scholarly journals Research and Development in the Field of Passive Components

1974 ◽  
Vol 1 (1) ◽  
pp. 3-9
Author(s):  
D. S. Campbell
Keyword(s):  
Research And Development ◽  
Electronics Industry ◽  
Passive Component ◽  
Passive Components ◽  
Market Situation ◽  
Component Field ◽  
Total Position

This paper firstly examines the market situation in passive components in relation to the total position of the electronics industry. Expenditure on research and development is then discussed and examples given of recent and present research and development activities in the field of passive components. The situation with regard to the publication position on research and development in passive components is briefly considered and it is concluded that there is a positive need for a journal covering the passive component field and acting as an outlet for papers generated in this area.

Degradation Susceptibility Metrics as the Bases for Bayesian Reliability Models of Aging Passive Components and Long-Term Reactor Risk

2011 ◽  
Author(s):  
Stephen D. Unwin ◽  
Peter P. Lowry ◽  
Michael Y. Toyooka ◽  
Benjamin E. Ford
Keyword(s):  
Passive Component ◽  
Degradation Mechanisms ◽  
Component Reliability ◽  
Passive Components ◽  
Reliability Models ◽  
Age Dependent ◽  
Probabilistic Risk Assessments ◽  
Component Failure Rates ◽  
Service Data

Conventional probabilistic risk assessments (PRAs) are not well-suited to addressing long-term reactor operations. Since passive structures, systems and components are among those for which refurbishment or replacement can be least practical, they might be expected to contribute increasingly to risk in an aging plant. Yet, passives receive limited treatment in PRAs. Furthermore, PRAs produce only snapshots of risk based on the assumption of time-independent component failure rates. This assumption is unlikely to be valid in aging systems. The treatment of aging passive components in PRA does present challenges. First, service data required to quantify component reliability models are sparse, and this problem is exacerbated by the greater data demands of age-dependent reliability models. A compounding factor is that there can be numerous potential degradation mechanisms associated with the materials, design, and operating environment of a given component. This deepens the data problem since the risk-informed management of materials degradation and component aging will demand an understanding of the long-term risk significance of individual degradation mechanisms. In this paper we describe a Bayesian methodology that integrates the metrics of materials degradation susceptibility being developed under the Nuclear Regulatory Commission’s Proactive Materials Degradation Assessment Program with available plant service data to estimate age-dependent passive component reliabilities. Integration of these models into conventional PRA will provide a basis for materials degradation management informed by the predicted long-term operational risk.

scholarly journals High Temperature Silicon Integrated Circuits and Passive Components for Commercial and Military Applications

1998 ◽  
Author(s):  
Richard R. Grzybowski ◽  
Ben Gingrich
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Elevated Temperatures ◽  
Silicon On Insulator ◽  
Passive Component ◽  
Oil Well ◽  
Automotive Electronics ◽  
Passive Components ◽  
Silicon Integrated Circuits

Advances in silicon-on-insulator (SOI) integrated circuit technology and the steady development of wider band gap semiconductors like silicon carbide are enabling the practical deployment of high temperature electronics. High temperature civilian and military electronics applications include distributed controls for aircraft, automotive electronics, electric vehicles and instrumentation for geothermal wells, oil well logging and nuclear reactors. While integrated circuits are key to the realization of complete high temperature electronic systems, passive components including resistors, capacitors, magnetics and crystals are also required. This paper will present characterization data obtained from a number of silicon high temperature integrated evaluated over a range of elevated temperatures and aged at a selected high temperature. This paper will also present a representative cross section of high temperature passive component characterization data for device types needed by many applications. Device types represented will include both small signal and power resistors and capacitors. Specific problems encountered with the employment of these devices in harsh environments will be discussed for each family of components. The goal in presenting this information is to demonstrate the viability of a significant number of commercially available silicon integrated circuits and passive components that operate at elevated temperatures as well as to encourage component suppliers to continue to optimize a selection of their product offerings for operation at higher temperatures. In addition, systems designers will be encouraged to view this information with an eye toward the conception and implementation of reliable and affordable high temperature systems.

scholarly journals Voltage-Mode All-Pass Filters Including Minimum Component Count Circuits

