Surface heat flow measurements at the Puhimau hot spot

Geophysics ◽  
1985 ◽  
Vol 50 (7) ◽  
pp. 1108-1112 ◽  
Author(s):  
J. C. Dunn ◽  
H. C. Hardee

The Puhimau hot spot, on Kilauea Volcano, Hawaii, was thermally mapped using new high‐output thermopile heat flow sensors. This thermal geophysical technique allows rapid measurement of surficial heat flow, especially in regions of high heat flux where shallow burial depths can be used. Heat flow measurements ranged from 200 to [Formula: see text] over the central portion of the Puhimau hot spot. Analysis of the heat flow data combined with other geophysical measurements suggests that the Puhimau hot spot could be caused by a shallow and perhaps still molten body of magma beneath the local area. These geophysical measurements, along with a proposed shallow scientific drillhole, can provide valuable evaluation of geophysical techniques for locating magma bodies in the crust.

2013 ◽  
Vol 455 ◽  
pp. 466-469
Author(s):  
Yun Chuan Wu ◽  
Shang Long Xu ◽  
Chao Wang

With the increase of performance demands, the nonuniformity of on-chip power dissipation becomes greater, causing localized high heat flux hot spots that can degrade the processor performance and reliability. In this paper, a three-dimensional model of the copper microchannel heat sink, with hot spot heating and background heating on the back, was developed and used for numerical simulation to predict the hot spot cooling performance. The hot spot is cooled by localized cross channels. The pressure drop, thermal resistance and effects of hot spot heat flux and fluid flow velocity on the cooling of on-chip hot spots, are investigated in detail.


2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Genesis Vasquez ◽  
Siavash Rastkar

Two-layer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 × 2.45 mm footprint and a hot spot of 0.5 × 0.5 mm in its center was studied in this research. Two different cases were simulated in which heat fluxes of 1500 W cm−2 and 2000 W cm−2 were applied at the hot spot. Heat flux of 1000 W cm−2 was applied on the rest of the chip. Each microchannel layer had 20 channels with an aspect ratio of 4:1. Direction of the second microchannel layer was rotated 90 deg with respect to the first layer. Fully three-dimensional (3D) conjugate heat transfer analysis was performed to study the heat removal capacity of the proposed two-layer microchannel cooling design for high heat flux chips. In the next step, a linear stress analysis was performed to investigate the effects of thermal stresses applied to the microchannel cooling design due to variations of temperature field. Results showed that two-layer microchannel configuration was capable of removing heat from high heat flux chips with a hot spot.


2016 ◽  
Vol 87 (2) ◽  
pp. 165-174
Author(s):  
Elena Onofrei ◽  
Teodor-Cezar Codau ◽  
Gauthier Bedek ◽  
Daniel Dupont ◽  
Cedric Cochrane

This paper describes the concept of creating and testing of a textile heat flow sensor in order to determine the amount of heat exchanged between the human body and its environment. The main advantage of this sensor is the permeability to moisture, which allows taking into account the evaporation phenomenon, contrary to the traditional heat flow sensors. Another property related to this new sensor is its flexibility conferred by the textile substrate, which allows it to be applied on deformable surfaces.


2014 ◽  
Vol 6 (1) ◽  
pp. 403-426 ◽  
Author(s):  
K. Erkan

Abstract. Results of a crustal heat flow analysis in western Anatolia based on borehole equilibrium temperatures and rock thermal conductivity data are reported. The dataset comprises 113 borehole sites that were collected in Southern Marmara and Aegean regions of Turkey in 1995–1999. The measurements are from abandoned water wells with depths of 100–150 m. Data were first classed in terms of quality, and the low quality data, including data showing effects of hydrologic disturbances on temperatures, were eliminated. For the remaining 34 sites, one meter resolution temperature-depth curves were carefully analyzed for determination of the background geothermal gradients, and any effects of terrain topography and intra-borehole fluid flow were corrected when necessary. Thermal conductivities were determined either by direct measurements on representative surface outcrop or estimated from the borehole lithologic records. The calculated heat flow values are 85–90 mW m−2 in the northern and central parts of the Menderes horst-graben system. Within the system, the highest heat flow values (> 100 mW m−2) are observed in the northeastern part of Gediz Graben, near Kula active volcanic center. The calculated heat flow values are also in agreement with the results of studies on the maximum depth of seismicity in the region. In the Menderes horst-graben system, surface heat flow is expected to show significant variations as a result of active sedimentation and thermal refraction in grabens, and active erosion on horst detachment zones. High heat flow values (90–100 mW m−2) are also observed in the peninsular (western) part of Çanakkale province. The heat flow anomaly here may be an extension of the high heat flow zone previously observed in the northern Aegean Sea. Moderate heat flow values (60–70 mW m−2) are observed in eastern part of Çanakkale and central part of Balıkesir provinces.


