Reliability assessment of slopes with three-dimensional rotated transverse anisotropy in soil properties

2020 ◽  
Author(s):  
Lei Huang ◽  
Andy Y F Leung
Keyword(s):  
Soil Properties ◽  
Three Dimensional ◽  
Transverse Anisotropy ◽  
Reliability Indices ◽  
Strike Direction ◽  
Soil Fabric ◽  
Out Of Plane ◽  
Plane Direction ◽  
Deposition Processes ◽  
Probabilistic Slope Stability Analysis

The influence of soil variability on three-dimensional (3D) probabilistic slope stability analysis has been previously investigated for soils that display isotropic spatial variability features or anisotropic horizontal fabric patterns. However, due to various soil deposition processes, weathering, filling or tectonic movements, the assumptions of isotropy or horizontal layering may not always be realistic. This study presents 3D analyses of slopes with spatially variable soils associated with rotated transverse anisotropy features. The results show that for cross-dip slopes where the strike direction of soil strata is perpendicular to the out-of-plane direction of the slope, the reliability depends on various factors including strata rotation angle and autocorrelation distances, and differs significantly from slopes with horizontally deposited soil fabric. The influence of strata orientation is also pronounced for dip slopes and reverse dip slopes, and these are presented in terms of reliability indices of the slopes and statistics of the length of sliding mass, and elaborated by considering the failure mechanism under different scenarios. Through these analyses, this paper discusses the key features of slope reliability considering rotated transverse anisotropy in soil properties, and their major differences from situations involving horizontal soil layers or two-dimensional probabilistic assessments.

Mechanism of the Transition From In-Plane Buckling to Helical Buckling for a Stiff Nanowire on an Elastomeric Substrate

2016 ◽  
Vol 83 (4) ◽  
Author(s):  
Youlong Chen ◽  
Yong Zhu ◽  
Xi Chen ◽  
Yilun Liu
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Stretchable Electronics ◽  
Buckling Mode ◽  
Design And Optimization ◽  
Out Of Plane ◽  
Plane Direction ◽  
Plane Displacement ◽  
Helical Buckling ◽  
Selection Of

In this work, the compressive buckling of a nanowire partially bonded to an elastomeric substrate is studied via finite-element method (FEM) simulations and experiments. The buckling profile of the nanowire can be divided into three regimes, i.e., the in-plane buckling, the disordered buckling in the out-of-plane direction, and the helical buckling, depending on the constraint density between the nanowire and the substrate. The selection of the buckling mode depends on the ratio d/h, where d is the distance between adjacent constraint points and h is the helical buckling spacing of a perfectly bonded nanowire. For d/h > 0.5, buckling is in-plane with wavelength λ = 2d. For 0.27 < d/h < 0.5, buckling is disordered with irregular out-of-plane displacement. While, for d/h < 0.27, buckling is helical and the buckling spacing gradually approaches to the theoretical value of a perfectly bonded nanowire. Generally, the in-plane buckling induces smaller strain in the nanowire, but consumes the largest space. Whereas the helical mode induces moderate strain in the nanowire, but takes the smallest space. The study may shed useful insights on the design and optimization of high-performance stretchable electronics and three-dimensional complex nanostructures.

Numerical and experimental investigation for enhancing the energy absorption capacity of the novel three-dimensional printed sandwich structures

2021 ◽  
pp. 146442072199749
Author(s):  
H Geramizadeh ◽  
S Dariushi ◽  
S Jedari Salami
Keyword(s):  
Energy Absorption ◽  
Sandwich Structures ◽  
Three Dimensional ◽  
Absorption Capacity ◽  
The Novel ◽  
Energy Absorption Capacity ◽  
Fused Deposition ◽  
Honeycomb Sandwich ◽  
Out Of Plane ◽  
Vertical Walls

