scholarly journals Fault isolation technique for decentralized survivable communication network systems via regions and paths

2020 ◽  
Vol 17 (1) ◽  
pp. 533
Author(s):  
Nethravathi B ◽  
Kamalesh V N
Keyword(s):  
Communication Network ◽  
Communication Networks ◽  
High Reliability ◽  
Fault Isolation ◽  
Large Network ◽  
Network Systems ◽  
Isolation Technique ◽  
Continuous Growth ◽  
Theoretical Concepts ◽  
Decentralized Diagnosis

<p>The rapid continuous growth of communication networks in size, complexity and dependencies, makes them extremely challenging to maintain the survivability of the complete large network.  The complexity may be due to advance voice and video services like IP TVs, IP telephony, video streaming which demands high reliability and survivability. Network management has become a great challenge as Faults are expected only in these complex networks. Once a failure is detected, the next step in the diagnosis is fault isolation which locates the source of that failure. The necessitate of decentralized diagnosis is justified by various applications, like spacecrafts.  This article presents model based fault isolation technique using a graph theoretical concepts, regions and paths for decentralized communication networks.</p>

Back End of Line (BEOL) Pulse Nanoprobing Fault Isolation Technique on RF Device with Soft Failure Issue

2020 ◽  
Author(s):  
P.K. Tan ◽  
C.Q. Chen ◽  
R. Fransiscus ◽  
A. Quah ◽  
P.T. Ng ◽  
...  
Keyword(s):  
Communication Networks ◽  
High Frequency ◽  
Fault Isolation ◽  
Design Rule ◽  
Market Size ◽  
Isolation Technique ◽  
Digital Devices ◽  
Soft Failure ◽  
Front End ◽  
Rf Devices

Abstract The global radio frequency (RF) semiconductor market size is growing dramatically in recent years, especially with the growing demand for mobile devices, communication networks, automotive applications, etc. Failure analysis (FA) on RF devices is normally more complex than digital devices, especially when it involves soft failure. This paper discusses FA on an RF product soft failure issue by the pulsed currentvoltage (IV) nanoprobing technique. The device suffered from high-frequency failure and exhibited abnormal repetitive softstart signature. Previous publications on pulsed IV nanoprobing applications were mostly related to Front End Of Line (FEOL) issues and simulations. In most of these cases, the electrical abnormality could also be observed with normal DC IV measurement. In this paper, the pulsed IV nanoprobing was performed at the Back End Of Line (BEOL) interconnects to isolate the failure that was otherwise not detected with normal DC nanoprobing or the reported pulse IV measurement. The proposed method successfully isolate, simulate the failure, and helping us to identify the process and design rule weakness.

Advanced T-LSIM System Detections using Amplified External Isolated Source-Sense Unit

2018 ◽  
Author(s):  
Zhi Jie Lau ◽  
Chris Philips
Keyword(s):  
Fault Isolation ◽  
Isolation Technique ◽  
Laser Signal ◽  
Signal Injection ◽  
Sense Unit ◽  
Types Of Faults

Abstract Thermal-Laser Signal Injection Microscopy (T-LSIM) is a widely used fault isolation technique. Although there are several T-LSIM systems on the market, each is limited in terms of the voltage and current it can produce. In this paper, the authors explain how they incorporated an Amplified External Isolated Source-Sense (AxISS) unit into their T-LSIM platform, increasing its current sourcing capability and voltage biasing range. They also provide examples highlighting the types of faults and failures that the modified system can detect.