There are now twelve heat flow measurements in the Red Sea made with heat flow probes from survey ships and several sets of temperature measurements made in deep exploration boreholes. The oceanic measurements are in water depths ranging from 0.94 to 2.70 km and all but one of these measurements give values significantly higher than the world mode of 46 mW m -2 (1.1 ). They include the world record high oceanic measurement of more than 3307 mW m -2 (79.0) in the neighbourhood of the hot brine pools. These measurements show that the deep axial trough of the Red Sea is associated with high heat flow, the values being similar to those found in the mid-Indian Ocean rift, the mid-Atlantic rift and over the crest of the East Pacific rise. It is of considerable interest to see if there is also high heat flow over the Red Sea margins and the main purpose of this paper is to examine temperature data from deep exploration boreholes. The boreholes are drilled mainly in rock salt, sandstones and shales. A discussion is given of the thermal conductivities assumed for these rocks. The boreholes have depths of up to 4 km and in some cases the temperature measurements enable an estimate to be made of the heat flow. These are also found to be high. The significance of the high heat flow to ideas concerning the structure and evolution of the Red Sea is discussed.


Author(s):  
Avram Bar-Cohen ◽  
Peng Wang

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip “hot spots”. The application of on-chip high heat flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric microcoolers — using mini-contcat enhancement and in-plane thermoelectric currents, orthotropic TIM’s/heat spreaders, and phase-change microgap coolers.


1979 ◽  
Vol 16 (10) ◽  
pp. 1951-1964 ◽  
Author(s):  
R. G. Allis ◽  
G. D. Garland

Six heat flow values have been obtained from measurements made in the sediments of thermally-stable lakes in four major structural belts of northwestern Ontario. Each heat flow is the average of measurements from 3–6 neighbouring lakes. Corrections for the thermal history, lateral heat flow, sedimentation, and refraction effects have been applied. High heat flows which were measured in the Quetico gneiss superbelt (77 mW/m2) and on the Indian Lake intrusion in the Wabigoon superbelt (64 mW/m2) are related to above-average heat productivities at these locations, but the extent in depth of the sources is shown to be very different in the two cases. The consistency of the lake results with borehole measurements, on a heat flow – heat productivity plot, strongly suggests that the former are not perturbed by recent climatic variations.


2021 ◽  
pp. 328-328
Author(s):  
Nan Zhang ◽  
Ruiwen Liu ◽  
Yanmei Kong ◽  
Yuxin Ye ◽  
Xiangbin Du ◽  
...  

Power chips with high power dissipation and high heat flux have caused serious thermal management problems. Traditional indirect cooling technologies could not satisfy the increasing heat dissipation requirements. The embedded cooling directly inside the chip is the hot spot of the current research, which bears greater cooling potential comparatively, due to the shortened heat transfer path and decreased thermal resistance. In this study, the thermal behaviors of the power chips were demonstrated using a thermal test chip (TTC), which was etched with microchannels on its substrate?s backside and bonded with a manifold which also fabricated with silicon wafer. The chip has normal thermal test function and embedded cooling function at the same time, and its size is 7 ? 7 ? 1.125 mm3. This paper mainly discussed the influence of width of microchannels and the number of manifold channels on the thermal and hydraulic performance of the embedded cooling structure in the single-phase regime. Compared with the conventional straight microchannel structure, the cooling coefficient of performance (COP) of the 8?-50(number of manifold distribution channels: 8, microchannel width: 50 ?m)structure is 3.38 times higher. It?s verified that the 8?-50 structure is capable of removing power dissipation of 300 W (heat flux: 1200 W/cm2) at a maximum junction temperature of 69.6 ? with pressure drop of less than90.8 kPa. This study is beneficial to promote the embedded cooling research, which could enable the further release of the power chips performance limited by the dissipated heat.


2016 ◽  
Vol 38 (14-15) ◽  
pp. 1235-1246 ◽  
Author(s):  
Sohail R. Reddy ◽  
Abas Abdoli ◽  
George S. Dulikravich ◽  
Cesar C. Pacheco ◽  
Genesis Vasquez ◽  
...  

Author(s):  
Peng Wang ◽  
Michael Manno ◽  
Avram Bar-Cohen

Wide bandgap semiconductor technology is expected to have a dramatic impact on radar and communications systems. To take full advantage of the power capabilities and small device sizes of wide bandgap semiconductors, new and novel thermal management solutions, especially for high power density, monolithic microwave integrated circuits (MMICs) are in high demand. In this paper, a quantum-well Si/SiC self-cooling concept for hot spot thermal management at the multi-fingered GaN high electron mobility transistor (HEMTs) in the GaN-on-SiC package is proposed and investigated using a three dimensional (3-D) thermal-electric coupling simulation. The impact of electric current, cooler size, Si/SiC substrate thickness, Si/SiC thermal conductivity, and interfacial parasitic effect on the hot spot cooling is examined and discussed. The preliminary modeling results strongly suggest that self-cooling phenomenon inherent in the quantum-well Si/SiC substrate can be used to remove local high heat flux hot spot on the semiconductor devices.


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