High Temperature Processable Flexible Polymer Films

2016 ◽  
Vol 16 (03) ◽  
pp. 1650038
Author(s):  
D. Shanmuga Sundar ◽  
A. Sivanantha Raja ◽  
C. Sanjeeviraja ◽  
D. Jeyakumar
Keyword(s):  
Flexible Electronics ◽  
Flexible Substrate ◽  
Electronic Devices ◽  
Visible Region ◽  
Thermal Characteristics ◽  
Index Formula ◽  
Flexible Substrates ◽  
Transparent Substrate ◽  
Flexible Polymer ◽  
Recent Developments

Recent developments in the field of flexible electronics motivated the researchers to start working in verdict of new flexible substrate for replacing the existing rigid glass and flexible plastics. Flexible substrates offer significant rewards in terms of being able to fabricate flexible electronic devices that are robust, thinner, conformable, lighter and can be rolled away when needed. In this work, a new flexible and transparent substrate with the help of organic materials such as Polydimethylsiloxane (PDMS) and tetra ethoxy orthosilicate (TEOS) is synthesized. Transmittance of about 90–95% is acquired in the visible region (400–700[Formula: see text]nm) and the synthesized substrate shows better thermal characteristics and withstands temperature up to 200[Formula: see text]C without any significant degradation. Characteristics such as transmittance ([Formula: see text]), absorption ([Formula: see text]), reflectance ([Formula: see text]), refractive index ([Formula: see text]) and extinction coefficient ([Formula: see text]) are also reported.

scholarly journals High performance p-channel transistors on flexible substrate using direct roll transfer stamping

2021 ◽  
Author(s):  
Ayoub Abdulhafith Sadek Zumeit ◽  
Abhishek S Dahiya ◽  
Adamos Christou ◽  
Ravinder Dahiya
Keyword(s):  
High Performance ◽  
Room Temperature ◽  
Field Effect Transistors ◽  
Flexible Substrate ◽  
Electronic Devices ◽  
Silicon On Insulator ◽  
Flexible Substrates ◽  
Device Performance ◽  
Mechanical Bending ◽  
P Type

Abstract lexible electronics with high-performance devices is crucial for transformative advances in several emerging and traditional applications. To address this need, herein we present p-type silicon (Si) nanoribbons (NR)-based high-performance field-effect transistors (FETs) developed using innovative Direct Roll Transfer Stamping (DRTS) process. First, ultrathin Si NRs (~70 nm) are obtained from silicon on insulator (SOI) wafers using conventional top-down method, and then DRTS method is employed to directly place the NRs onto flexible substrates at room temperature (RT). The NRFETs are then developed following RT fabrication process which include deposition of high-quality SiNx dielectric. The fabricated p-channel transistors demonstrate high linear mobility ~100±10 cm2/Vs, current on/off ratio >10^4, and low gate leakage (<1nA). Further, the transistors showed robust device performance under mechanical bending and at wide temperature range (15 to 90 °C), showing excellent potential for futuristic high-performance flexible electronic devices/circuits.

Subtractive Laser Processing of Low Temperature Inkjet Printed Micro Electric Components of Functional Nano-Ink for Flexible Electronics

2005 ◽  
Author(s):  
Seung Hwan Ko ◽  
Jaewon Chung ◽  
Yeonho Choi ◽  
David J. Hwang ◽  
Costas P. Grigoropoulos ◽  
...  
Keyword(s):  
Low Temperature ◽  
Melting Temperature ◽  
Flexible Electronics ◽  
Flexible Substrate ◽  
Nano Particles ◽  
Additive Process ◽  
Drop On Demand ◽  
Flexible Polymer ◽  
Electrical Components ◽  
First Time

The low temperature fabrication of electrical components on flexible substrate is presented in this paper. As an additive process, combined with a CAD tool, a drop-on-demand (DOD) inkjetting system was used to print electrical components from gold nano-particles suspended in Alpha-Terpineol solution on flexible polymer substrates. In a subtractive process, Nd:YAG pulsed laser was irradiated to produce finer electrical components. Continuous Ar laser was irradiated locally to evaporate carrier solution as well as to sinter gold nanoparticles. It is demonstrated for the first time, that the melting temperature depression of gold nanoink, combined with local laser heating and ablation can be used to fabricate micro electric components on low melting temperature polymer substrate to realize flexible electronics.

