The Performance of Methanol and Water Heat Pipes for Electronics Cooling Applications in Spacecraft Instrumentation

2005 ◽  
Author(s):  
John D. Bernardin

Increases in the power density of electronics and the corresponding decreases in packaging space have driven the development and enhancement of numerous electronics cooling strategies. The design of cooling systems for electronics are particularly challenging in spacecraft environments where there exists the additional requirements of minimal mass and volume, high reliability, reduced complexity and number of moving parts, and ability to operate in a reduced or gravity-free environment. One cooling technique that has proven to satisfy these demanding and integrated requirements for spacecraft electronics cooling applications, involves the use of heat pipes. The heat pipe is a passive heat transport device that requires no moving parts, is highly compact and reliable, and is an efficient mover of thermal energy in reduced gravity environments. Despite all of these positive features, heat pipes do have limitations and functional characteristics that designers must be keenly aware of when incorporating them into the development of electronic cooling systems. These include, in part, limits on the heat transport capacity and operational temperature, as well as performance variations between seemingly identical heat pipes due to contamination or manufacturing flaws. This paper discusses thermal analyses and performance testing of commercial copper heat pipes that utilize a sintered copper wick with either methanol or water as the working fluid. First, the electronic cooling application, thermal operating requirements, and commercial heat pipe designs are introduced. Next, the models and analyses used to predict the heat transport limits for the heat pipes are discussed. Following this, the experimental apparatus and procedures used to characterize the thermal performance of the heat pipes are presented. Finally, with the aid of empirical data, assessments of the thermal performance of each heat pipe, the range of performance variation between heat pipes, as well as the applicability and accuracy of the analytical performance models are provided.

Author(s):  
Triem T. Hoang ◽  
Tamara A. O’Connell ◽  
Jentung Ku ◽  
C. Dan Butler ◽  
Theodore D. Swanson

Thermal management of modern electronics has become a problem of significant interest due to the demand for power and reduction in packaging size. Requirements of next-generation microprocessors in terms of power dissipation and heat flux will certainly outgrow the capability of today’s thermal control technology. LHPs, like conventional heat pipes, are capillary pumped heat transport devices. They contain no mechanical moving part to wear out or require electrical power to operate. But unlike heat pipes, LHPs possess much higher heat transport capabilities enabling them to transport large amounts of heat over long distances in small flexible lines for heat rejection. In fact, a miniature ammonia LHP developed for a NASA space program is capable of transporting 60W over a distance of 1 meter in 1/16”O.D. stainless steel tubing. Therefore, miniature LHPs using water as the working fluid are excellent candidates to replace heat pipes as heat transports in electronic cooling systems. However, a number of operational issues regarding system performance, cost, and integration/packaging must be resolved before water LHPs can become a viable option for commercial electronics.


Volume 3 ◽  
2004 ◽  
Author(s):  
R. Kempers ◽  
A. Robinson ◽  
C. Ching ◽  
D. Ewing

A study was performed to experimentally characterize the effect of fluid loading on the heat transport performance of wicked heat pipes. In particular, experiments were performed to characterize the performance of heat pipes with insufficient fluid to saturate the wick and excess fluid for a variety of orientations. It was found that excess working fluid in the heat pipe increased the thermal resistance of the heat pipe, but increased maximum heat flux through the pipe in a horizontal orientation. The thermal performance of the heat pipe was reduced when the amount of working fluid was less than required to saturate the wick, but the maximum heat flux through the heat pipe was significantly reduced at all orientations. It was also found in this case the performance of this heat pipe deteriorated once dry-out occurred.


Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.


Author(s):  
Mehdi Taslimifar ◽  
Maziar Mohammadi ◽  
Ali Adibnia ◽  
Hossein Afshin ◽  
Mohammad Hassan Saidi ◽  
...  

Homogenous dispersing of nanoparticles in a base fluid is an excellent way to increase the thermal performance of heat transfer devices especially Heat Pipes (HPs). As a wickless, cheap and efficient heat pipe, Pulsating Heat Pipes (PHPs) are important candidates for thermal application considerations. In the present research an Open Loop Pulsating Heat Pipe (OLPHP) is fabricated and tested experimentally. The effects of working fluid namely, water, Silica Coated ferrofluid (SC ferrofluid), and ferrofluid without surface coating of nanoparticles (ferrofluid), charging ratio, heat input, and application of magnetic field on the overall thermal performance of the OLPHPs are investigated. Experimental results show that ferrofluid has better heat transport capability relative to SC ferrofluid. Furthermore, application of magnetic field improves the heat transfer performance of OLPHPs charged with both ferrofluids.


Author(s):  
S. B. Liang ◽  
G. P. Xu

Self-sustainable motions of the slug flow in oscillating heat pipes have been investigated in the paper. Thin film condensation in the capillary channels of the condenser of the oscillating heat pipes was studied. Instability of the thin liquid film on the characteristics of heat pipes was analysed. The extra thermal resistance caused by the thickness of the thin liquid film was taken into account for the numerical simulation of the oscillatory motions of the slug flow in the heat pipes. Saturated temperatures and pressures of the working fluid in the condenser were obtained. Thermoacoustic theory was applied to calculate heat transport through the adiabatic section of the heat pipes. Experimental studies were carried out to understand the heat transfer behaviours of heat pipes. One heat pipe with the working fluid of HFC-134a was evaluated. The heat pipe is made of aluminium plate and has the width of 50 mm and thickness of 1.9 mm. Numerical and experimental results relevant to the heat transport capability of the heat pipe were analysed and compared.