The current study focuses on designing the optimal three-dimensional printed sandwich structures. The main goal is to improve the energy absorption capacity of the out-of-plane honeycomb sandwich beam. The novel Beta VI and Alpha VI were designed in order to achieve this aim. In the Beta VI, the connecting curves (splines) were used instead of the four diagonal walls, while the two vertical walls remained unchanged. The Alpha VI is a step forward on the Beta VI, which was promoted by filleting all angles among the vertical walls, created arcs, and face sheets. The two offered sandwich structures have not hitherto been provided in the literature. All models were designed and simulated by the CATIA and ABAQUS, respectively. The three-dimensional printer fabricated the samples by fused deposition modeling technique. The material properties were determined under tensile, compression, and three-point bending tests. The results are carried out by two methods based on experimental tests and finite element analyses that confirmed each other. The achievements provide novel insights into the determination of the adequate number of unit cells and demonstrate the energy absorption capacity of the Beta VI and Alpha VI are 23.7% and 53.9%, respectively, higher than the out-of-plane honeycomb sandwich structures.

scholarly journals In-Process Measurement of Three-Dimensional Deformations Based on Speckle Photography

2021 ◽  
Vol 11 (11) ◽  
pp. 4981
Author(s):  
Andreas Tausendfreund ◽  
Dirk Stöbener ◽  
Andreas Fischer
Keyword(s):  
Evaluation Method ◽  
Process Analysis ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Machining Process ◽  
Image Correlation ◽  
Speckle Photography ◽  
Process Measurement ◽  
Out Of Plane ◽  
Plane Deformations

In the concept of the process signature, the relationship between a material load and the modification remaining in the workpiece is used to better understand and optimize manufacturing processes. The basic prerequisite for this is to be able to measure the loads occurring during the machining process in the form of mechanical deformations. Speckle photography is suitable for this in-process measurement task and is already used in a variety of ways for in-plane deformation measurements. The shortcoming of this fast and robust measurement technique based on image correlation techniques is that out-of-plane deformations in the direction of the measurement system cannot be detected and increases the measurement error of in-plane deformations. In this paper, we investigate a method that infers local out-of-plane motions of the workpiece surface from the decorrelation of speckle patterns and is thus able to reconstruct three-dimensional deformation fields. The implementation of the evaluation method enables a fast reconstruction of 3D deformation fields, so that the in-process capability remains given. First measurements in a deep rolling process show that dynamic deformations underneath the die can be captured and demonstrate the suitability of the speckle method for manufacturing process analysis.

Influence of Interference and Clamping on Fretting Fatigue in Single Rivet-Row Lap Joints

2000 ◽  
Vol 123 (4) ◽  
pp. 686-698 ◽  
Author(s):  
K. Iyer ◽  
C. A. Rubin ◽  
G. T. Hahn
Keyword(s):  
Crack Initiation ◽  
Three Dimensional ◽  
Fretting Fatigue ◽  
Cyclic Stress ◽  
Lap Joints ◽  
Element Analysis ◽  
Out Of Plane ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Fretting Damage

Primary fretting fatigue variables such as contact pressure, slip amplitude and bulk cyclic stresses, at and near the contact interface between the rivet shank and panel hole in a single rivet-row, 7075-T6 aluminum alloy lap joint are presented. Three-dimensional finite element analysis is applied to evaluate these and the effects of interference and clamping stresses on the values of the primary variables and other overall measures of fretting damage. Two rivet geometries, non-countersunk and countersunk, are considered. Comparison with previous evaluations of the fretting conditions in similar but two-dimensional connections indicates that out-of-plane movements and attending effects can have a significant impact on the fatigue life of riveted connections. Variations of the cyclic stress range and other proponents of crack initiation are found to peak at distinct locations along the hole-shank interface, making it possible to predict crack initiation locations and design for extended life.

