Experimental analysis of dropwise condensation heat transfer on a finned tube: Impact of pitch size

2021 ◽  
pp. 095765092110580
Author(s):  
Ehsan Aminian ◽  
Hamid Saffari
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pure Copper ◽  
Water Desalination ◽  
Condensation Heat Transfer ◽  
Free Energy Surface ◽  
Logarithmic Mean ◽  
Result Section ◽  
Maximum Heat ◽  
Mean Temperature

Condensation is one of the essential processes in diverse industries due to its widespread use in various industrial applications such as power generation, water desalination, and air conditioning. Much research has been conducted to achieve better efficiencies and better heat transfer performances in condensers in the past decades. Condensation is divided into dropwise and filmwise based on the surface free energy, surface roughnesses, and condensate characteristics. This study investigated the influence of the 1-Octadecanethiol coating on vertically grooved copper tube’s condensation heat transfer characteristics. The hydrophobic surfaces have been created using self-assembled monolayers (SAMs) on the pure copper tubes (99.9% Cu). Moreover, four different pitch sizes of 1.5, 2, 2.5, and 3.5 mm have been implemented on the surface. Finally, the heat flux and the heat transfer coefficient as functions of logarithmic mean temperature difference are reported in the result section. For validation, the results obtained from the experiment were compared with available data in the literature, and an acceptable agreement was achieved. According to the results, it was found that the 1.5-mm pitch size has the highest heat flux, and the 3.5-mm pitch size has the lowest heat flux. Additionally, it can be inferred that the maximum heat flux of 696.71 kW/m2 was attributed to the 1.5-mm pitch size for logarithmic mean temperature differences of 64.3 K, which is approximately 1.24 times higher compared to the plain tube.

A Heat Transfer Model of Dropwise Condensation Underneath a Horizontal Substrate

2011 ◽  
Vol 199-200 ◽  
pp. 1604-1608
Author(s):  
Yun Fu Chen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Contact Angle ◽  
Fractal Model ◽  
Condensation Heat Transfer ◽  
Droplet Growth ◽  
Transfer Model ◽  
Dropwise Condensation ◽  
Small Contact Angle ◽  
Horizontal Substrate

For finding influence of the condensing surface to dropwise condensation heat transfer, a fractal model for dropwise condensation heat transfer has been established based on the self-similarity characteristics of droplet growth at various magnifications on condensing surfaces with considering influence of contact angle to heat transfer. It has been shown based on the proposed fractal model that the area fraction of drops decreases with contact angle increase under the same sub-cooled temperature; Varying the contact angle changes the drop distribution; higher the contact angle, lower the departing droplet size and large number density of small droplets; dropwise condensation translates easily to the filmwise condensation at the small contact angle ;the heat flux increases with the sub-cooled temperature increases, and the greater of contact angle, the more heat flux increases slowly.

Boiling Heat Transfer Characteristics of Rotary Hollow Cylinders with In-Line and Staggered Multiple Arrays of Water Jets

2021 ◽  
Author(s):  
Mohammad Jahedi ◽  
Bahram Moshfegh
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Stagnation Point ◽  
Surface Heat Flux ◽  
Surface Heat ◽  
Maximum Heat ◽  
Water Jets ◽  
Maximum Heat Flux ◽  
Inner Surface ◽  
Hollow Cylinders

Abstract Transient heat transfer studies of quenching rotary hollow cylinders with in-line and staggered multiple arrays of jets have been carried out experimentally. The study involves three hollow cylinders (Do/d = 12 to 24) with rotation speed 10 to 50 rpm, quenched by subcooled water jets (ΔTsub=50-80 K) with jet flow rate 2.7 to 10.9 L/min. The increase in area-averaged and maximum heat flux over quenching surface (Af) has been observed in the studied multiple arrays with constant Qtotal compared to previous studies. Investigation of radial temperature distribution at stagnation point of jet reveals that the footprint of configuration of 4-row array is highlighted in radial distances near the outer surface and vanishes further down toward the inner surface. The influence of the main quenching parameters on local average surface heat flux at stagnation point is addressed in all the boiling regimes where the result indicates jet flow rate provides strongest effect in all the boiling regimes. Effectiveness of magnitude of maximum heat flux in the boiling curve for the studied parameters is reported. The result of spatial and temporal heat flux by radial conduction in the solid presents projection depth of cyclic variation of surface heat flux in the radial axis as it disappears near inner surface of hollow cylinder. In addition, correlations are proposed for area-averaged Nusselt number as well as average and maximum local heat flux at stagnation point of jet for the in-line and staggered multiple arrays.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Bharath Ramakrishnan ◽  
Yaser Hadad ◽  
Sami Alkharabsheh ◽  
Paul R. Chiarot ◽  
Bahgat Sammakia
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Resistance ◽  
High Heat ◽  
High Heat Flux ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Maximum Heat ◽  
Effective Heat ◽  
Cold Plates

Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of microelectronic devices and an increasing demand for clock speed result in high heat flux systems. By adopting direct liquid cooling, the high heat flux and high power demands can be met, while the reliability of the electronic devices is greatly improved. Cold plates which are mounted directly on to the chips facilitate a lower thermal resistance path originating from the chip to the incoming coolant. An attempt was made in the current study to characterize a commercially available cold plate which uses warm water in carrying the heat away from the chip. A mock package mimicking a processor chip with an effective heat transfer area of 6.45 cm2 was developed for this study using a copper block heater arrangement. The thermo-hydraulic performance of the cold plates was investigated by conducting experiments at varying chip power, coolant flow rates, and coolant temperature. The pressure drop (ΔP) and the temperature rise (ΔT) across the cold plates were measured, and the results were presented as flow resistance and thermal resistance curves. A maximum heat flux of 31 W/cm2 was dissipated at a flow rate of 13 cm3/s. A resistance network model was used to calculate an effective heat transfer coefficient by revealing different elements contributing to the total resistance. The study extended to different coolant temperatures ranging from 25 °C to 45 °C addresses the effect of coolant viscosity on the overall performance of the cold plate, and the results were presented as coefficient of performance (COP) curves. A numerical model developed using 6SigmaET was validated against the experimental findings for the flow and thermal performance with minimal percentage difference.

scholarly journals Boiling Heat Transfer From an Array of Round Jets With Hybrid Surface Enhancements

2015 ◽  
Vol 137 (7) ◽  
Author(s):  
Matthew J. Rau ◽  
Suresh V. Garimella ◽  
Ercan M. Dede ◽  
Shailesh N. Joshi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Flat Surface ◽  
Microporous Layer ◽  
Maximum Heat ◽  
Flow Rates ◽  
Pin Fin ◽  
Pin Fins ◽  
Single Jet

The effect of a variety of surface enhancements on the heat transfer achieved with an array of impinging jets is experimentally investigated using the dielectric fluid HFE-7100 at different volumetric flow rates. The performance of a 5 × 5 array of jets, each 0.75 mm in diameter, is compared to that of a single 3.75 mm diameter jet with the same total open orifice area, in single-and two-phase operation. Four different target copper surfaces are evaluated: a baseline smooth flat surface, a flat surface coated with a microporous layer, a surface with macroscale area enhancement (extended square pin–fins), and a hybrid surface on which the pin–fins are coated with the microporous layer; area-averaged heat transfer and pressure drop measurements are reported. The array of jets enhances the single-phase heat transfer coefficients by 1.13–1.29 times and extends the critical heat flux (CHF) on all surfaces compared to the single jet at the same volumetric flow rates. Additionally, the array greatly enhances the heat flux dissipation capability of the hybrid coated pin–fin surface, extending CHF by 1.89–2.33 times compared to the single jet on this surface, with a minimal increase in pressure drop. The jet array coupled with the hybrid enhancement dissipates a maximum heat flux of 205.8 W/cm2 (heat input of 1.33 kW) at a flow rate of 1800 ml/min (corresponding to a jet diameter-based Reynolds number of 7800) with a pressure drop incurred of only 10.9 kPa. Compared to the single jet impinging on the smooth flat surface, the array of jets on the coated pin–fin enhanced surface increased CHF by a factor of over four at all flow rates.

Experimental Study of a Single Microchannel Flow Under Non-Uniform Heat Flux

2017 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Dissipation ◽  
Hot Spot ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Maximum Heat ◽  
Uniform Heat ◽  
Microchannel Heat Sinks

Non-uniform heat fluxes are commonly observed in thermo-electronic devices that require distinct thermal management strategies for effective heat dissipation and robust performance. The limited research available on non-uniform heat fluxes focus mostly on microchannel heat sinks while the fundamental component, i.e. a single microchannel, has received restricted attention. In this work, an experimental setup for the analysis of variable axial heat flux is used to study the heat transfer in a single microchannel with fully developed flow under the effect of different heat flux profiles. Initially a hot spot at different locations, with a uniform background heat flux, is studied at different Reynolds numbers while varying the maximum heat fluxes in order to compute the heat transfer in relation to its dependent variables. Measurements of temperature, pressure, and flow rates at a different locations and magnitudes of hot spot heat fluxes are presented, followed by a detailed analysis of heat transfer characteristics of a single microchannel under non-uniform heating. Results showed that upstream hotspots have lower tube temperatures compared to downstream ones with equal amounts of heat fluxes. This finding can be of importance in enhancing microchannel heat sinks effectiveness in reducing maximum wall temperatures for the same amount of heat released, by redistributing spatially fluxes in a descending profile.