Fault Isolation of MOL and FEOL Buried Defects Using Conductive Atomic Force Microscopy as a Complement to Passive Voltage Contrast Imaging

2017 ◽  
Author(s):  
Lucile C. Teague Sheridan ◽  
Linda Conohan ◽  
Chong Khiam Oh
Keyword(s):  
Atomic Force Microscopy ◽  
Cmos Technology ◽  
Fault Isolation ◽  
Contrast Imaging ◽  
Conductive Atomic Force Microscopy ◽  
Isolation Technique ◽  
Conductive Afm ◽  
Force Microscopy ◽  
Atomic Force ◽  
Voltage Contrast

Abstract Atomic force microscopy (AFM) methods have provided a wealth of knowledge into the topographic, electrical, mechanical, magnetic, and electrochemical properties of surfaces and materials at the micro- and nanoscale over the last several decades. More specifically, the application of conductive AFM (CAFM) techniques for failure analysis can provide a simultaneous view of the conductivity and topographic properties of the patterned features. As CMOS technology progresses to smaller and smaller devices, the benefits of CAFM techniques have become apparent [1-3]. Herein, we review several cases in which CAFM has been utilized as a fault-isolation technique to detect middle of line (MOL) and front end of line (FEOL) buried defects in 20nm technologies and beyond.

WLCSP Laminate Removal Using NIR Laser

2018 ◽  
Author(s):  
Chun Haur Khoo
Keyword(s):  
Near Infrared ◽  
Laser Energy ◽  
Photon Emission ◽  
Mechanical Damage ◽  
Consumer Products ◽  
Fault Isolation ◽  
Wafer Level ◽  
Isolation Technique ◽  
Laminate Layer ◽  
Nir Laser

Abstract Driven by the cost reduction and miniaturization, Wafer Level Chip Scale Packaging (WLCSP) has experienced significant growth mainly driven by mobile consumer products. Depending on the customers or manufacturing needs, the bare silicon backside of the WLCSP may be covered with a backside laminate layer. In the failure analysis lab, in order to perform the die level backside fault isolation technique using Photon Emission Microscope (PEM) or Laser Signal Injection Microscope (LSIM), the backside laminate layer needs to be removed. Most of the time, this is done using the mechanical polishing method. This paper outlines the backside laminate removal method of WLCSP using a near infrared (NIR) laser that produces laser energy in the 1,064 nm range. This method significantly reduces the sample preparation time and also reduces the risk of mechanical damage as there is no application of mechanical force. This is an effective method for WLCSP mounted on a PCB board.

A Novel OBIRCH Fault Isolation Method to Locate the Leakage Failure Point

2008 ◽  
Author(s):  
Chi-Lin Huang ◽  
Yu Hsiang Shu
Keyword(s):  
Semiconductor Device ◽  
Fault Isolation ◽  
Resistance Change ◽  
Cross Sectional ◽  
Isolation Technique ◽  
Isolation Techniques ◽  
Atomic Force ◽  
Analysis Experiment ◽  
Failure Point ◽  
Leakage Failure

Abstract Conventional isolation techniques, such as Optical Beam Induced Resistance Change (OBIRCH) or photoemission microscopy (PEM) frequently fail to locate failure points when only applied to power pin of the semiconductor device. In this paper, a novel OBIRCH failure isolation technique is utilized to detect leakage failures. Different test conditions are presented to identify the differences in current when all input pins are pulled high in an OBIRCH system. In order to verify a failure point, it is necessary to perform electrical analysis of the suspected failure point in the failing sample. In general, Conductive Atomic Force Microscope (C-AFM) and a Nano-Prober is sufficient to provide the electrical data required for failure analysis. Experiment results, however, prove that this novel OBIRCH failure isolation technique is effective in locating the failure point, especially for leakage failures. The failure mechanism is illustrated using cross-sectional TEM.

Pseudo-Dynamic Fault Isolation Technique Using Backside Emission Microscopy – Case Study, Where All Other Methods Fail

2002 ◽  
Author(s):  
Yoav Weizman ◽  
Ezra Baruch ◽  
Michael Zimin
Keyword(s):  
Failure Analysis ◽  
Process Variations ◽  
Fault Isolation ◽  
Operating Conditions ◽  
Detection Sensitivity ◽  
Isolation Technique ◽  
Root Cause ◽  
Emission Microscopy ◽  
Failure Location ◽  
Noisy Background