Fabricating Microchannels in Elastomer Substrates for Stretchable Electronics

2016 ◽  
Author(s):  
Michelle C. Yuen ◽  
Rebecca K. Kramer
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Stretchable Electronics ◽  
Flexible Substrates ◽  
Soft Sensors ◽  
Elastic Substrate ◽  
Conductive Fluid ◽  
Manufacturing Method ◽  
Flexible Devices ◽  
Soft Electronics

As flexible devices and machines become more ubiquitous, there is a growing need for similarly deformable electronics. Soft polymers continue to be widely used as stretchable and flexible substrates for soft electronics, and in particular, soft sensing. These soft sensors generally consist of a highly elastic substrate with embedded microchannels filled with a conductive fluid. Deforming the substrate deforms the embedded microchannels and induces a change in the electrical resistance through the conductive fluid. Microchannels, thus, are the foundation of flexible electronic devices and sensors. These microchannels have been fabricated using various methods, where the manufacturing method greatly impacts device functionality. In this paper, comparisons are made between the following methods of microchannel manufacturing: cast molding, 3D printing of the elastomer substrate itself, and laser ablation. Further processing of the microchannels into flexible electronics is also presented for all three methods. Lastly, recommended ranges of microchannel sizes and their associated reproducibility and accuracy measures for each manufacturing method are presented.

scholarly journals Reliability-Aware SPICE Compatible Compact Modeling of IGZO Inverters on a Flexible Substrate

2021 ◽  
Vol 11 (11) ◽  
pp. 4838
Author(s):  
Je-Hyuk Kim ◽  
Youngjin Seo ◽  
Jun Tae Jang ◽  
Shinyoung Park ◽  
Dongyeon Kang ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Circuit Simulation ◽  
Flexible Substrate ◽  
Atomic Layer ◽  
Operating Conditions ◽  
Gate Insulator ◽  
Compact Modeling ◽  
Indium Gallium Zinc Oxide ◽  
Electrical Stress ◽  
Bending Radius

Accurate circuit simulation reflecting physical and electrical stress is of importance in indium gallium zinc oxide (IGZO)-based flexible electronics. In particular, appropriate modeling of threshold voltage (VT) changes in different bias and bending conditions is required for reliability-aware simulation in both device and circuit levels. Here, we present SPICE compatible compact modeling of IGZO transistors and inverters having an atomic layer deposition (ALD) Al2O3 gate insulator on a polyethylene terephthalate (PET) substrate. Specifically, the modeling was performed to predict the behavior of the circuit using stretched exponential function (SEF) in a bending radius of 10 mm and operating voltages ranging between 4 and 8 V. The simulation results of the IGZO circuits matched well with the measured values in various operating conditions. It is expected that the proposed method can be applied to process improvement or circuit design by predicting the direct current (DC) and alternating current (AC) responses of flexible IGZO circuits.

scholarly journals Sheet Resistance Measurements of Conductive Thin Films: A Comparison of Techniques

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 960
Author(s):  
Mira Naftaly ◽  
Satyajit Das ◽  
John Gallop ◽  
Kewen Pan ◽  
Feras Alkhalil ◽  
...  
Keyword(s):  
Thin Films ◽  
Sheet Resistance ◽  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductivity Measurements ◽  
Terahertz Time Domain Spectroscopy ◽  
Comparison Of Techniques ◽  
Terahertz Frequencies ◽  
Conductive Thin Films ◽  
Multiple Samples

Conductive thin films are an essential component of many electronic devices. Measuring their conductivity accurately is necessary for quality control and process monitoring. We compare conductivity measurements on films for flexible electronics using three different techniques: four-point probe, microwave resonator and terahertz time-domain spectroscopy. Multiple samples were examined, facilitating the comparison of the three techniques. Sheet resistance values at DC, microwave and terahertz frequencies were obtained and were found to be in close agreement.

