scholarly journals Self-Extinguishing of Phenol-Aralkyl-Type Epoxy Resin Compounds and Their Application to Electronics Packaging Materials

2007 ◽  
Vol 64 (4) ◽  
pp. 191-203 ◽  
Author(s):  
Masatoshi IJI ◽  
Yukihiro KIUCHI
Keyword(s):  
Epoxy Resin ◽  
Electronics Packaging ◽  
Packaging Materials

scholarly journals Preparation and Thermal Conductivity of Epoxy Resin/Graphene-Fe3O4 Composites

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2013
Author(s):  
Zhong Wu ◽  
Jingyun Chen ◽  
Qifeng Li ◽  
Da-Hai Xia ◽  
Yida Deng ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Epoxy Resin ◽  
Thermomechanical Properties ◽  
Packaging Materials ◽  
Mass Ratio ◽  
Degree Of Orientation ◽  
Ep Matrix ◽  
Electrical Insulation Properties

By modifying the bonding of graphene (GR) and Fe3O4, a stable structure of GR-Fe3O4, namely magnetic GR, was obtained. Under the induction of a magnetic field, it can be orientated in an epoxy resin (EP) matrix, thus preparing EP/GR-Fe3O4 composites. The effects of the content of GR and the degree of orientation on the thermal conductivity of the composites were investigated, and the most suitable Fe3O4 load on GR was obtained. When the mass ratio of GR and Fe3O4 was 2:1, the thermal conductivity could be increased by 54.8% compared with that of pure EP. Meanwhile, EP/GR-Fe3O4 composites had a better thermal stability, dynamic thermomechanical properties, and excellent electrical insulation properties, which can meet the requirements of electronic packaging materials.

Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization

2015 ◽  
Vol 3 (27) ◽  
pp. 7195-7202 ◽  
Author(s):  
Jun-Wei Zha ◽  
Tian-Xing Zhu ◽  
Yun-Hui Wu ◽  
Si-Jiao Wang ◽  
Robert K. Y. Li ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Epoxy Resin ◽  
Electronics Packaging ◽  
Graphene Nanoplatelets ◽  
Electrical Insulation ◽  
Epoxy Composites ◽  
Alumina Fibers ◽  
Excellent Adhesion ◽  
Cure Shrinkage

Epoxy resin is widely used for electrical and electronics packaging in various forms due to its excellent adhesion, low cure shrinkage and good electrical insulation.

Environmental and Cost Assessment of Several Injection Molded Powder Electronics Packaging Materials

2011 ◽  
Author(s):  
Misha V. Sahakian ◽  
Malcolm O. Brown ◽  
Sundar V. Atre ◽  
Karl R. Haapala
Keyword(s):  
Environmental Impact ◽  
Electronics Packaging ◽  
Packaging Materials ◽  
Performance Study ◽  
Cost Performance ◽  
The Past ◽  
Injection Molded ◽  
Relative Differences ◽  
Transfer Properties ◽  
Better Than

Electronics manufacturing technology has been advancing at an increasing rate for the past few decades and has forced related industries to do the same. One related industry involves the packaging technology used to enclose chips for power electronics. As demands of electronics manufacturers continue to increase in terms of cost, performance, and environmental impacts, so do demands on the packaging technologies involved. A variety of packaging materials have been used and proposed. The performance of each material varies in terms of ease of manufacturing, as well as its heat transfer properties. This study addresses performance, cost, and environmental impact measures to assist in selecting the most appropriate electronics packaging material. A performance study identified epoxy, aluminum nitride (AlN), and silicon carbide (SiC) to be the most viable options. Further analysis then found that epoxy outperforms the other options in terms of cost and environmental impact on a per-part basis, with AlN shown to be slightly better than SiC according to both metrics. Since it is known that AlN and SiC have superior material performance to epoxy packaging, further investigation is warranted to elucidate these relative differences, which will result in a more representative functional unit for comparative analysis.

scholarly journals Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

Processes ◽  
2021 ◽  
Vol 9 (9) ◽  
pp. 1634
Author(s):  
Sarthak Acharya ◽  
Shailesh Singh Chouhan ◽  
Jerker Delsing
Keyword(s):  
Epoxy Resin ◽  
Process Development ◽  
Electronics Packaging ◽  
Laser Source ◽  
Cu Metallization ◽  
Pcb Manufacturing ◽  
Production Techniques ◽  
Metallic Parts ◽  
Actinic Radiation ◽  
Base Substrate

Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) laminates on the base substrate and patterning the structures using lithography processes. As a result, significant amounts of metallic parts are etched away during any mass production process, causing unnecessary disposables leading to pollution. In this work, a new approach for Cu metallization is demonstrated with considerable step-reducing pattern-transfer mechanism. In the fabrication steps, a seed layer of covalent bonded metallization (CBM) chemistry on top of a dielectric epoxy resin is polymerized using actinic radiation intensity of a 375 nm UV laser source. The proposed method is capable of patterning any desirable geometries using the above-mentioned surface modification followed by metallization. To metallize the patterns, a proprietary electroless bath has been used. The metallic layer grows only on the selective polymer-activated locations and thus is called selective metallization. The highlight of this production technique is its occurrence at a low temperature (20–45 °C). In this paper, FR-4 as a base substrate and polyurethane (PU) as epoxy resin were used to achieve various geometries, useful in electronics packaging. In addition, analysis of the process parameters and some challenges witnessed during the process development are also outlined. As a use case, a planar inductor is fabricated to demonstrate the application of the proposed technique.

scholarly journals Deterioration Behavior of Epoxy Resin for Electronics Packaging and Its Adhesive Joint with Ni by Water Absorption

2021 ◽  
Vol 10 (6) ◽  
pp. 359-364
Author(s):  
Hironao MITSUGI ◽  
Riku SUZUKI ◽  
Ikuo SHOHJI ◽  
Tatsuya KOBAYASHI
Keyword(s):  
Water Absorption ◽  
Epoxy Resin ◽  
Adhesive Joint ◽  
Electronics Packaging

Research on Performance of Epoxy Electronic Packaging Materials

2013 ◽  
Vol 668 ◽  
pp. 226-230
Author(s):  
Hao Ran Zhou ◽  
An Sun ◽  
Hao Cheng Yang ◽  
Shuang Zhao
Keyword(s):  
Epoxy Resin ◽  
Electronic Packaging ◽  
Volume Resistivity ◽  
Mechanical Analysis ◽  
Electrical Performance ◽  
Process Conditions ◽  
Packaging Materials ◽  
Curing Process ◽  
Matrix Resin ◽  
Ft Ir

This article the epoxy resin electronic packaging materials was prepared via epoxy resin E-51 as matrix resin, MNA for curing agent, the CTBN as toughening agents, BPO, DMP-30, Al(MM)3, 2E4MZ as curing promoting agents by mechanical blending. The cured condition was 80°C curing 2 h, 90°C curing 2 h, 100°C curing 5 h. The structure of the epoxy resin electronic packaging materials was characterized via FT-IR, the result showed that epoxy resin cured completely. Dynamic mechanical analysis (DMA) is evaluated material thermal stability. The results show that anhydride dosage 7.7 g. The dielectric loss and volume resistivity of epoxy electronic potting were measured via the electrical performance analysis. The results show that epoxy electronic potting having BPO (0.2 g) and DMP-30 (0.1 g) had electrical optimal performance. In the curing process conditions, its performance is meet potting requirements, curing process is feasible.

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