2007 ◽  
Vol 2007 ◽  
pp. 1-5 ◽  
Author(s):  
Sudhanshu Maheshwari
Keyword(s):  
Active Element ◽  
Passive Component ◽  
Output Impedance ◽  
Passive Components ◽  
First Order ◽  
Voltage Mode ◽  
Pspice Simulation ◽  
Simulation Results ◽  
A Current

This paper presents two new first-order voltage-mode all-pass filters using a single-current differencing buffered amplifier and four passive components. Each circuit is compatible to a current-controlled current differencing buffered amplifier with only two passive elements, thus resulting in two more circuits, which employ a capacitor, a resistor, and an active element, thus using a minimum of active and passive component counts. The proposed circuits possess low output impedance, and hence can be easily cascaded for voltage-mode systems. PSPICE simulation results are given to confirm the theory.

scholarly journals Grounded Impedance Simulator Topologies Employing Minimum Passive Elements

2018 ◽  
Vol 7 (2.28) ◽  
pp. 1 ◽  
Author(s):  
Mohammad Faseehuddin ◽  
Jahariah Sampe ◽  
Sawal Hamid Md Ali
Keyword(s):  
Current Mode ◽  
Cmos Technology ◽  
Passive Component ◽  
Passive Components ◽  
Theoretical Predictions ◽  
Low Pass ◽  
Multifunction Filter ◽  
Component Matching ◽  
Order Butterworth Filter ◽  
Matching Constraints

In this research three new grounded inductance simulators (GIS) are proposed. In addition, frequency dependent negative resistor (FDNR) and grounded capacitor (GC) simulators are also developed. The voltage differencing current conveyor (VDCC) is utilized in the design. All the developed simulator circuits need a single active block and only two grounded passive components. All the designed simulator circuits are perfectly tunable and did not suffer from passive component matching constraints. To demonstrate the performance of the inductor, FDNR and GC circuits they are employed in designing  current mode parallel RLC multifunction filter, low pass third order Butterworth filter and RLC resonance circuits. The VDCC is designed in 0.18μm CMOS technology parameters from TSMC and simulated in P-Spice software to prove the theoretical predictions. 

Passive device embedded substrate for application of RF module

Circuit World ◽  
2016 ◽  
Vol 42 (2) ◽  
pp. 84-88 ◽  
Author(s):  
Hyunho Kim
Keyword(s):  
Impedance Measurement ◽  
Test Methods ◽  
Organic Substrate ◽  
Passive Component ◽  
Electrical Characteristics ◽  
Circuit Testing ◽  
Passive Components ◽  
Content Type ◽  
Passive Device ◽  
Low Profile

Purpose The purpose of this study is to form fabrication and electrical characteristics of passive device embedded substrate that is embedded chip bead inductor and chip capacitor inside substrate for the application of radio frequency (RF) modules. Design/methodology/approach Passive device embedded substrate was fabricated using embedding process that consists of lamination process, laser drilling at the electrode Cu pads of passive components, electro-less Cu plating formation process such as photolithography, electrolytic Cu plating and etching. Impedance and capacitance characteristics of the fabricated passive device embedded substrate were evaluated. Findings By checking what embedded components are placed in the appropriate place using failure analysis via connection performance between copper plane and embedded components was verified. For measuring electrical characteristics of the fabricated passive device embedded substrate, the evaluation was done using test methods like continuity test for checking interconnections which are not connected to any embedded components and in-circuit test for checking interconnections which are connected to any embedded component. From in-circuit testing for embedding passive components with series and parallel circuits, the authors verified how to test passive device embedded substrate by using capacitance and impedance measurement with the comparison of measured results between good samples and bad samples. Originality/value Ultra miniaturized and low-profile mobile products are driving the need for embedded passive component integration technologies using a novel manufacturing-compatible organic substrate and interconnect technologies. Fabrication and test methods for passive device embedded substrate described in this paper are expected to lead to be developed to make quality measurable for the application of RF modules.

scholarly journals Discussion on the research and development demand and market benefit of intelligent disability nursing equipment — Analysis from the perspective of welfare pluralism

2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Rui Xing
Keyword(s):  
Quality Of Life ◽  
Research And Development ◽  
The State ◽  
Market Demand ◽  
Welfare Policies ◽  
Market Situation ◽  
The Disabled ◽  
Welfare Pluralism ◽  
At Home

In order to better serve the disabled, the state strongly supports the research and development and production of intelligent nursing equipment, thus ensuring and improving the quality of life and the sense of happiness of the disabled. This paper analyzes the current market situation of disabled nursing equipment and nursing products at home and abroad. Combined with the national pension and welfare policies, the paper analyzes the current market demand, market benefit and investment risks of intelligent disabled nursing equipment from the perspective of welfare pluralism, aiming at the development demand of intelligent disabled nursing equipment. This paper provides research and development suggestions and countermeasures for intelligent disability nursing equipment of Anhui Liwei Precision Machinery Co., Ltd.