Abstract Emission microscopy is usually implemented for static operating conditions of the DUT. Under dynamic operation it is nearly impossible to identify a failure out of the noisy background. In this paper we describe a simple technique that could be used in cases where the temporal location of the failure was identified however the physical location is not known or partially known. The technique was originally introduced to investigate IDDq failures (1) in order to investigate timing related issues with automated tester equipment. Ishii et al (2) improved the technique and coupled an emission microscope to the tester for functional failure analysis of DRAMs and logic LSIs. Using consecutive step-by-step tester halting coupled to a sensitive emission microscope, one is able detect the failure while it occurs. We will describe a failure analysis case in which marginal design and process variations combined to create contention at certain logic states. Since the failure occurred arbitrarily, the use of the traditional LVP, that requires a stable failure, misled the analysts. Furthermore, even if we used advanced tools as PICA, which was actually designed to locate such failures, we believe that there would have been little chance of observing the failure since the failure appeared only below 1.3V where the PICA tool has diminished photon detection sensitivity. For this case the step-by-step halting technique helped to isolate the failure location after a short round of measurements. With the use of logic simulations, the root cause of the failure was clear once the failing gate was known.

Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip Package

2012 ◽  
Author(s):  
Lihong Cao ◽  
Manasa Venkata ◽  
Meng Yeow Tay ◽  
Wen Qiu ◽  
J. Alton ◽  
...  
Keyword(s):  
Time Domain ◽  
Flip Chip ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Experimental Results ◽  
Terahertz Pulse ◽  
Isolation And Identification ◽  
Isolation Technique ◽  
Non Destructive

Abstract Electro-optical terahertz pulse reflectometry (EOTPR) was introduced last year to isolate faults in advanced IC packages. The EOTPR system provides 10μm accuracy that can be used to non-destructively localize a package-level failure. In this paper, an EOTPR system is used for non-destructive fault isolation and identification for both 2D and 2.5D with TSV structure of flip-chip packages. The experimental results demonstrate higher accuracy of the EOTPR system in determining the distance to defect compared to the traditional time-domain reflectometry (TDR) systems.

The Research of GPRS-Based Remote Fault Monitoring System for CNC Machine Tools

2011 ◽  
Vol 328-330 ◽  
pp. 393-397
Author(s):  
Ming Liang Wu ◽  
Xiao Bing Wang ◽  
Shu Rong Yu
Keyword(s):  
Monitoring System ◽  
Communication Networks ◽  
Remote Monitoring ◽  
Data Transfer ◽  
High Reliability ◽  
Fast Response ◽  
Cnc Machine Tools ◽  
Cnc Machine ◽  
Remote Monitoring System ◽  
Wide Range

Based on GPRS network remote monitoring system which uses its two-way transmission performance, can easily monitor various electrical equipments and get information. Compare with the past remote monitoring systems, the system has the advantage of flexible networking, convenient, wide range of data transmission, high reliability, fast response time, and has great significance and value of research in CNC machine tool system with upgrade GPRS in the mobile communication networks, data services expand and data transfer capabilities.

scholarly journals Cooperative Problem Solving in Telecommunication Network

2013 ◽  
Vol 4 (3) ◽  
pp. 388-392
Author(s):  
Shanu K Rakesh ◽  
Bharat Choudhary ◽  
Rachna Sandhu
Keyword(s):  
Communication Network ◽  
Problem Solving ◽  
Distributed Control ◽  
Communication Networks ◽  
Foraging Behaviour ◽  
Telecommunication Network ◽  
Telecommunication Networks ◽  
Control Problems ◽  
Engineering Systems ◽  
Biologically Inspired

Swarm intelligence, as demonstrated by natural biological swarms, has numerous powerful properties desirable in many engineering systems, such as telecommunication. Communication network management is becoming increasingly difficult  due to the increasing size, rapidly changing topology, and complexity of communication networks. This paper describes  how biologically-inspired agents can be used to solve control problems in telecommunications. These agents, inspired by the foraging behaviour of ants, exhibit the desirable characteristics of simplicity of action and interaction. The colle ction of agents, or swarm system, deals only with local knowledge and exhibits a form of distributed control with agent communication effected through the environment. In this paper we explore the application of ant-like agents to the problem of routing in telecommunication networks.

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