Stiffened Hangers: an Often Overlooked Tool for Conceptual Design of Tied-Arch Footbridges

2021 ◽  
Author(s):  
Juan José Jorquera-Lucerga ◽  
Juan Manuel GARCÍA-GUERRERO
Keyword(s):  
Low Cost ◽  
Three Dimensional ◽  
Structural Response ◽  
Bending Moments ◽  
Structural Element ◽  
Axial Forces ◽  
Limited Effectiveness ◽  
Out Of Plane ◽  
Arch Bridges ◽  
Fixed End

<p>In tied-arch bridges, the way the arch and the deck are connected may become crucial. The deck is usually suspended from hangers made out of steel pinned cables capable of resisting axial forces only. However, a proper structural response, (both in-plane and out-of-plane) may be ensured by fixing and stiffening the hangers in order to resist, additionally, shear forces and bending moments. This paper studies the effect of different pinned and stiffened hanger arrangements on the structural behavior of the tied-arch footbridges, with the intention of providing designers with useful tools at the early steps of design. As a major conclusion, regarding the in-plane behavior, hangers composed of cables (either with vertical, Nielsen-Löhse or network arrangements) are recommended due to its low cost and ease of erection. Alternatively, longitudinally stiffened hangers, fixed at both ends, can be used. Regarding the out-of-plane behavior, and in addition to three-dimensional arrangements of cables, of limited effectiveness, transversally stiffened hangers fixed at both ends are the most efficient arrangement. A configuration almost as efficient can be achieved by locating a hinge at the end corresponding to the most flexible structural element (normally the arch). Its efficiency is further improved if the cross-section tapers from the fixed end to the pinned end.</p>

scholarly journals Comparison of Induced Deflection and Forces in Piles Adjacent to Tunnelling and Deep Excavation in 2D and 3D Problems

2018 ◽  
Vol 203 ◽  
pp. 04011
Author(s):  
Ong Yin Hoe ◽  
Hisham Mohamad
Keyword(s):  
Bending Moment ◽  
Pile Group ◽  
3D Models ◽  
Deep Excavation ◽  
Pile Groups ◽  
Out Of Plane ◽  
National University ◽  
Plane Direction ◽  
2D And 3D ◽  
2D Model

There is a trend in Malaysia and Singapore, engineers tend to model the effect of TBM tunneling or deep excavation to the adjacent piles in 2D model. In the 2D model, the pile is modelled using embedded row pile element which is a 1-D element. The user is allowed to input the pile spacing in out-of-plane direction. This gives an impression to engineers the embedded pile row element is able to model the pile which virtually is a 3D problem. It is reported by Sluis (2014) that the application of embedded pile row element is limited to 8D of pile length. It is also reported that the 2D model overestimates the axial load in pile and the shear force and bending moment at pile top and it is not realistic in comparison to 3D model. In this paper, the centrifuge results of single pile and 6-pile group - tunneling problem carried out in NUS (National University of Singapore) are back-analysed with Midas GTS 3D and a 2D program. In a separate case study, pile groups adjacent to a deep excavation is modelled by 3D and 2D program. This paper compares the deflection and forces in piles in 2D and 3D models.

Validation of the Stress Predictions in Rolling EHL Contacts Having In-Line Roughness Using the Inverse Method

2006 ◽  
Vol 128 (4) ◽  
pp. 745-752 ◽  
Author(s):  
C. J. Hooke ◽  
K. Y. Li
Keyword(s):  
Fluid Flow ◽  
Inverse Method ◽  
Rough Surfaces ◽  
Three Dimensional ◽  
Plane Flow ◽  
Preliminary Results ◽  
Rolling Contacts ◽  
Out Of Plane ◽  
Transverse Roughness

Using modern EHL programs it is relatively simple to determine the pressures and clearances in rough EHL contacts. The pressures may then be used to calculate the subsurface stresses in the two contacting components. However, the results depend on the assumptions made about the fluid’s rheology. While it is possible to measure the clearances using interferometric techniques, measurement of either the pressures or stresses is extremely difficult. However it is these, rather than the clearances, that determine the life of the contact. In previous papers the authors have described how the inverse method may be used to validate the stress predictions for contacts with transverse roughness. This type of contact has fluid flow in only one plane and it remained necessary to check the results for more general rough surfaces where the flow is three-dimensional. Accordingly, the inverse method is extended, in this paper, to a situation where out-of-plane flow is significant. The paper describes the approach and presents some preliminary results for rolling contacts.

