Research Progress in the Preparation of Flexible Substrate Barrier Films

2021 ◽  
Vol 1027 ◽  
pp. 91-98
Author(s):  
Li Xia Guan ◽  
Zhao Yi Zhou ◽  
Yi Jing Huang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Flexible Electronics ◽  
Flexible Substrate ◽  
Research Progress ◽  
Barrier Films ◽  
Main Challenge ◽  
Long Life

The development of flexible electronics towards for the direction of bend ability, lightweight, portability, long life against falling. The performance of the substrate in the flexible electronics plays a very important role in the development of electronics. In this article, three preparation technologies of thin films are introduced, including CVD, PVD and ALD. The paper also introduces the research progress on the preparation of substrate barrier films, and one main challenge that may face by the preparation of thin film materials. In order to satisfy the development of flexible electronics, improving the substrate’s performance constantly is needed. Finally, the development of preparing barrier films is prospected.

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

2009 ◽  
Author(s):  
Khalid Alzoubi ◽  
Susan Lu ◽  
Bahgat Sammakia ◽  
Mark Poliks
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Polyethylene Terephthalate ◽  
Flexible Electronics ◽  
Electrical Resistance ◽  
Thermal Stresses ◽  
Electronic Systems ◽  
Total Width ◽  
Flexible Substrates ◽  
Polyethylene Naphthalate

Flexible electronics represent an emerging area in the electronics packaging and systems integration industry with the potential for new product development and commercialization in the near future. Manufacturing electronics on flexible substrates will produce low cost devices that are rugged, light, and flexible. However, electronic systems are vulnerable to failures caused by mechanical and thermal stresses. For electronic systems on flexible substrates repeated stresses below the ultimate tensile strength or even below the yield strength will cause failures in the thin films. It is known that mechanical properties of thin films are different from those of bulk materials; so, it is difficult to extrapolate bulk material properties on thin film materials. The objective of this work is to study the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated flexible substrates were studied, including thin film thickness, temperature, and humidity. A series of experiments for sputter-deposited copper on PET substrates were performed. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. High magnification images were obtained to observe the crack initiation and propagation in the metal film. Statistical analysis based on design of experiments concepts was performed to identify the main factors and factor’s interaction that affect the life of a thin-film coated substrate. The results of the experiments showed that the crack starts in the middle of the sample and slowly grows toward the edges. Electrical resistance increases slightly during the test until the crack length covers about 90% of the total width of the sample where a dramatic increase in the resistance takes place.

scholarly journals Highly transparent copper iodide thin film thermoelectric generator on a flexible substrate

RSC Advances ◽  
2019 ◽  
Vol 9 (61) ◽  
pp. 35384-35391 ◽  
Author(s):  
J. Coroa ◽  
B. M. Morais Faustino ◽  
A. Marques ◽  
C. Bianchi ◽  
T. Koskinen ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermoelectric Generator ◽  
Flexible Substrate ◽  
Current Trend ◽  
Copper Iodide ◽  
Conductive Materials ◽  
Flexible Technology ◽  
Flexible Thermoelectric

Simultaneously transparent and flexible conductive materials are in demand to follow the current trend in flexible technology. A highly transparent and flexible thermoelectric generator of 17 p–n modules was constructed based on copper iodide thin films.

Surface Effects on the Mechanical Behavior of Buckled Thin Film

2013 ◽  
Vol 80 (2) ◽  
Author(s):  
Yong Wang ◽  
Xue Feng ◽  
Bingwei Lu ◽  
Gangfeng Wang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Surface Tension ◽  
Mechanical Behavior ◽  
Flexible Electronics ◽  
Geometric Nonlinearity ◽  
Surface Elasticity ◽  
Surface Effects ◽  
Design Strategy ◽  
Piezoelectric Effects

The buckling of thin films with natural nonlinearity can provide a useful tool in many applications. In the present paper, the mechanical properties of controllable buckling of thin films are investigated by accounting for both geometric nonlinearity and surface effects at nanoscale. The effects of surface elasticity and residual surface tension on both static and dynamic behaviors of buckled thin films are discussed based on the surface-layer-based model. The dynamic design strategy for buckled thin films as interconnects in flexible electronics is proposed to avoid resonance in a given noise environment based on the above analysis. Further discussion shows that the thermal and piezoelectric effects on mechanical behavior of buckled thin film are equivalent to that of residual surface tension.