High Heat Flux Phase Change on Silicon Wick Structures

2012 ◽  
Author(s):  
Qingjun Cai ◽  
Avijit Bhunia ◽  
Yuan Zhao
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Test Chamber ◽  
Nucleate Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Wick Structure ◽  
Silicon Pillars

Silicon is the major material in IC manufacture. It has high thermal conductivity and is compatible with precision micro-fabrication. It also has decent thermal expansion coefficient to most semiconductor materials. These characteristics make it an ideally underlying material for fabricating micro/mini heat pipes and their wick structures. In this paper, we focus our research investigations on high heat flux phase change capacity of the silicon wick structures. The experimental wick sample is composed of silicon pillars 320μm in height and 30 ∼ 100μm in diameter. In a stainless steel test chamber, synchronized visualizations and measurements are performed to crosscheck experimental phenomena and data. Using the mono-wick structure with large silicon pillar of 100μm in diameter, the phase change on the silicon wick structure reaches its maximum heat flux at 1,130W/cm2 over a 2mm×2mm heating area. The wick structure can fully utilize the wick pump capability to supply liquid from all 360° directions to the center heating area. In contrast, the large heating area and fine silicon pillars 10μm in diameter significantly reduces liquid transport capability and suppresses generation of nucleate boiling. As a result, phase change completely relies on evaporation, and the CHF of the wick structure is reduced to 180W/cm2. An analytical model based on high heat flux phase change of mono-porous wick structures indicates that heat transfer capability is subjected to the ratio between the wick particle radius and the heater dimensions, as well as vapor occupation ratio of the porous volume. In contrast, phase change heat transfer coefficients of the wick structures essentially reflect material properties of wick structure and mechanism of two-phase interactions within wick structures.

Numerical and Experimental Investigations on Heat Transfer Phenomena of an Aluminium Microchannel Heat Sink

2011 ◽  
Vol 145 ◽  
pp. 129-133 ◽  
Author(s):  
Thanhtrung Dang ◽  
Ngoctan Tran ◽  
Jyh Tong Teng
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Mass Flow Rate ◽  
Mass Flow ◽  
Flow Rate ◽  
Heat Sink ◽  
Inlet Temperature ◽  
Outlet Temperature ◽  
Microchannel Heat Sink ◽  
Maximum Heat

The study was done both numerically and experimentally on the heat transfer behaviors of a microchannel heat sink. The solver of numerical simulations (CFD - ACE+software package) was developed by using the finite volume method. This numerical method was performed to simulate for an overall microchannel heat sink, including the channels, substrate, manifolds of channels as well as the covered top wall. Numerical results associated with such kinds of overall microchannel heat sinks are rarely seen in the literatures. For cases done in this study, a heat flux of 9.6 W/cm2was achieved for the microchannel heat sink having the inlet temperature of 25 °C and mass flow rate of 0.4 g/s with the uniform surface temperature of bottom wall of the substrate of 50 °C; besides, the maximum heat transfer effectiveness of this device reached 94.4%. Moreover, in this study, when the mass flow rate increases, the outlet temperature decreases; however, as the mass flow rate increases, the heat flux of this heat sink increases also. In addition, the results obtained from the numerical analyses were in good agreement with those obtained from the experiments as well as those from the literatures, with the maximum discrepancies of the heat fluxes estimated to be less than 6 %.

Effect of Liquid Properties on Phase-Change Heat Transfer in Porous Wick Structures

2015 ◽  
Vol 138 (3) ◽  
Author(s):  
Steve Q. Cai ◽  
Avijit Bhunia
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Phase Change ◽  
Transfer Coefficient ◽  
Mode Transition ◽  
Maximum Heat ◽  
Maximum Heat Flux ◽  
Phase Change Heat Transfer ◽  
The Heat Transfer Coefficient

In a heat pipe, operating fluid saturates wick structures system and establishes a capillary-driven circulation loop for heat transfer. Thus, the thermophysical properties of the operating fluid inevitably impact the transitions of phase-change mode and the capability of heat transfer, which determine both the design and development of the associated heat pipe systems. This article investigates the effect of liquid properties on phase-change heat transfer. Two different copper wick structures, cubic and cylindrical in cross section, 340 μm in height and 150 μm in diameter or width, are fabricated using an electroplating technique. The phase-change phenomena inside these wick structures are observed at various heat fluxes. The corresponding heat transfer characteristics are measured for three different working liquids: water, ethanol, and Novec 7200. Three distinct modes of the phase-change process are identified: (1) evaporation on liquid–vapor interface, (2) nucleate boiling with interfacial evaporation, and (3) boiling enhanced interface evaporation. Transitions between the three modes depend on heat flux and liquid properties. In addition to the mode transition, liquid properties also dictate the maximum heat flux and the heat transfer coefficient. A quantitative characterization shows that the maximum heat flux scales with Merit number, a dimensionless number connecting liquid density, surface tension, latent heat of vaporization, and viscosity. The heat transfer coefficient, on the other hand, is dictated by the thermal conductivity of the liquid. A complex interaction between the mode transition and liquid properties is reflected in Novec 7200. In spite of having the lowest thermal conductivity among the three liquids, an early transition to the mode of the boiling enhanced interface evaporation leads to a higher heat transfer coefficient at low heat flux.

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