THE CONNECTION OF CONVERTERS INSTEAD OF SEMICONDUCTOR POWER DEVICES — A HIGH PERFORMANCE SOLUTION FOR THE MVA RANGE OF POWER COMVERTERS

1995 ◽  
Vol 05 (03) ◽  
pp. 503-521 ◽  
Author(s):  
LOURENCO MATAKAS ◽  
CATALIN BURLACU ◽  
EISUKE MASADA
Keyword(s):  
High Power ◽  
High Performance ◽  
Power Converters ◽  
State Of The Art ◽  
High Reliability ◽  
Motor Drives ◽  
Switching Frequency ◽  
Power Devices ◽  
Parallel Connection ◽  
Severe Limitation

Recently, there is an increased demand for high power, high performance converters for power system applications, motor drives, etc. The low switching frequency of the existing semiconductor power devices poses a severe limitation that can be overcome by the use of interconnected smaller power converters (multiconverter) with appropriate control. This paper gives an overview of the state of the art of multiconverters, followed by a comparison based on analytically calculated values of the spectra, RMS and peak values of their ripple currents, and the peak values of the transformer's flux. Special attention has been given to show that the transformerless parallel connection of converters is feasible and offers features such as simplicity, gracefully degrading operating, high reliability, easy expandability and easy maintenance.

Constant Switching Frequency and Torque Ripple Minimization of DTC of Induction Motor Drives with Three-level NPC Inverter

2017 ◽  
Vol 8 (3) ◽  
pp. 1035
Author(s):  
Huzainirah Ismail ◽  
Fazlli Patkar ◽  
Auzani Jidin ◽  
Aiman Zakwan Jidin ◽  
Noor Azida Noor Azlan ◽  
...  
Keyword(s):  
Induction Motor ◽  
High Performance ◽  
Direct Torque Control ◽  
Torque Ripple ◽  
Motor Drives ◽  
Torque Control ◽  
Switching Frequency ◽  
Ac Motor ◽  
Hysteresis Controller ◽  
Selection Of

<p>Direct Torque Control (DTC) is widely applied for ac motor drives as it offers high performance torque control with a simple control strategy. However, conventional DTC poses some disadvantages especially in term of variable switching frequency and large torque ripple due to the utilization of torque hysteresis controller. Other than that, performance of conventional DTC fed by two-level inverter is also restricted by the limited numbers of voltage vectors which lead to inappropriate selection of voltage vectors for different speed operations. This research aims to propose a Constant Switching Frequency (CSF) torque controller for DTC of induction motor (IM) fed by three-level Neutral-Point Clamped (NPC) inverter. The proposed torque controller utilizes PI controller which apply different gain for different speed operation. Besides, the utilization of NPC inverter provides greater number of voltage vectors which allow appropriate selection of voltage vectors for different operating condition. Using the proposed method, the improvement of DTC drives in term of producing a constant switching operation and minimizing torque ripple are achieved and validated via experimental results.</p>

Review and comparison of high efficiency high power boost DC/DC converters for photovoltaic applications

2011 ◽  
Vol 59 (4) ◽  
pp. 499-506 ◽  
Author(s):  
J. Dawidziuk
Keyword(s):  
High Power ◽  
High Efficiency ◽  
State Of The Art ◽  
Environmental Issues ◽  
Switching Frequency ◽  
Power Losses ◽  
Renewable Energy Systems ◽  
Boost Converters ◽  
Power Mosfets ◽  
Photovoltaic Applications

Review and comparison of high efficiency high power boost DC/DC converters for photovoltaic applicationsRecent environmental issues have accelerated the use of more efficient and energy saving technologies in renewable energy systems. High power high efficiency boost DC/DC converters for the use in photovoltaic, fuel cell systems are discussed in this paper from the viewpoint of power losses and efficiency. State of the art converters with switching frequency within the range of 25 kHz with IGBTs to 100 kHz with power MOSFETs and the highest efficiency close to 98%, depending on the load conditions, is considered. A comparison and discussion of the highest efficiency high power DC/DC boost converters is also presented in this paper.