2011 ◽  
Vol 15 (3) ◽  
pp. 879-888 ◽  
Author(s):  
Rathinasamy Senthilkumar ◽  
Subaiah Vaidyanathan ◽  
Sivaramanb Balasubramanian

This paper discuses the use of self rewetting fluids in the heat pipe. In conventional heat pipes, the working fluid used has a negative surface-tension gradient with temperature. It is an unfavourable one and it decreases the heat transport between the evaporator section and the condenser section. Self rewetting fluids are dilute aqueous alcoholic solutions which have the number of carbon atoms more than four. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with temperature up to a certain limit. The experiments are conducted to improve the heat-transport capability and thermal efficiency of capillary assisted heat pipes with the self rewetting fluids like aqueous solutions of n-Butanol and n-Pentanol and its performance is compared with that of pure water. The n-Butanol and n-Pentanol are added to the pure water at a concentration of 0.001moles/lit to prepare the self rewetting fluids. The heat pipes are made up of copper container with a two-layered stainless steel wick consisting of mesh wrapped screen. The experimental results show that the maximum heat transport of the heat pipe is enhanced and the thermal resistances are considerably decreased than the traditional heat pipes filled with water. The fluids used exhibit an anomalous increase in the surface tension with increasing temperature.


2015 ◽  
Vol 789-790 ◽  
pp. 422-425
Author(s):  
Fun Liang Chang ◽  
Yew Mun Hung

Micro heat pipe is a two-phase heat transfer device offering effective high heat-flux removal in electronics cooling. Essentially, micro heat pipe relies on the phase change processes, namely evaporation and condensation, and the circulation of working fluid to function as heat transfer equipment. The vast applications of micro heat pipe in portable appliances necessitate its functionality under different orientations with respect to gravity. Therefore, its thermal performance is strongly related to its orientation. By incorporating solid wall conduction, together with the continuity, momentum, and energy equations of the working fluid, a mathematical model is developed to investigate the heat and fluid flow characteristics of inclined micro heat pipes. We investigate both the favorable and adverse effects of gravity on the circulation rate which is intimately related to the thermal performance of micro heat pipes. The effects of gravity, through the angle of inclination, on the circulation strength and heat transport capacity are analysed. This study serves as a useful analytical tool in the micro heat pipe design and performance analysis, associated with different inclinations and operating conditions.


2013 ◽  
Vol 393 ◽  
pp. 735-740
Author(s):  
Fairosidi Idrus ◽  
Nazri Mohamad ◽  
Ramlan Zailani ◽  
Wisnoe Wirachman ◽  
Mohd Zulkifly Abdullah

A heat pipe is a heat-transfer device that use the principles of thermal conductivity and phase change to transfer heat between two ends at almost constant temperature. The thermal peformance of cylindrical heat pipes depends on design parameters such as dimensions of the heat pipe, material, wick structure and the working fluid. An experimental strategy was designed to study the effect of these parameters on the thermal performance of cylindrical heat pipes. The experimental design was conceived by employing the Taguchi method. The final aim of the experiments is to come up with design parameters that will yield optimum thermal performance. This paper presents an efficient design of experiment and the associated experimental setup and procedures to be carried out in order to optimize the design of cylindrical heat pipes.


2010 ◽  
Vol 31 (4) ◽  
pp. 125-132 ◽  
Author(s):  
Patrik Nemec ◽  
Alexander Čaja ◽  
Richard Lenhard

Visualization of heat transport in heat pipes using thermocamera Heat pipes, as passive elements show a high level of reliability when taking heat away and they can take away heat flows having a significantly higher density than systems with forced convection. A heat pipe is a hermetically closed duct, filled with working fluid. Transport of heat in heat pipes is procured by the change of state of the working fluid from liquid state to steam and vice versa and depends on the hydrodynamic and heat processes in the pipe. This study have been focused on observing the impact these processes have on the heat process, the transport of heat within the heat pipe with the help of thermovision. The experiment is oriented at scanning the changes in the surface temperatures of the basic structural types of capillary heat pipes in vertical position.


Author(s):  
Sukhvinder Kang ◽  
Randy Cook ◽  
Dave Gailus

In recent years heat pipes have become widely use in high performance air-cooled heat sinks for cooling electronics equipment. Such heat sinks rely on the heat pipes to collect heat from small high heat flux sources, transport it over some distance, and spread the heat efficiently to a volume of fins where the heat is transferred to an air flow stream by convection. When used effectively, heat pipes enable heat sinks that have low thermal resistance and low mass. For the heat sink to be successful, the heat pipes must also have sufficient heat transport capacity. To deliver their design thermal resistance and heat transport capacity, heat pipes need to be manufactured with well-controlled wick characteristics, working fluid fill volume and minimal residual non-condensable gases. It is standard procedure for heat pipe manufacturing companies to test 100 percent of the heat pipes they manufacture. The most commonly used production test is designed to rapidly show whether or not a heat pipe functions as a heat pipe. On a sampling basis, manufacturers also test the heat transport capacity of their heat pipes. There is no rapid test that can verify that any specific heat pipe will achieve the desired operational life — this is achieved by validation of the manufacturing process and adequate manufacturing process controls. In this paper we describe a test method and apparatus that can be used to rapidly test whether a heat pipe has the required thermal resistance at the specified heat transport capacity. The apparatus is capable of testing heat pipes over a wide range of diameters and lengths in their end use configuration (with bends and flattened regions). The key design criteria for the test apparatus is described and test data for several application specific heat pipes is presented.


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