MWCNTs patterning by thermally enhanced and confined evaporation for transparent and conductive thin film

2018 ◽  
Vol 32 (29) ◽  
pp. 1850360 ◽  
Author(s):  
Xiangmeng Li ◽  
Jinyou Shao ◽  
Xijing Zhu ◽  
Huifen Wei
Keyword(s):  
Thin Film ◽  
Flexible Electronics ◽  
Self Assembly ◽  
Mechanical Performance ◽  
Flexible Substrate ◽  
Adhesive Tape ◽  
Large Area ◽  
Multi Walled Carbon Nanotubes ◽  
Geometric Confinement ◽  
Walled Carbon Nanotubes

Conductive and transparent thin film structures are useful in flexible electronics. In this paper, we report multi-walled carbon nanotubes (MWCNTs) patterning into gradient regular patterns with large area of about several square centimeters on silicon or wafer glass slide via thermally enhanced evaporative self-assembly under wedge-shaped geometric confinement. The morphologies, electrical and optical properties of the MWCNTs thin film were characterized. The findings reveal that the conductance would increase with depositing times, meanwhile the transparency would decrease. The resistance of the grid patterning films of MWCNTs has a nearly linear relation to the transmittance in a relatively large range. The MWCNTs can be easily transferred to flexible substrate such as PET films or an adhesive tape. In comparison, SWCNTs could hardly be deposited into stripes or grid patterns, but the continuous thick films and discontinuous thin films could demonstrate better electrical and mechanical performance.

scholarly journals Low-Temperature Fabrication of IZO Thin Film for Flexible Transistors

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2552
Author(s):  
Xingwei Ding ◽  
Bing Yang ◽  
Haiyang Xu ◽  
Jie Qi ◽  
Xifeng Li ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Low Temperature ◽  
Flexible Electronics ◽  
Room Temperature ◽  
Network Formation ◽  
Semiconductor Films ◽  
Uv Treatment ◽  
Indium Zinc Oxide ◽  
Izo Thin Film

Solution-processed thin film transistors (TFTs) used in flexible electronics require them to be fabricated under low temperature. Ultraviolet (UV) treatment is an effective method to transform the solution precursors into dense semiconductor films. In our work, high-quality indium zinc oxide (IZO) thin films were prepared from nitrate-based precursors after UV treatment at room temperature. After UV treatment, the structure of IZO thin films was gradually rearranged, resulting in good M–O–M network formation and bonds. TFTs using IZO as a channel layer were also fabricated on Si and Polyimide (PI) substrate. The field effect mobility, threshold voltage (Vth), and subthreshold swing (SS) for rigid and flexible IZO TFTs are 14.3 and 9.5 cm2/Vs, 1.1 and 1.7 V, and 0.13 and 0.15 V/dec., respectively. This low-temperature processed route will definitely contribute to flexible electronics fabrication.

Thermoelectric Properties of β-Zn4Sb3 Thin Films Deposited on Polyimide Flexible Substrate

2016 ◽  
Vol 847 ◽  
pp. 166-170
Author(s):  
Feng Li ◽  
Ping Fan ◽  
Jing Ting Luo ◽  
Zhuang Hao Zheng ◽  
Guang Xing Liang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermoelectric Properties ◽  
High Performance ◽  
Saturated Vapor ◽  
Flexible Substrate ◽  
Local Area ◽  
Atomic Ratio ◽  
Medium Temperature ◽  
Low Dimensional

Due to the high-performance in the medium temperature application, β-Zn4Sb3 thermoelectric material has been received much attention. It is found that low dimensional thin film can improve the thermoelectric properties of materials by quantum local area effect and interface effect in recent years. In this paper, the β-Zn4Sb3 thin film was prepared on polyimide flexible substrate by DC magnetron co-sputtering method. The results showed that the thin film exhibited predominately ZnSb phases when the thin film was prepared by DC magnetron sputtering using Zn4Sb3 alloy target. It is suggested that the element Zn has high saturated vapor pressure and the thin film is lack of Zn due to the evaporation during the heat treatment process. We further adopted co-deposition Zn and Zn4Sb3 by DC magnetron co-sputtering to supplement the content of Zn. The sputtering power of Zn4Sb3 is fixed and Zn is set to 21W, 27W and 34W, respectively. The results indicated that the thin films transformed from ZnSb phase into β-Zn4Sb3 phase after Zn added. EDS analysis demonstrated that the atomic ratio of Zn:Sb was approach 4:3, and a slightly surplus of Zn. The thermoelectric properties of thin films with β-Zn4Sb3 phase were improved obviously.