A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices

2021 ◽  
pp. 1-1
Author(s):  
Cong Hiep Hoang ◽  
Srikanth Rangarajan ◽  
Yaman Manaserh ◽  
Mohammad Tradat ◽  
Ghazal Mohsenian ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Two Phase ◽  
Recent Developments ◽  
Two Phase Cooling

ZnSxO1-x Films Grown on Flexible Substrates

2012 ◽  
Vol 1394 ◽  
Author(s):  
Jesse Huso ◽  
Hui Che ◽  
John L. Morrison ◽  
Dinesh Thapa ◽  
Michelle Huso ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Flexible Substrates ◽  
Semiconductor Films ◽  
Ethylene Propylene ◽  
Transmission Spectroscopy ◽  
Fluorinated Ethylene Propylene ◽  
Potential Substrate

ABSTRACTBandgap engineered ZnSxO1-x films were grown on Fluorinated Ethylene Propylene (FEP) substrates and analyzed using transmission spectroscopy. FEP is considered as a potential substrate for application in flexible electronics and semiconductor films.

scholarly journals A Review: Electrospinning and Electrospinning Nanofibre Technology, Process & Application

2020 ◽  
Vol 5 (6) ◽  
pp. 528-538
Author(s):  
Somesh S. Bhagure ◽  
Dr. Adarsh R. Rao
Keyword(s):  
Electronic Devices ◽  
Early History ◽  
Comprehensive Overview ◽  
Thin Fiber ◽  
Filtration Membranes ◽  
Technology Process ◽  
Recent Developments ◽  
History Of ◽  
Catalytic Supports ◽  
Remarkable Progress

Electrospinning is a versatile and viable technique for ultra-thin fiber generation. Remarkable progress has been made with regard to the development of Electrospinning methods and the engineering of Electrospinning Nanofibre to suit or enable different applications. We aim to provide a comprehensive overview of Electrospinning, including principles, methods, materials and applications. We begin with a brief introduction to the early history of Electrospinning, followed by a discussion of its principle and its typical apparatus. Subsequently, we discuss the applications of electrospun Nanofibre, including their use as smart mattresses, filtration membranes, catalytic supports, energy harvesting / conversion / storage components, and photonic and electronic devices, as well as biomedical scaffolds. We highlight the most relevant and recent developments in the application of electrospun Nanofibre by focusing on the most representative examples.

scholarly journals Direct Ink Writing of Materials for Electronics-Related Applications: A Mini Review

2021 ◽  
Vol 8 ◽  
Author(s):  
Zhenzhong Hou ◽  
Hai Lu ◽  
Ying Li ◽  
Laixia Yang ◽  
Yang Gao
Keyword(s):  
Human Life ◽  
Electronic Devices ◽  
Electronic Components ◽  
Direct Ink Writing ◽  
Recent Developments ◽  
Print Materials ◽  
On Chip ◽  
Functional Components ◽  
Printing Techniques

Recently, the fabrication of electronics-related components via direct ink writing (DIW) has attracted much attention. Compared to the conventionally fabricated electronic components, DIW-printed ones have more complicated structures, higher accuracy, improved efficiency, and even enhanced performances that arise from well-designed architectures. The DIW technology allows directly print materials on a variety of flat substrates, even a conformal one, well suiting them to applications such as wearable devices and on-chip integrations. Here, recent developments in DIW printing of emerging components for electronics-related applications are briefly reviewed, including electrodes, electronic circuits, and functional components. The printing techniques, processes, ink materials, advantages, and properties of DIW-printed architectures are discussed. Finally, the challenges and outlooks on the manufacture of 3D structured electronic devices by DIW are outlined, pointing out future designs and developments of DIW technology for electronics-related applications. The combination of DIW and electronic devices will help to improve the quality of human life and promote the development of science and society.

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