GENERATION OF OSCILLATORS BASED ON GROUNDED CAPACITOR CURRENT CONVEYORS WITH MINIMUM PASSIVE COMPONENTS

2009 ◽  
Vol 18 (05) ◽  
pp. 857-873 ◽  
Author(s):  
AHMED M. SOLIMAN
Keyword(s):  
Negative Resistance ◽  
Passive Component ◽  
Current Conveyors ◽  
Spice Simulation ◽  
Feature Size ◽  
Passive Components ◽  
The Family ◽  
Simulation Results ◽  
Inverting Current Conveyors ◽  
Oscillator Circuits

In this paper, eight new Frequency Dependent Negative Resistance (FDNR) circuits using two current conveyors or inverting current conveyors or a combination of the two types are introduced. The proposed circuits are canonic and they use two grounded capacitors and one floating resistor. The generation of grounded capacitor minimum passive component oscillators from the FDNR circuits is also considered. It is found that two of the recently reported attractive oscillators are among the family of the generated oscillator circuits. Additional six new oscillator circuits based on the FDNR circuits are introduced in this paper. Spice simulation results using technology: SCN 05 feature size 0.5 μm, MOSIS Vendor: AGILENT to demonstrate the practicality of the proposed oscillators are included.

scholarly journals Novel VDBA based universal filter topologies with minimum passive components

2021 ◽  
Vol 9 (3B) ◽  
Author(s):  
Musa Ali Albrni ◽  
◽  
Mohammad Faseehuddin ◽  
Jahariah Sampe ◽  
Sawal Hamid Md Ali ◽  
...  
Keyword(s):  
Process Variations ◽  
Matching Condition ◽  
Passive Component ◽  
Passive Components ◽  
Parasitic Extraction ◽  
Single Output ◽  
Mode Of Operation ◽  
Theoretical Predictions ◽  
Minimum Number ◽  
Component Matching

In this research, voltage differencing buffered amplifier (VDBA) is utilized in designing three novel multi-input single output (MISO) topologies of universal filters. The designed filters employ minimum number of passive components and did not require any passive component matching condition. Two of the designed filters can work in dual mode of operation simultaneously. The designed filters have inbuilt tunability property. The nonideal gain analysis and sensitivity analysis of the filters are also carried out to study the effect of process variations and process spread on the filter responses. The complete layout of the VDBA is designed using 0.18μm Silterra Malaysia process design kit (PDK) in Cadence design software. The parasitic extraction is done using Mentor graphics Calibre tool. The postlayout simulations bear close resemblance with the theoretical predictions.

The Third Royal Society Technology Lecture: Research and development leading to viable production- some examples from the electronics industry

1969 ◽  
Vol 308 (1494) ◽  
pp. 291-303 ◽  
Keyword(s):  
Research And Development ◽  
Science And Technology ◽  
Well Being ◽  
Electronics Industry ◽  
Advisory Council ◽  
Scientific Policy ◽  
Considerable Time ◽  
Science And Engineering ◽  
The Third ◽  
The Difference

On 23 April-St George’s Day-I had the great privilege of giving the Society’s Third Technology Lecture. These Technology Lectures were intended to bring out the interplay between science and technology, but may I say straight away that although I had no worries about science I have never been very happy about the exact meaning of technology-a word that has crept very much into our vocabulary over recent years to the extent that we now even have a Ministry of that name. What do we mean by technology-what is the difference between a scientist, an engineer and a technologist? What are the boundaries of technology with science and engineering-do such boundaries even exist? Some of us have spent a considerable time during the last few years attending meetings of such bodies as the Prime Minister’s Central Advisory Council for Science and Technology and the Minister of Education’s Council for Scientific Policy, where a great deal of effort has been made to try to correlate the national spending on research and development with the progress of our country and the well-being of our people-with singularly little success.

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