The Optimal Stretching Angle of Honeycomb Paper Core Based on the Fourth Strength Principle

2013 ◽  
Vol 288 ◽  
pp. 256-261 ◽  
Author(s):  
Jian Wu ◽  
Yong Long Wang ◽  
Yang Zhang ◽  
Gai Mei Zhang ◽  
Yan Ping Du
Keyword(s):  
Sampling Method ◽  
Stress Condition ◽  
Three Dimensional ◽  
Force Analysis ◽  
Honeycomb Core ◽  
Out Of Plane ◽  
Equivalent Load

The force analysis on the in-plane and out-of-plane of honeycomb core referring to some related articles is presented. during the transportation of wine, the honeycomb paper core is under three-dimensional stress. According to stress condition in the process of wine packaging and transportation, based on the fourth strength principle, the equivalent load is obtained. And the stress with different stretching angels with virtual sampling method is calculated. Thus, the optimal stretching angle of honeycomb paper is acquired, which is .

scholarly journals Epifluorescence-based three-dimensional traction force microscopy

2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Lauren Hazlett ◽  
Alexander K. Landauer ◽  
Mohak Patel ◽  
Hadley A. Witt ◽  
Jin Yang ◽  
...  
Keyword(s):  
Spatial Frequency ◽  
Open Source ◽  
Single Particle ◽  
Three Dimensional ◽  
Traction Force ◽  
High Spatial Frequency ◽  
Epifluorescence Microscopy ◽  
Traction Force Microscopy ◽  
Force Microscopy ◽  
Out Of Plane

Abstract We introduce a novel method to compute three-dimensional (3D) displacements and both in-plane and out-of-plane tractions on nominally planar transparent materials using standard epifluorescence microscopy. Despite the importance of out-of-plane components to fully understanding cell behavior, epifluorescence images are generally not used for 3D traction force microscopy (TFM) experiments due to limitations in spatial resolution and measuring out-of-plane motion. To extend an epifluorescence-based technique to 3D, we employ a topology-based single particle tracking algorithm to reconstruct high spatial-frequency 3D motion fields from densely seeded single-particle layer images. Using an open-source finite element (FE) based solver, we then compute the 3D full-field stress and strain and surface traction fields. We demonstrate this technique by measuring tractions generated by both single human neutrophils and multicellular monolayers of Madin–Darby canine kidney cells, highlighting its acuity in reconstructing both individual and collective cellular tractions. In summary, this represents a new, easily accessible method for calculating fully three-dimensional displacement and 3D surface tractions at high spatial frequency from epifluorescence images. We released and support the complete technique as a free and open-source code package.

Magnetic quantum oscillations in doped antiferromagnets

2017 ◽  
Vol 31 (25) ◽  
pp. 1745015
Author(s):  
V. V. Kabanov
Keyword(s):  
Magnetic Field ◽  
Polar Angle ◽  
Two Dimensional ◽  
Plane Angle ◽  
Arbitrary Direction ◽  
Magnetization Direction ◽  
Quantum Oscillations ◽  
Out Of Plane ◽  
Plane Direction ◽  
Magnetic Quantum Oscillations

Energy spectrum of electrons (holes) doped into two-dimensional (2D) antiferromagnetic (AF) semiconductors is quantized in an external magnetic field of arbitrary direction. A peculiar dependence of de Haas–van Alphen (dHvA) magneto-oscillation amplitudes on the azimuthal in-plane angle from the magnetization direction and on the polar angle from the out-of-plane direction is found. The angular dependence of the amplitude is different if the measurements are performed in the field above and below of the spin-flop field.

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