Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
Keyword(s):
The temperature dependence of the strength of a thin copper electrodeposit has been measured, by microtensile testing, from room temperature to 150 °C. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at 150 °C. The yield strength followed a similar trend. Elongation to failure increased slightly with temperature. The Young’s modulus, as measured by the unload-load slope, was well below the values expected based on averaging single-crystal elastic constants at all test temperatures. The effect of strain rate on strength at room temperature, using a range of over a decade, was low, with a weak trend upward.
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