Metal Wert Etch Process Development For Dual Metal Gate CMOS Using Standard Industry Tools

2005 ◽  
Vol 8 (12) ◽  
pp. G333 ◽  
Author(s):  
Muhammad Mustafa Hussain ◽  
Naim Moumen ◽  
Joel Barnett ◽  
Jason Saulters ◽  
David Baker ◽  
...  

2021 ◽  
pp. 421-429
Author(s):  
Achinta Baidya ◽  
Rajesh Saha ◽  
Amarnath Gaini ◽  
Chaitali Koley ◽  
Somen Debnath ◽  
...  

2020 ◽  
Vol 19 (3) ◽  
pp. 1085-1099
Author(s):  
Prateek Kishor Verma ◽  
Yogesh Kumar Verma ◽  
Varun Mishra ◽  
Santosh Kumar Gupta

2004 ◽  
Vol 462-463 ◽  
pp. 15-18 ◽  
Author(s):  
Chang Seo Park ◽  
Byung Jin Cho ◽  
N. Balasubramanian ◽  
Dim-Lee Kwong

2002 ◽  
Vol 81 (22) ◽  
pp. 4192-4194 ◽  
Author(s):  
Tae-Ho Cha ◽  
Dae-Gyu Park ◽  
Tae-Kyun Kim ◽  
Se-Aug Jang ◽  
In-Seok Yeo ◽  
...  

2015 ◽  
Vol 62 (1) ◽  
pp. 44-51 ◽  
Author(s):  
Giovanni Betti Beneventi ◽  
Elena Gnani ◽  
Antonio Gnudi ◽  
Susanna Reggiani ◽  
Giorgio Baccarani

2020 ◽  
Vol 20 (23) ◽  
pp. 13969-13975 ◽  
Author(s):  
Mahalaxmi ◽  
Bibhudendra Acharya ◽  
Guru Prasad Mishra

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 282 ◽  
Author(s):  
Liang Dai ◽  
Weifeng Lü ◽  
Mi Lin

We investigate the effect of random dopant fluctuation (RDF)-induced variability in n-type junctionless (JL) dual-metal gate (DMG) fin field-effect transistors (FinFETs) using a 3D computer-aided design simulation. We show that the drain voltage (VDS) has a significant impact on the electrostatic integrity variability caused by RDF and is dependent on the ratio of gate lengths. The RDF-induced variability also increases as the length of control gate near the source decreases. Our simulations suggest that the proportion of the gate metal near the source to the entire gate should be greater than 0.5.


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