnification images were obtained to observe the crack initiation and propagation in the metal film. Statistical analysis based on design of experiments concepts was performed to identify the main factors and factor’s interaction that affect the life of a thin-film coated substrate. The results of the experiments showed that the crack starts in the middle of the sample and slowly grows toward the edges. Electrical resistance increases slightly during the test until the crack length covers about 90% of the total width of the sample where a dramatic increase in the resistance takes place.

Research Progress in the Preparation of Flexible Substrate Barrier Films

2021 ◽  
Vol 1027 ◽  
pp. 91-98
Author(s):  
Li Xia Guan ◽  
Zhao Yi Zhou ◽  
Yi Jing Huang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Flexible Electronics ◽  
Flexible Substrate ◽  
Research Progress ◽  
Barrier Films ◽  
Main Challenge ◽  
Long Life

The development of flexible electronics towards for the direction of bend ability, lightweight, portability, long life against falling. The performance of the substrate in the flexible electronics plays a very important role in the development of electronics. In this article, three preparation technologies of thin films are introduced, including CVD, PVD and ALD. The paper also introduces the research progress on the preparation of substrate barrier films, and one main challenge that may face by the preparation of thin film materials. In order to satisfy the development of flexible electronics, improving the substrate’s performance constantly is needed. Finally, the development of preparing barrier films is prospected.

scholarly journals Low-Temperature Fabrication of IZO Thin Film for Flexible Transistors

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2552
Author(s):  
Xingwei Ding ◽  
Bing Yang ◽  
Haiyang Xu ◽  
Jie Qi ◽  
Xifeng Li ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Flexible Electronics ◽  
Room Temperature ◽  
Network Formation ◽  
Semiconductor Films ◽  
Uv Treatment ◽  
Indium Zinc Oxide ◽  
Izo Thin Film

Solution-processed thin film transistors (TFTs) used in flexible electronics require them to be fabricated under low temperature. Ultraviolet (UV) treatment is an effective method to transform the solution precursors into dense semiconductor films. In our work, high-quality indium zinc oxide (IZO) thin films were prepared from nitrate-based precursors after UV treatment at room temperature. After UV treatment, the structure of IZO thin films was gradually rearranged, resulting in good M–O–M network formation and bonds. TFTs using IZO as a channel layer were also fabricated on Si and Polyimide (PI) substrate. The field effect mobility, threshold voltage (Vth), and subthreshold swing (SS) for rigid and flexible IZO TFTs are 14.3 and 9.5 cm2/Vs, 1.1 and 1.7 V, and 0.13 and 0.15 V/dec., respectively. This low-temperature processed route will definitely contribute to flexible electronics fabrication.

scholarly journals Capillary Action Around Dental Structures

1973 ◽  
Vol 52 (3) ◽  
pp. 544-550 ◽  
Author(s):  
W.J. O'Brien
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Tension ◽  
Vapor Pressure ◽  
Ambient Pressure ◽  
Human Saliva ◽  
Capillary Action ◽  
Dental Restorations ◽  
Capillary Phenomena ◽  
Lower Vapor Pressure

The capillary action of saliva occurs in the crevices around and between teeth and around dental restorations. Marginal leakage and denture retention caused by a thin film of saliva are aspects of capillary phenomena. Liquids in capillaries isolated from a reservoir showed an increase in surface tension and lower vapor pressure. The strength of thin films of human saliva was independent of ambient pressure.

CRITICAL SURFACE TENSION, CRITICAL SURFACE ENERGY AND PARACHOR OF MnSO3 THIN FILM

2016 ◽  
Vol 23 (03) ◽  
pp. 1650009 ◽  
Author(s):  
İ. A. KARIPER
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Tension ◽  
Grain Size ◽  
Surface Energy ◽  
Film Thickness ◽  
Critical Surface ◽  
Critical Surface Tension ◽  
Average Grain Size ◽  
The Relationship

This study examines the critical surface energy of manganese sulfite (MnSO[Formula: see text] crystalline thin film, produced via chemical bath deposition (CBD) on substrates. In addition, parachor, which is an important parameter of chemical physics, and its relationship with grain size, film thickness, etc., has been investigated for thin films. For this purpose, MnSO3 thin films were deposited at room temperature using different deposition times. Structural properties of the films, such as film thickness and average grain size, were examined using X-ray diffraction; film thickness and surface properties were measured by and atomic force microscope; and critical surface tension of MnSO3 thin films was measured with Optical Tensiometer and calculated using Zisman method. The results showed that critical surface tension and parachor of the films have varied with average grain size and film thickness. Critical surface tension was calculated as 32.97, 24.55, 21.03 and 12.76[Formula: see text]mN/m for 14.66, 30.84, 37.07 and 44.56[Formula: see text]nm grain sizes, respectively. Film thickness and average grain size have been increased with the deposition time and they were found to be negatively correlated with surface tension and parachor. The relationship between film thickness and parachor was found as [Formula: see text] whereas the relationship between average grain size and parachor was found as [Formula: see text] We also showed the relationships between parachor and some thin films parameters.

Effect of the Casimir Force on Buckling of a Double-Nanowire System with Surface Effects

2018 ◽  
Vol 18 (10) ◽  
pp. 1850118 ◽  
Author(s):  
J. Zou ◽  
X.-F. Li
Keyword(s):  
Surface Tension ◽  
Carrying Capacity ◽  
Critical Loads ◽  
Casimir Force ◽  
Surface Elasticity ◽  
Surface Effects ◽  
Load Carrying Capacity ◽  
Governing Equations ◽  
Simply Supported ◽  
Load Carrying

Structural stability of a double-nanowire system with surface effects subjected to axial compressive forces is analyzed. Taking into account the Casimir force between the two nanowires, two coupled governing equations for buckling of a double-nanowire system are derived. For four typical end supports including simply-supported, clamped, cantilevered, and clamped-pinned double-nanowire systems, the characteristic equations are derived and the critical loads are determined for the out-of-phase in-plane buckling. Numerical results indicate that positive surface elasticity enhances the load-carrying capacity of the nanowires, and the reverse is also true. The Casimir force and residual surface tension always increase the critical loads.

