Excimer Laser Micromachining Using Binary Mask Projection for Large Area Patterning With Single Micrometer Features

2013 ◽  
Vol 1 (3) ◽  
Author(s):  
Govind Dayal ◽  
Syed Nadeem Akhtar ◽  
S. Anantha Ramakrishna ◽  
J. Ramkumar
Keyword(s):  
Excimer Laser ◽  
Material Removal ◽  
Removal Rate ◽  
Laser Micromachining ◽  
Binary Mask ◽  
Projection Technique ◽  
Large Area ◽  
Aspect Ratios ◽  
Simple Limit ◽  
Micrometer Scale

Excimer laser micromachining using binary mask projection has been investigated for rapid patterning of single micrometer features over large areas of various substrates. Simple limit for depth of focus that determines the depth to width aspect ratios is given and verified for different materials. Binary mask projection technique is found to conformally reproduce the mask features from the millimetre to the micrometer scale under proper focusing conditions. Large arrays of 1 μm and 15 μm holes on Kapton are made with high resolution and uniform periodicity. Material removal rate (MRR) for the laser machining of these holes are examined and the machining efficiency for these are found to have different dependence on the fluence. A saturation of hole-depth with increasing number of pulses is obtained.

Development of Wide Bandgap Semiconductor Photonic Device Structures by Excimer Laser Micromachining

1999 ◽  
Vol 595 ◽  
Author(s):  
Qiang Zhao ◽  
Michael Lukitsch ◽  
Jie Xu ◽  
Gregory Auner ◽  
Ratna Niak ◽  
...  
Keyword(s):  
Thin Films ◽  
Excimer Laser ◽  
Ablation Rate ◽  
Laser Micromachining ◽  
Wide Bandgap ◽  
Wide Bandgap Semiconductor ◽  
Excimer Laser Ablation ◽  
Sapphire Substrates ◽  
Aspect Ratios ◽  
Device Structures

AbstractExcimer laser ablation rates of Si (111) and AlN films grown on Si (111) and r-plane sapphire substrates were determined. Linear dependence of ablation rate of Si (111) substrate, sapphire and AlN thin films were observed. Excimer laser micromachining of the AlN thin films on silicon (111) and SiC substrates were micromachined to fabricate a waveguide structure and a pixilated structure. This technique resulted in clean precise machining of AlN with high aspect ratios and straight walls.

scholarly journals Development of Wide Bandgap Semiconductor Photonic Device Structures by Excimer Laser Micromachining

2000 ◽  
Vol 5 (S1) ◽  
pp. 852-858 ◽  
Author(s):  
Qiang Zhao ◽  
Michael Lukitsch ◽  
Jie Xu ◽  
Gregory Auner ◽  
Ratna Niak ◽  
...  
Keyword(s):  
Thin Films ◽  
Excimer Laser ◽  
Ablation Rate ◽  
Laser Micromachining ◽  
Wide Bandgap ◽  
Wide Bandgap Semiconductor ◽  
Excimer Laser Ablation ◽  
Sapphire Substrates ◽  
Aspect Ratios ◽  
Device Structures

Excimer laser ablation rates of Si (111) and AlN films grown on Si (111) and r-plane sapphire substrates were determined. Linear dependence of ablation rate of Si (111) substrate, sapphire and AlN thin films were observed. Excimer laser micromachining of the AlN thin films on silicon (111) and SiC substrates were micromachined to fabricate a waveguide structure and a pixilated structure. This technique resulted in clean precise machining of AlN with high aspect ratios and straight walls.

A Comparison of Dry and Underwater Laser Micromachining of Silicon Substrates

2010 ◽  
Vol 443 ◽  
pp. 693-698 ◽  
Author(s):  
Viboon Tangwarodomnukun ◽  
Jun Wang ◽  
Philip Mathew
Keyword(s):  
Material Removal ◽  
Laser Energy ◽  
Removal Rate ◽  
Water Layer ◽  
Traverse Speed ◽  
Laser Micromachining ◽  
Pulse Frequency ◽  
Silicon Substrates ◽  
Underwater Laser ◽  
Cut Surface

Laser micromachining has been widely used for decades to fabricate the micro- and submicro-component structures. However, thermal and physical damages are crucial issues associated with the process. Underwater laser ablation has been developed as a damage-free micro-ablation technique. In this paper, a comparison of the conventional dry and underwater laser micromachining of silicon is presented. It shows that the heat affected zone (HAZ) can be reduced significantly in the underwater laser process, though the material removal rate is reduced due to the energy loss by the water layer. The effects of pulse frequency, traverse speed and laser energy on the obtained kerf width, HAZ and cut surface quality are also analyzed and discussed.

Electrical Discharge Machining of Micro Holes on Titanium Sheets

2011 ◽  
Author(s):  
Gianluca D’Urso ◽  
Michela Longo ◽  
Giancarlo Maccarini ◽  
Chiara Ravasio
Keyword(s):  
Process Parameters ◽  
Electrical Discharge ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Micro Electrical Discharge Machining ◽  
Aspect Ratios ◽  
Micro Holes ◽  
Electron Microscopes

Micro-Electrical Discharge Machining (μEDM) has become a widely accepted non-traditional material removal process for micro-manufacture of conductive materials considered difficult to be cut using traditional machining technologies. Moreover, EDM is an ideal process for obtaining burr-free micron-size apertures with high aspect ratios. Aim of this work was to investigate the feasibility of drilling micro holes on titanium using μ-EDM technology. Titanium plates having a thickness equal to 0.5 mm were taken into account and the holes were performed using a carbide electrode having a diameter equal to 0.3 mm. The Design Of Experiment (DOE) method was used for planning the experimental campaign and ANOVA techniques were applied to study the relationship between process parameters and final output. In particular, the most important process parameters such as peak current, pulse duration, frequency and electrode rotation speed were investigated as a function of material removal rate, wear rate and machining accuracy. Geometrical and dimensional analyses were carried out on micro-holes using both optical and scanning electron microscopes to evaluate both the over cut and the rate of taper.