scholarly journals Comparative Review of Brushless PMAC and PMDC Motor Drives

2020 ◽  
Author(s):  
Rajesh Pindoriya
Keyword(s):  
Permanent Magnet ◽  
Permanent Magnets ◽  
High Efficiency ◽  
State Of The Art ◽  
High Reliability ◽  
Motor Drives ◽  
Compact Size ◽  
Comparative Review ◽  
Depth Analysis ◽  
Alternative Current

<div>This paper presents a state of the art on brushless </div><div>Permanent Magnet Alternative Current (PMAC) and </div><div>Permanent Magnet Direct Current (PMDC) motor drives. The </div><div>brushless PMAC and PMDC motor drives are the latest choices </div><div>of researchers due to their high efficiency, silent operation, </div><div>compact size, high reliability, and low maintenance </div><div>requirements. These motors are preferred for numerous </div><div>applications. An in-depth analysis of PMAC and PMDC motor </div><div>drives have been discussed. The Permanent Magnets (PMs)</div><div>motor drives can be classified into two categories, first is PMAC </div><div>motor drives, i.e. PMSM and the second one is PMDC motor</div><div>drives, i.e. BLDC motors. There has been a long </div><div>misunderstanding between the two ways of driving and </div><div>controlling a motor with no windings on the rotor but only </div><div>PMs. In this paper given a comprehensive analysis of both </div><div>motor drives. So, beginner of the research scholars are easily </div><div>able to understand about brushless PMAC and PMDC motor </div><div>drives.</div>

The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000065-000072 ◽  
Author(s):  
Sayan Seal ◽  
Michael D. Glover ◽  
H. Alan Mantooth
Keyword(s):  
High Performance ◽  
High Reliability ◽  
Feasibility Studies ◽  
Wide Band ◽  
Power Devices ◽  
Power Module ◽  
Wide Band Gap ◽  
Fast Switching ◽  
Power Modules ◽  
Wide Band Gap Semiconductors

Abstract This paper presents the plan and initial feasibility studies for an Integrated Wire Bondless Power Module (IWPM). Contemporary power modules are moving toward unprecedented levels of power density. The ball has been set rolling by a drastic reduction in the size of bare die power devices themselves owing to the advent of wide band gap semiconductors like silicon carbide (SiC) and gallium nitride (GaN). SiC has capabilities of operating at much higher temperatures and faster switching speeds as compared with its silicon counterparts, while being a fraction of their size. However, electronic packaging technology has not kept pace with these developments. High performance packaging technologies do exist in isolation, but there has been limited success in integrating these disparate efforts into a single high performance package of sufficient reliability. This paper lays the foundation for an electronic package which is designed to completely leverage the benefits of SiC semiconductor technology, with a focus on high reliability and fast switching capability.

Low Temperature, Fast Sintering of Micro-Scale Silver Paste for Die Attach for 300°C Applications

2015 ◽  
Vol 2015 (1) ◽  
pp. 000654-000660 ◽  
Author(s):  
Fang Yu ◽  
R. Wayne Johnson ◽  
Michael C. Hamilton
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
High Performance ◽  
High Reliability ◽  
Sintering Process ◽  
Power Devices ◽  
C Storage ◽  
Die Attach ◽  
Increasing Demand ◽  
High Lead

With an increasing demand for SiC and GaN high power devices that operate at high temperature, traditional solder materials are reaching their limitations in performance. In addition, there is a strong desire to eliminate high lead containing solders in Si power device packaging for use over conventional temperature range. Low temperature Ag sintering technology is a promising method for high performance lead-free die attachment. In a previous study, a pressureless sintering process and suitable metallization were demonstrated to provide high reliability die attach by using micro-size Ag sintering. The resulting die attach layer had approximately 30% porosity. In this work, a low temperature pressure-assisted fast sintering process was examined. The porosity was decreased from 30% to 15% with application of a low pressure (7.6MPa) during a one minute sintering process. The shear strength for a 3 mm × 3 mm die was 70 MPa and the 8 mm × 8 mm die could not be sheared off due to a 100 kg shear module force limit. Both the Ag and Au metallization (die and substrate) were studied. Furthermore, a new substrate metallization combination was found that allows the use of Au thick film metallized substrates. High temperature (300 °C) storage tests for up to 2000 hours aging were conducted and results are presented.