Nonvolatile Resistive Switching of Mn3O4 Thin Films for Flexible Electronics Applications

2020 ◽  
Vol 10 (5) ◽  
pp. 622-630
Author(s):  
C.S. Dash ◽  
A. Sivasubramanian ◽  
S.R.S. Prabaharan
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Resistive Switching ◽  
Flexible Electronics ◽  
Local Effect ◽  
Switching Behavior ◽  
Memory Retention ◽  
Potential Sweep ◽  
Bipolar Resistive Switching ◽  
Resistance State

Introduction: We report here our success in developing a flexible RRAM stack structure by employing a low-cost method. Bare conductive commercial electric paint is used as anode against Stainless Steel (SS) foil deposited with Mn3O4 thin films forming a BCEP/Mn3O4/SS thin film stack to understand the intrinsic non-volatile resistive switching behavior of Mn3O4. Experimental: Thin film Mn3O4 is deposited on a SS (304) foil by means of potential sweep voltammetry by maintaining typical conditions. Interestingly, the pristine device is subjected to an electroforming process which exhibited a digital type bipolar resistive switching characteristics. The study of the conduction mechanism revealed that the resistive switching arises due to local effect occurring in the bulk of Mn3O4, which corresponds to the growth and annihilation of oxygen vacancy nanofilaments, and this is responsible for the change in resistance state of the RRAM between Low Resistance State (LRS) and High Resistance State (HRS) respectively. Results: In order to affirm the reliability and reproducibility of RRAM structure, the memory retention is monitored over 103 s and subsequently, the endurance test is also carried out ensuring the reproducibility over 100 cycles. Conclusion: Owing to the flexible nature of BCEP/Mn3O4/SS Foil RRAM stack structure, it is perceived to be a prime candidate for future non-volatile memory and flexible electronics applications.

STRAIN DECONCENTRATION IN THIN FILMS PATTERNED WITH CIRCULAR HOLES

2009 ◽  
Vol 01 (04) ◽  
pp. 557-568 ◽  
Author(s):  
MATTHEW B. TUCKER ◽  
TENG LI
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Flexible Electronics ◽  
Strain Concentration ◽  
Hole Edge ◽  
Small Strains ◽  
Loading Direction ◽  
Applied Tension ◽  
Out Of Plane ◽  
Circular Holes

It is well known that a circular hole in a blanket thin film causes strain concentration near the hole edge when the thin film is under tension. The increased strain level can be as high as three times of the applied tension. Interestingly, we show that, by suitably patterning an array of circular holes in a thin film, the resulting strain in the patterned film can be decreased to only a fraction of the applied tension, even at the hole edges. The strain deconcentration in the film originates from the following deformation mechanism: while initially planar, the film patterned with circular holes elongates by deflecting out of plane, so that a large tension induces only small strains. Using finite element simulations, we investigate the effects of geometric parameters (i.e., hole size, spacing, and pattern) and loading direction on the resulting strain in patterned thin films under tension. The large deformability of the patterned film is independent of materials and length scale, and thus sheds light on a potential architecture concept for flexible electronics.

Integration of a patterned conductive carbon nanotube thin film with an insulating hydrophobic polymer carpet into robust 2D Janus hybrid flexible electronics

2016 ◽  
Vol 4 (41) ◽  
pp. 9750-9755 ◽  
Author(s):  
Peng Xiao ◽  
Jincui Gu ◽  
Jiang He ◽  
Shuai Wang ◽  
Jiawei Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Carbon Nanotube ◽  
Flexible Electronics ◽  
Electronic Packaging ◽  
Molecular Level ◽  
Hydrophobic Polymer ◽  
Packaging Strategy

Hydrophobic polymer carpet grafting on 2D CNTs thin films provides a simple electronic packaging strategy for flexible conductive networks on a molecular level.

scholarly journals Research progress of tin oxide-based thin films and thin-film transistors prepared by sol-Ggel method

2020 ◽  
Vol 69 (22) ◽  
pp. 228102-228102
Author(s):  
Liu Xian-Zhe ◽  
◽  
Zhang Xu ◽  
Tao Hong ◽  
Huang Jian-Lang ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Tin Oxide ◽  
Thin Film Transistors ◽  
Research Progress
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