Nonvolatile Resistive Switching of Mn3O4 Thin Films for Flexible Electronics Applications

2020 ◽  
Vol 10 (5) ◽  
pp. 622-630
Author(s):  
C.S. Dash ◽  
A. Sivasubramanian ◽  
S.R.S. Prabaharan
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Resistive Switching ◽  
Flexible Electronics ◽  
Local Effect ◽  
Switching Behavior ◽  
Memory Retention ◽  
Potential Sweep ◽  
Bipolar Resistive Switching ◽  
Resistance State

Introduction: We report here our success in developing a flexible RRAM stack structure by employing a low-cost method. Bare conductive commercial electric paint is used as anode against Stainless Steel (SS) foil deposited with Mn3O4 thin films forming a BCEP/Mn3O4/SS thin film stack to understand the intrinsic non-volatile resistive switching behavior of Mn3O4. Experimental: Thin film Mn3O4 is deposited on a SS (304) foil by means of potential sweep voltammetry by maintaining typical conditions. Interestingly, the pristine device is subjected to an electroforming process which exhibited a digital type bipolar resistive switching characteristics. The study of the conduction mechanism revealed that the resistive switching arises due to local effect occurring in the bulk of Mn3O4, which corresponds to the growth and annihilation of oxygen vacancy nanofilaments, and this is responsible for the change in resistance state of the RRAM between Low Resistance State (LRS) and High Resistance State (HRS) respectively. Results: In order to affirm the reliability and reproducibility of RRAM structure, the memory retention is monitored over 103 s and subsequently, the endurance test is also carried out ensuring the reproducibility over 100 cycles. Conclusion: Owing to the flexible nature of BCEP/Mn3O4/SS Foil RRAM stack structure, it is perceived to be a prime candidate for future non-volatile memory and flexible electronics applications.

STRAIN DECONCENTRATION IN THIN FILMS PATTERNED WITH CIRCULAR HOLES

2009 ◽  
Vol 01 (04) ◽  
pp. 557-568 ◽  
Author(s):  
MATTHEW B. TUCKER ◽  
TENG LI
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Flexible Electronics ◽  
Strain Concentration ◽  
Hole Edge ◽  
Small Strains ◽  
Loading Direction ◽  
Applied Tension ◽  
Out Of Plane ◽  
Circular Holes

It is well known that a circular hole in a blanket thin film causes strain concentration near the hole edge when the thin film is under tension. The increased strain level can be as high as three times of the applied tension. Interestingly, we show that, by suitably patterning an array of circular holes in a thin film, the resulting strain in the patterned film can be decreased to only a fraction of the applied tension, even at the hole edges. The strain deconcentration in the film originates from the following deformation mechanism: while initially planar, the film patterned with circular holes elongates by deflecting out of plane, so that a large tension induces only small strains. Using finite element simulations, we investigate the effects of geometric parameters (i.e., hole size, spacing, and pattern) and loading direction on the resulting strain in patterned thin films under tension. The large deformability of the patterned film is independent of materials and length scale, and thus sheds light on a potential architecture concept for flexible electronics.

Integration of a patterned conductive carbon nanotube thin film with an insulating hydrophobic polymer carpet into robust 2D Janus hybrid flexible electronics

2016 ◽  
Vol 4 (41) ◽  
pp. 9750-9755 ◽  
Author(s):  
Peng Xiao ◽  
Jincui Gu ◽  
Jiang He ◽  
Shuai Wang ◽  
Jiawei Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Carbon Nanotube ◽  
Flexible Electronics ◽  
Electronic Packaging ◽  
Molecular Level ◽  
Hydrophobic Polymer ◽  
Packaging Strategy

Hydrophobic polymer carpet grafting on 2D CNTs thin films provides a simple electronic packaging strategy for flexible conductive networks on a molecular level.

Green Function for the Problem of a Plane Containing a Circular Hole With Surface Effects

2010 ◽  
Vol 78 (2) ◽  
Author(s):  
S. G. Mogilevskaya ◽  
A. V. Pyatigorets ◽  
S. L. Crouch
Keyword(s):  
Surface Tension ◽  
Green Function ◽  
Circular Hole ◽  
Surface Elasticity ◽  
Continuum Theory ◽  
Surface Effects ◽  
Elastic Plane ◽  
Parametric Studies ◽  
Complex Green Function ◽  
Hoop Stresses

This paper presents the complex Green function for the plane-strain problem of an infinite, isotropic elastic plane containing a circular hole with surface effects and subjected to a force applied at a point outside of the hole. The analysis is based on the Gurtin and Murdoch [1975, “A Continuum Theory of Elastic Material Surfaces,” Arch. Ration. Mech. Anal., 57, pp. 291–323; 1978, “Surface Stress in Solids,” Int. J. Solids Struct., 14, pp. 431–440] model, in which the surface of the hole possesses its own mechanical properties and surface tension. Systematic parametric studies are performed to investigate the effects of both surface elasticity and surface tension on the distribution of hoop stresses on the boundary of the hole and on a line that connects the point of the applied force and the center of the hole.

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