Voiding Control at Preform Soldering

2016 ◽  
Vol 2016 (1) ◽  
pp. 000630-000637
Author(s):  
Arnab Dasgupta ◽  
Elaina Zito ◽  
Ning-Cheng Lee
Keyword(s):  
High Power ◽  
High Performance ◽  
High Reliability ◽  
Solder Paste ◽  
Reflow Soldering ◽  
High Brightness ◽  
Die Attach ◽  
Alloy Type ◽  
Reflow Temperature ◽  
Bondline Thickness

Abstract Assembly of components with large pads such as high brightness LEDs or high power dies often is soldered with preform, mainly due to a lower voiding and lower flux fume generated when compared with solder paste, and also because of its better thermal and electrical conductivity compared with Ag epoxy. This is particularly true when the joints are to be formed within a cavity. Although lower than solder paste, the voiding in the solder joint is still a concern for high reliability and high performance devices. In this study, voiding at high power die attach reflow soldering using preform was simulated with the use of Cu coupons to mimic both die and substrate. The voiding behavior was studied by varying solder alloy type, flux quantity coated on preform, oxidation extent of Cu coupon, reflow peak temperature, and weight applied on the top of simulated die. For SAC305, with increasing weight, the bondline thickness (BLT) maintained constant initially due to solder surface tension, then reduced rapidly at weight higher than 50 g. The voiding area % increased with decreasing BLT first, then levelled off at lower BLT, although the voiding volume decreased with decreasing BLT due to constrained lamellar solder flow. Voiding was the highest for SAC305, followed by 57Bi42Sn1Ag, with 63Sn37Pb being the lowest, and increased with increasing oxidation of Cu coupon. With increasing flux quantity, voiding increased for SAC305 and 63Sn37Pb, but decreased for 57Bi42Sn1Ag, mainly due to the different temperature range at reflow. Voiding increased with increasing reflow temperature up to 170°C due to increasing vaporization, decreased with further increase in reflow temperature up to 210°C due to increasing flux activity, and increased again at temperature beyond 210°C due to rapid flux outgassing.

The Design and Evaluation of an Integrated Wire Bond-less Power Module using a Low Temperature Co-fired Ceramic Interposer

2016 ◽  
Vol 13 (4) ◽  
pp. 169-175
Author(s):  
Sayan Seal ◽  
Michael D. Glover ◽  
H. Alan Mantooth
Keyword(s):  
Low Temperature ◽  
High Performance ◽  
High Reliability ◽  
Feasibility Studies ◽  
Power Devices ◽  
Power Module ◽  
Fast Switching ◽  
Wire Bond ◽  
Power Modules ◽  
Bandgap Semiconductors

This article presents the plan and initial feasibility studies for an Integrated Wire Bond-less Power Module. Contemporary power modules are moving toward unprecedented levels of power density. The ball has been set rolling by a drastic reduction in the size of bare die power devices owing to the advent of wide bandgap semiconductors such as silicon carbide (SiC) and gallium nitride. SiC has capabilities of operating at much higher temperatures and faster switching speeds compared with its silicon counterparts, while being a fraction of their size. However, electronic packaging technology has not kept pace with these developments. High-performance packaging technologies do exist in isolation, but there has been limited success in integrating these disparate efforts into a single high-performance package of sufficient reliability. This article lays the foundation for an electronic package designed to completely leverage the benefits of SiC semiconductor technology, with a focus on high reliability and fast switching capability. The interconnections between the gate drive circuitry and the power devices were implemented using a low temperature cofired ceramic interposer.

Sign in / Sign up

Export Citation Format

Share Document