Effects of alternating current voltage amplitude and oxide capacitance on mid-gap interface state defect density extractions in In0.53Ga0.47As capacitors

Author(s):  
Scott Monaghan ◽  
Éamon O'Connor ◽  
Ian M. Povey ◽  
Brendan J. Sheehan ◽  
Karim Cherkaoui ◽  
...  
1997 ◽  
Vol 485 ◽  
Author(s):  
B. G Budaguan ◽  
A. A. Aivazov ◽  
A. A. Sherchenkov ◽  
A. V Blrjukov ◽  
V. D. Chernomordic ◽  
...  

AbstractIn this work a-Si:H/c-Si heterostructures with good electronic properties of a-Si:H were prepared by 55 kHz Plasma Enhanced Chemical Vapor Deposition (PECVD). Currentvoltage and capacitance-voltage characteristics of a-Si:H/c-Si heterostructures were measuredto investigate the influence of low frequency plasma on the growing film and amorphous silicon/crystalline silicon boundary. It was established that the interface state density is low enough for device applications (<2.1010 cm−2). The current voltage measurements suggest that, when forward biased, space-charge-limited current determines the transport mechanism in a- Si:H/c-Si heterostructures, while reverse current is ascribed to the generation current in a-Si:H and c-Si depletion layers.


1993 ◽  
Vol 297 ◽  
Author(s):  
H. Stiebig ◽  
M. BÖhm

Amorphous silicon based n-i-p-i-n structures may be used as color detectors. A simulation program has been developed which allows the examination of the spatial distribution of carrier concentrations, electric field and current densities under different illumination conditions. Furthermore current/voltage- and monochromatic response curves are presented. The results of the simulation point out that the defect density in the p-layer has a major influence on device performance.


2004 ◽  
Vol 808 ◽  
Author(s):  
Jarrod McDonald ◽  
Vikram L. Dalal ◽  
Max Noack

ABSTRACTWe report on the growth and fabrication of top gate thin film transistors at low temperatures in nanocrystalline Si:H. The nanocrystalline Si:H was deposited using a VHF-PECVD plasma process at 45 MHz in a diode reactor. The material was deposited from a mixture of silane and hydrogen at a temperature of 250-300°C. Higher temperatures resulted in a loss of hydrogen from the material. The properties of the nanocrystalline Si:H were studied using x-ray diffraction and Raman spectroscopy. The material showed a high ratio (3.8) between the crystalline and amorphous peaks in the Raman spectrum. X-ray diffraction data showed the films to be predominantly oriented in <111> direction, and the grain size estimated from Scherer's formula was in the range of 12-15 nm. The doping of the material could be changed by introducing ppm levels of Boron or Phosphorus. The as-grown material was generally n type. By adding controlled amounts of B, the material could be made p type. The devices made were n-channel MISFET's with p body. The n+ source and drain layers were made from amorphous Si:H. A systematic investigation of the appropriate oxide/nitride layer to be used was undertaken. The nitride layers were grown at 250-300°C using mixtures of silane and ammonia, with a high degree of dilution by helium. The presence of helium dilution, along with post-deposition passivation by a hydrogen plasma, was found to produce reproducible, low interface defect density nitride materials. Interface state densities were measured using capacitance spectroscopy at different frequencies and temperatures and found to be in the range of 4.5x1011/cm2-eV. The breakdown strength of the nitride was measured and found to be 4 MV/cm. Proof-of-concept TFT devices were fabricated using reactive ion etching. The threshold voltage was in the range of 13-15 V, and the on/off ratio was in the range of 103.


2014 ◽  
Vol 31 (12) ◽  
pp. 127201
Author(s):  
Kun-Qi Xu ◽  
Hua-Rong Zeng ◽  
Hui-Zhu Yu ◽  
Kun-Yu Zhao ◽  
Guo-Rong Li ◽  
...  

1995 ◽  
Vol 378 ◽  
Author(s):  
Hisayoshi Fujikawa ◽  
Yasunori Taga

AbstractTa2O5-based composite films prepared by magnetron sputtering have been investigated with respect to their dielectric properties. As additive third oxides, Y2O3 and WO3 were found to be effective in improving insulating properties without decreasing their dielectric constant. Furthermore, electrical properties of Ta2O5-Y2O3 films were investigated by measuring the current-voltage characteristics in the temperature range from 100 to 330 K. Measurement of temperature dependence of the leakage current revealed that the conduction mechanism at RT changed from the Poole-Frenkel type to the Fowler-Nordheim tunneling type by adding Y2O3 into Ta2O5. Based on the detailed analysis of the results, it is concluded that the addition of Y2O3 into the Ta2O5 film is effective in the reduction of defect density without high-temperature annealing and the alteration of electrical conduction mechanisms of the films.


1995 ◽  
Vol 387 ◽  
Author(s):  
L. K. Han ◽  
M. Bhat ◽  
J. Yan ◽  
D. Wristers ◽  
D. L. Kwong

AbstractThis paper reports on the formation of high quality ultrathin oxynitride gate dielectric by in-situ rapid thermal multiprocessing. Four such gate dielectrics are discussed here; (i) in-situ NO-annealed SiO2, (ii) N2O- or NO- or O2-grown bottom oxide/RTCVD SiO2/thermal oxide, (iii) N2O-grown bottom oxide/Si3N4/N2O-oxide (ONO) and (iv) N2O-grown bottom oxide/RTCVD SiO2/N2O-oxide. Results show that capacitors with NO-based oxynitride gate dielectrics, stacked oxynitride gate dielectrics with varying quality of bottom oxide (O2/N2O/NO), and the ONO structures show high endurance to interface degradation, low defect-density and high charge-to-breakdown compared to thermal oxide. The N2O-last reoxidation step used in the stacked dielectrics and ONO structures is seen to suppress charge trapping and interface state generation under Fowler-Nordheim injection. The stacked oxynitride gate dielectrics also show excellent MOSFET performance in terms of transconductance and mobility. While the current drivability and mobilities are found to be comparable to thermal oxide for N-channel MOSFET's, the hot-carrier immunity of N-channel MOSFET's with the N2O-oxide/CVD-SiO2/N2O-oxide gate dielectrics is found to be significantly enhanced over that of conventional thermal oxide.


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