Effects of Process Parameters on Surface Roughness and MRR in the hard turning of EN 36 steel

2018 ◽  
pp. 102-110
Author(s):  
Amritpal Singh ◽  
Rakesh Kumar
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Hard Turning ◽  
Control Parameter ◽  
Removal Rate ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Dry Cutting

In the present study, Experimental investigation of the effects of various cutting parameters on the response parameters in the hard turning of EN36 steel under the dry cutting condition is done. The input control parameters selected for the present work was the cutting speed, feed and depth of cut. The objective of the present work is to minimize the surface roughness to obtain better surface finish and maximization of material removal rate for better productivity. The design of experiments was done with the help of Taguchi L9 orthogonal array. Analysis of variance (ANOVA) was used to find out the significance of the input parameters on the response parameters. Percentage contribution for each control parameter was calculated using ANOVA with 95 % confidence value. From results, it was observed that feed is the most significant factor for surface roughness and the depth of cut is the most significant control parameter for Material removal rate.

Performance Analysis of Trihexyltetradecylphosphonium Chloride Ionic Fluid under MQL Condition in Hard turning

2020 ◽  
Vol 17 (1) ◽  
pp. 7629-7647
Author(s):  
A. Pandey ◽  
R. Kumar ◽  
A. K. Sahoo ◽  
A. Paul ◽  
A. Panda
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Cutting Speed ◽  
Coconut Oil ◽  
Chip Morphology ◽  
Weight Fraction ◽  
Cutting Fluid ◽  
Depth Of Cut

The current research presents an overall performance-based analysis of Trihexyltetradecylphosphonium Chloride [[CH3(CH2)5]P(Cl)(CH2)13CH3] ionic fluid mixed with organic coconut oil (OCO) during turning of hardened D2 steel. The application of cutting fluid on the cutting interface was performed through Minimum Quantity Lubrication (MQL) approach keeping an eye on the detrimental consequences of conventional flood cooling. PVD coated (TiN/TiCN/TiN) cermet tool was employed in the current experimental work. Taguchi’s L9 orthogonal array and TOPSIS are executed to analysis the influences, significance and optimum parameter settings for predefined process parameters. The prime objective of the current work is to analyze the influence of OCO based Trihexyltetradecylphosphonium Chloride ionic fluid on flank wear, surface roughness, material removal rate, and chip morphology. Better quality of finish (Ra = 0.2 to 1.82 µm) was found with 1% weight fraction but it is not sufficient to control the wear growth. Abrasion, chipping, groove wear, and catastrophic tool tip breakage are recognized as foremost tool failure mechanisms. The significance of responses have been studied with the help of probability plots, main effect plots, contour plots, and surface plots and the correlation between the input and output parameters have been analyzed using regression model. Feed rate and depth of cut are equally influenced (48.98%) the surface finish while cutting speed attributed the strongest influence (90.1%). The material removal rate is strongly prejudiced by cutting speed (69.39 %) followed by feed rate (28.94%) whereas chip reduction coefficient is strongly influenced through the depth of cut (63.4%) succeeded by feed (28.8%). TOPSIS significantly optimized the responses with 67.1 % gain in closeness coefficient.

High Resolution Displacement of Functional Groups onto Fluorocarbon Resin Surface by Using ArF Excimer Laser

1996 ◽  
Vol 451 ◽  
Author(s):  
T. Shimizu ◽  
M. Murahara
Keyword(s):  
Contact Angle ◽  
High Resolution ◽  
Laser Beam ◽  
Thin Layer ◽  
Functional Groups ◽  
Excimer Laser ◽  
Laser Fluence ◽  
Large Area ◽  
Three Solutions ◽  
Arf Excimer Laser

ABSTRACTA Fluorocarbon resin surface was selectively modified by irradiation with a ArF laser beam through a thin layer of NaAlO2, B(OH)3, or H2O solution to give a hydrophilic property. As a result, with low fluence, the surface was most effectively modified with the NaAlO2 solution among the three solutions. However, the contact angle in this case changed by 10 degrees as the fluence changed only 1mJ/cm2. When modifying a large area of the surface, high resolution displacement could not be achieved because the laser beam was not uniform in displacing functional groups. Thus, the laser fluence was successfully made uniform by homogenizing the laser beam; the functional groups were replaced on the fluorocarbon resin surface with high resolution, which was successfully modified to be hydrophilic by distributing the laser fluence uniformly.

Effect of SiC-Cu Electrode on Material Removal Rate, Tool Wear and Surface Roughness in EDM Process

2020 ◽  
Vol 38 (9A) ◽  
pp. 1406-1413
Author(s):  
Yousif Q. Laibia ◽  
Saad K. Shather
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
304 Stainless Steel ◽  
Tool Electrode ◽  
Pulse Time ◽  
Edm Process

Electrical discharge machining (EDM) is one of the most common non-traditional processes for the manufacture of high precision parts and complex shapes. The EDM process depends on the heat energy between the work material and the tool electrode. This study focused on the material removal rate (MRR), the surface roughness, and tool wear in a 304 stainless steel EDM. The composite electrode consisted of copper (Cu) and silicon carbide (SiC). The current effects imposed on the working material, as well as the pulses that change over time during the experiment. When the current used is (8, 5, 3, 2, 1.5) A, the pulse time used is (12, 25) μs and the size of the space used is (1) mm. Optimum surface roughness under a current of 1.5 A and the pulse time of 25 μs with a maximum MRR of 8 A and the pulse duration of 25 μs.

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